초록 ▼

A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at lea

A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

대표청구항 ▼

1. A bonding pad structure for connecting an electronic component mounted on a printed circuit board (PCB), said structure, comprising: two bonding pad units, symmetrically disposed with respect to an axial line;wherein, each bonding pad unit has at least two bonding pads, each of the at least two b

1. A bonding pad structure for connecting an electronic component mounted on a printed circuit board (PCB), said structure, comprising: two bonding pad units, symmetrically disposed with respect to an axial line;wherein, each bonding pad unit has at least two bonding pads, each of the at least two bonding pads is composed of at least one first bonding pad and at least one second bonding pad in a manner that the first bonding pad is arranged next to the axial line, and the second bonding pad is arranged at a side of the corresponding first bonding pad that is away from the axial line, and further the first bonding pad and the corresponding second bonding pad are interconnected to each other by a first neck portion: wherein the first bonding pad, the second bonding pad, and the first neck portion are used for soldering the electronic component so as a plurality of solder areas of different sizes are formed by interconnecting the two bonding pad units. 2. The bonding pad structure of claim 1, wherein each of the two bonding pad unit further comprises at least one third bonding pad that is disposed at a side of the corresponding second bonding pad that is away from its corresponding first bonding pad while enabling the at least one third bonding pad and the corresponding second bonding pad to be interconnected to each other by a second neck portion. 3. The bonding pad structure of claim 1, wherein each bonding pad unit is composed of one said first bonding pad and one said second bonding pad in a manner that the first bonding pad and the second bonding pad are interconnected to each other by a first neck portion, while enabling the first neck potion to extend in a direction perpendicular to the axial line. 4. The bonding pad structure of claim 1, wherein the first bonding pad further comprises a pair of first reinforcement pads disposed respectively and perpendicularly at two sides of the axial line while enabling each of the first reinforcement pads to be connected to the first boding pad by a first auxiliary neck portion. 5. The bonding pad structure of claim 4, wherein each of the first reinforcement pad and the first auxiliary neck portion of the corresponding first bonding pad are extending in a direction parallel to the axial line. 6. The bonding pad structure of claim 1, wherein each bonding pad unit is composed of one said first bonding pad and two said second bonding pads in a manner that each of the two second bonding pads is configured with the first neck portion so as to be used for connecting to the first bonding pad thereby. 7. The bonding pad structure of claim 6, wherein the first neck portion is extending in a direction parallel to the axial line. 8. The bonding pad structure of claim 7, wherein each of the two second bonding pads is composed of a second master pad and a second auxiliary pad; and in each bonding pad unit, the two second master pads are arranged along a direction parallel with the axial line at a side of the first bonding pad that is away from the axial line, while enabling the two second master pads to be spaced from each other by an interval; and further in each bonding pad unit, the two second auxiliary pads are respectively disposed at two sides of their corresponding first bonding pad that are perpendicular to the axial line, while enabling each of the two second auxiliary pads to be connected to the first bonding pad by a first neck portion. 9. The bonding pad structure of claim 8, wherein each first neck portion that is used for connecting the first bonding pad to the corresponding second auxiliary pad is extending in a direction parallel to the axial line. 10. The bonding pad structure of claim 8, wherein each bonding pad unit is further comprised of two third bonding pads; and each of the two third bonding pads is composed of a third master pad and a third auxiliary pad in a manner that, in each bonding pad unit, the two third master pads are arranged along a direction parallel with the axial line at a side of the corresponding second bonding pad that is away from the axial line, while enabling the two third master pads to be spaced from each other by an interval; and further in each bonding pad unit, the two third auxiliary pads are respectively disposed at two sides of their corresponding two second bonding pad that are perpendicular to the axial line, while enabling each of the two third auxiliary pads to be connected to their corresponding second auxiliary pad by a second neck portion. 11. The bonding pad structure of claim 10, wherein each second neck portion is extending in a direction parallel to the axial line.