In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
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1. An electronic device comprising: an inorganic light-emitting diode (LED) having first and second spaced-apart contacts;a flexible substrate having first and second conductive traces on a first surface thereof in a bonding region, the first and second conductive traces being separated on the subst
1. An electronic device comprising: an inorganic light-emitting diode (LED) having first and second spaced-apart contacts;a flexible substrate having first and second conductive traces on a first surface thereof in a bonding region, the first and second conductive traces being separated on the substrate by a gap therebetween; anddisposed on the substrate, a control circuit electrically connected to the LED,wherein (i) the first and second conductive traces comprise at least one of silver, gold, aluminum, chromium, copper, or carbon, (ii) the first and second contacts are adhered to and in electrical contact with, respectively, the first and second conductive traces via an anisotropic conductive adhesive (ACA) electrically connecting the first contact only to the first trace and the second contact only to the second trace, and (iii) a portion of the ACA is disposed in the gap and substantially isolates the first contact from the second contact. 2. The device of claim 1, wherein the LED extends across the gap between the first and second traces, and further comprising a second inorganic LED, proximate the LED, extending across the gap between the first and second traces. 3. The device of claim 1, wherein the first and second traces consist essentially of aluminum. 4. The device of claim 1, wherein a reflectivity of the substrate for a wavelength of light emitted by the LED is greater than 80%. 5. The device of claim 1, wherein the LED emits white light having a color temperature in the range of 2000K to 7000K. 6. The device of claim 1, wherein the LED is a packaged LED. 7. The device of claim 1, wherein the LED is a bare LED die. 8. The device of claim 1, further comprising a power supply electrically connected to the LED. 9. The device of claim 1, wherein the substrate comprises a local flexing or a local deformation for maintaining electrical contact between the contacts and traces during operation of the LED. 10. The device of claim 1, wherein the first and second spaced-apart contacts are disposed on a first surface of the LED, and further comprising a reflective material over at least a portion of the first surface of the LED. 11. The device of claim 1, wherein the first and second spaced-apart contacts are substantially coplanar. 12. The device of claim 1, wherein the first and second spaced-apart contacts are disposed on a first surface of the LED, and an offset between the first and second spaced-apart contacts along a dimension substantially perpendicular to the first surface of the LED is at least 0.25 μm. 13. The device of claim 1, wherein the gap between the first and second traces ranges between approximately 25 μm and approximately 1000 μm. 14. The device of claim 1, wherein there is no heat sink in thermal communication with the LED. 15. The device of claim 1, wherein a transmittance of the substrate for a wavelength of light emitted by the LED is greater than 80%. 16. The device of claim 1, wherein a thickness of the first trace and a thickness of the second trace are substantially uniform and substantially equal to each other. 17. The device of claim 1, wherein a junction temperature of the LED does not exceed 100° C. during operation. 18. The device of claim 1, wherein (i) the LED comprises a p-n junction and (ii) a thermal resistance from the p-n junction to ambient through the substrate is at least 500° C./W. 19. The device of claim 1, wherein (i) the LED comprises a p-n junction and (ii) a thermal resistance from the p-n junction to ambient through the substrate is at least 1000° C./W. 20. The device of claim 1, further comprising: a plurality of additional inorganic LEDs each having first and second spaced-apart contacts, the inorganic LED and the additional inorganic LEDs being arranged in a two-dimensional array on the substrate,wherein a heat density generated by the two-dimensional array during operation is less than approximately 0.01 W/cm2. 21. The device of claim 1, wherein the ACA is a pressure-activated ACA. 22. The device of claim 1, wherein the first and second conductive traces comprise a conductive ink. 23. The device of claim 1, wherein, at least in the bonding region, a height of the first and second traces above the first surface of the substrate does not exceed 10 μm. 24. The device of claim 1, wherein the substrate is flexible and deformable. 25. The device of claim 1, wherein (i) the LED comprises a quantum well, and (ii) a distance between the quantum well and the first surface of the substrate is less than 100 μm. 26. The device of claim 1, wherein the substrate comprises at least one of polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyethersulfone, polyester, polyimide, polyethylene, or paper. 27. The device of claim 26, wherein the substrate consists essentially of polyethylene terephthalate. 28. The device of claim 1, further comprising an optical element arranged to transmit light emitted by the LED. 29. The device of claim 11, wherein the optical element is disposed above and optically coupled to the LED. 30. The device of claim 29, wherein the optical element is disposed in contact with at least one of the substrate or the traces so as to enclose the LED between the substrate and the optical element. 31. The device of claim 29, further comprising: a plurality of additional inorganic LEDs each having first and second spaced-apart contacts, the LED and the additional LEDs being arranged in a two-dimensional array on the substrate; anda plurality of additional optical elements each disposed over and optically coupled to one of the additional LEDs,wherein (i) the optical element is optically coupled only to the LED, and (ii) each additional optical element is optically coupled only to a different one of the additional LEDs. 32. The device of claim 1, further comprising, disposed over and at least partially surrounding the LED, a phosphor material for converting at least a portion of light emitted by the LED to a different wavelength. 33. The device of claim 32, further comprising, disposed over the LED, a reflective surface for reflecting converted light toward the flexible substrate. 34. The device of claim 32, further comprising an optically transparent material disposed between the LED and the phosphor material.
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