IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0598497
(2012-08-29)
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등록번호 |
US-8917502
(2014-12-23)
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발명자
/ 주소 |
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출원인 / 주소 |
- Amazon Technologies, Inc.
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대리인 / 주소 |
Kilpatrick Townsend & Stockton LLP
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인용정보 |
피인용 횟수 :
0 인용 특허 :
7 |
초록
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A modular datacenter having multiple levels. The levels are stackable, and the number of levels can be selected based upon a desired installation. The datacenter includes walls or other structures that define ducts that extend through all the levels. The ducts can be used as hot and cold aisles for
A modular datacenter having multiple levels. The levels are stackable, and the number of levels can be selected based upon a desired installation. The datacenter includes walls or other structures that define ducts that extend through all the levels. The ducts can be used as hot and cold aisles for servers and networking equipment. The ducts can be formed by concentric cylinders.
대표청구항
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1. A datacenter, comprising: a plurality of levels stacked one on top of each other, each level comprising:a first cylinder forming a first duct for vertical airflow therethrough;a second cylinder, concentric with the first cylinder, and surrounding the first cylinder so that a second duct is formed
1. A datacenter, comprising: a plurality of levels stacked one on top of each other, each level comprising:a first cylinder forming a first duct for vertical airflow therethrough;a second cylinder, concentric with the first cylinder, and surrounding the first cylinder so that a second duct is formed between the first cylinder and the second cylinder, the second duct for vertical airflow therethrough;a third cylinder, concentric with the first cylinder, and surrounding the second cylinder so that a third duct is formed between the second cylinder and the third cylinder, the third duct for vertical airflow therethrough;a server farm comprising a plurality of servers, each server comprising an air intake on one side and an air exhaust on another side, the servers of the server farm being arranged on the second cylinder such that air intakes for servers on the server farm are in fluid communication with the second duct and the air exhausts for the servers is in fluid communication with the third duct; anda plurality of network racks, each network rack including one or more network hardware components, the network hardware components including an air intake and an air exhaust, the one or more network hardware components being arranged on the first cylinder such that air intakes for the network hardware components are in fluid communication with the second duct and the air exhausts on the network hardware components are in fluid communication with the first duct; andwherein the first cylinders, second cylinders, and third cylinders for each of the levels align to form continuous cylinders through the plurality of multiple levels. 2. The datacenter of claim 1, further comprising a conical cap fitting over a top level of the datacenter. 3. The datacenter of claim 2, further comprising a vent in the top of the conical cap, the vent in fluid communication with the first and third ducts. 4. The datacenter of claim 3, wherein the second duct is capped and isolated from the vent, the first duct, and the third duct. 5. The datacenter of claim 4, further comprising a vent connecting the second duct to ambient air exterior of the datacenter. 6. The datacenter of claim 1, wherein the bottoms of the first, second, and third cylinders are in fluid communication with each other. 7. A level for a datacenter, comprising: a first structure forming a first duct for vertical airflow therethrough;a second structure surrounding the first structure so that a second duct is formed between the first structure and the second structure, the second duct for vertical airflow therethrough;a third structure surrounding the second structure so that a third duct is formed between the second structure and the third structure, the third duct for vertical airflow therethrough;a plurality of openings in the second structure for receiving a plurality of first computing devices, each first computing device comprising an air intake on one side and an air exhaust on another side, the openings being configured to receive the first computing devices on the second structure such that, when the first computing devices are in position, air intakes for the first computing devices face the second duct and air exhaust faces the third duct;a plurality of openings in the first structure for receiving a plurality of second computing devices, each second computing device including an air intake and an air exhaust, the openings in the first structure being arranged on the first structure such that, when the second computing devices are mounted on the first structure, air intakes for the network hardware components face the second duct and air exhaust faces the first duct; andwherein the first duct, second duct, and third duct each forms a continuous vertical ducts through the level. 8. The level for a datacenter of claim 7, further comprising a plurality of said levels, stacked so that first, second and third ducts for the levels align to form continuous vertical ducts through the multiple levels, the multiple levels forming a datacenter, and a cap fitting over a top level of the datacenter. 9. The level for a datacenter of claim 7, wherein the first computing devices comprise servers. 10. The level for a datacenter of claim 7, wherein the second computing devices comprise network hardware components. 11. The level for a datacenter of claim 7, wherein each of the first structure, second structure and third structure is a cylindrical wall. 12. The level for a datacenter of claim 7, wherein the bottoms of the first, second, and third ducts are open so that the bottom are in fluid communication with each other. 13. A datacenter, comprising: a plurality of levels stacked one on top of each other, each level comprising: a first structure forming a first duct for vertical airflow therethrough;a second structure forming a second duct, the second duct for vertical airflow therethrough;a third structure forming a third duct for vertical airflow therethrough;the first, second and third ducts being isolated from each other;a server farm comprising a plurality of servers, each server comprising an air intake on one side and an air exhaust on another side, the servers of the server farm being arranged such that air intakes for servers on the server farm draw air from the second duct and air exhausts on the servers exhausts air into the third duct; anda plurality of network racks, each network rack including one or more network hardware components, the network hardware components including an air intake and an air exhaust, the one or more network hardware components being arranged such that air intakes for the network hardware components draw air from the second duct and the air exhausts on the network hardware components exhaust air into the first duct;the first, second, and third ducts of a bottom of the layers being in fluid communication at a bottom end; andthe second duct being fluidly isolated from the first and third ducts at a top end;wherein the first ducts, second ducts, and third ducts for each of the levels align to form continuous ducts through the plurality of multiple levels; andat least one vent in fluid communication with a top of the stack of the first and third ducts for exhausting air from the ducts out of the datacenter. 14. The datacenter of claim 13, further comprising at least one fan mounted to direct air up at least one of the first and third ducts. 15. The datacenter of claim 13, further comprising a chiller in fluid communication with the second duct. 16. The datacenter of claim 13, further comprising a grate floor in the bottom of the second duct. 17. The datacenter of claim 13, further comprising a lift mounted to a side of the datacenter, the lift providing access to each of the levels. 18. The datacenter of claim 13, further comprising a mechanical and electrical compartment mounted along a side of the datacenter, and accessible from each of the levels. 19. A method of fabricating a datacenter, comprising: assembling a plurality of levels at a site by stacking the levels one on top of the other, each of the levels comprising:a first cylinder forming a first duct for vertical airflow therethrough;a second cylinder, concentric with the first cylinder, and surrounding the first cylinder so that a second duct is formed between the first cylinder and the second cylinder, the second duct for vertical airflow therethrough;a third cylinder, concentric with the first cylinder, and surrounding the second cylinder so that a third duct is formed between the second cylinder and the third cylinder, the third duct for vertical airflow therethrough;wherein, when the levels are stacked, the first cylinders, second cylinders, and third cylinders for each of the levels align to form continuous cylinders through the plurality of multiple levels;mounting a cap on a top of the levels;mounting a lift on a side of the levels, the lift providing access to each of the levels;mounting a mechanical and electrical compartment on a side of the levels, and access from each of the levels to the compartment;mounting a plurality of server racks at at least one of the levels, the server racks comprising mounting locations for a plurality of servers, each server comprising an air intake on one side and an air exhaust on another side, the server racks being arranged such that, when servers are mounted on the server racks, air intakes for servers face the second duct and air exhaust faces the third duct; andmounting a plurality of network racks at at least one of the levels, each network rack including mounting locations for one or more network hardware components, the network hardware components including an air intake and an air exhaust, the network racks being arranged such that, when network hardware components are mounted on the server racks, air intakes for the network hardware components face the second duct and air exhaust faces the first duct. 20. The method of claim 19, further comprising mounting a vent in fluid communication with a top of the first and third cylinders and ambient atmosphere outside the datacenter. 21. The method of claim 19, further comprising capping a top of the topmost second cylinder. 22. The method of claim 21, further comprising mounting a vent between the second cylinder cap and ambient atmosphere outside the datacenter. 23. The method of claim 19, further comprising mounting at least one fan to aid in exhaust of at least one of the first and third cylinders. 24. The method of claim 19, further comprising mounting at least one chiller tower in fluid communication with the second cylinder.
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