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An electronics module is provided for utilization onboard an airborne object. In one embodiment, the electronics module includes a housing having a cavity therein, a first printed circuit board (PCB) disposed in the cavity, a second PCB disposed in the cavity above the first PCB, and a supportive in

An electronics module is provided for utilization onboard an airborne object. In one embodiment, the electronics module includes a housing having a cavity therein, a first printed circuit board (PCB) disposed in the cavity, a second PCB disposed in the cavity above the first PCB, and a supportive interconnect structure. The supportive interconnect structure includes a substantially annular insulative body and a plurality of vias. The substantially annular insulative body extends around an inner circumferential portion of the housing between the first PCB and the second PCB to support the second PCB and to axially space the second PCB from the first PCB. The plurality of vias is formed through the substantially annular insulative body and electrically couples the first PCB to the second PCB.

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1. An electronics module for utilization onboard an airborne object, the electronics module comprising: a housing having a cavity therein;a first printed circuit board (PCB) disposed in the cavity, and supporting a first plurality of electronic devices having a first maximum height;a second PCB disp

1. An electronics module for utilization onboard an airborne object, the electronics module comprising: a housing having a cavity therein;a first printed circuit board (PCB) disposed in the cavity, and supporting a first plurality of electronic devices having a first maximum height;a second PCB disposed in the cavity above the first PCB, and supporting a second plurality of electronic devices having a second maximum height different from the first maximum height;a third PCB disposed in the cavity above the second PCB;a first supportive interconnect structure, comprising: a first substantially annular insulative body extending around an inner circumferential portion of the housing between the first PCB and the second PCB to support the second PCB, wherein the first substantially annular insulative body comprises a single unitary body having a substantially continuous annular sidewall to provide robust structural support to the electronics module, the first substantially annular insulative body being configured to axially space the second PCB from the first PCB; anda first plurality of vias formed through the first substantially annular insulative body and electrically coupling the first PCB to the second PCB; anda second supportive interconnect structure, comprising: a second substantially annular insulative body extending around an inner circumferential portion of the housing between the second PCB and the third PCB to support the third PCB, wherein the second substantially annular insulative body comprises a single unitary body configured to axially space the third PCB from the second PCB; anda second plurality of vias formed through the second substantially annular insulative body and electrically coupling the second PCB to the third PCB,wherein a first axial height of the first substantially annular insulative body is minimized to accommodate the first maximum height of the first plurality of electronic devices, and a second axial height of the second substantially annular insulative body is minimized to accommodate the second maximum height of the second plurality of electronic devices, the first axial height of the first substantially annular insulative body being different from the second axial height of the second substantially annular insulative body, such that a usable space within the housing is maximized. 2. An electronics module according to claim 1 wherein the first substantially annular insulative body contacts and extends around an outer peripheral portion of the upper surface of the first PCB. 3. An electronics module according to claim 2 wherein the first substantially annular insulative body contacts and extends around an outer peripheral portion of the lower surface of the second PCB. 4. An electronics module according to claim 3 wherein the first supportive interconnect structure mates directly with the first PCB and with the second PCB. 5. An electronics module according to claim 1 wherein the first plurality of vias are radially spaced about the longitudinal axis of the first substantially annular insulative body. 6. An electronics module according to claim 1 wherein the first PCB and the second PCB each have a substantially circular shape that is generally conformal with the cavity. 7. An electronics module according to claim 6 wherein the first supportive interconnect structure has a substantially cylindrical shape that is generally conformal with the cavity. 8. An electronics module according to claim 6 wherein the outer diameter of the third PCB is less than the outer diameter of the second PCB, and wherein the second supportive interconnect structure tapers radially inward from a lower portion of the second supportive interconnect structure to an upper portion of the second supportive interconnect structure. 9. An electronics module according to claim 8 wherein the lower portion of the second supportive interconnect structure has an outer diameter substantially equivalent to that of the second PCB, and wherein the upper portion of the second supportive interconnect structure has an outer diameter substantially equivalent to that of the third PCB. 10. An electronics module according to claim 1 wherein the first substantially annular insulative body comprises an inner circumferential sidewall through which the first plurality of vias is exposed. 11. An electronics module according to claim 1 wherein the first substantially annular insulative body comprises an outer circumferential sidewall through which the first plurality of vias is exposed. 12. An electronics module according to claim 1, further comprising a rotational orientation feature comprising: a longitudinal key projecting radially inward from an inner surface of the housing; anda longitudinal keyway formed through at least one of the first PCB, the second PCB, and the supportive interconnect structure, the longitudinal keyway receiving the longitudinal key therein. 13. An electronics module according to claim 12 wherein the longitudinal keyway is formed through each of the first PCB, the second PCB, and the first substantially annular insulative body. 14. An electronics module according to claim 1 wherein the airborne object comprises an airborne projectile, and wherein an aft portion of the housing is threaded to permit the housing to be threadably mounted to the airborne projectile. 15. An electronics module according to claim 1 further comprising at least one via formed through a central axial post and electrically coupling the first and second PCBs, the central axial post extending from the first PCB to the second PCB to support a central portion of the second PCB. 16. An electronics module according to claim 1, further comprising: a central opening formed through the first substantially annular insulative body and accommodating the first plurality of electronic devices; anda central axial post coupled to the first substantially annular insulative body and extending within the central opening from the first PCB to the second PCB to support a central portion of the second PCB. 17. An electronics module according to claim 16 wherein the first supportive interconnect structure further comprises a radial spoke projecting radially from the first substantially annular insulative body into the central opening to connect with the central axial post and further support the second PCB. 18. An electronics module for utilization onboard an airborne object, the electronics module comprising: a housing having a cavity therein;a plurality of printed circuit boards (PCBs) disposed in the cavity in a stacked configuration, at least two of the PCBs supporting pluralities of electronic devices having different maximum heights; anda plurality of supportive interconnect structures axially interspersed with the plurality of the PCBs, each supportive interconnect structure in the plurality of supportive interconnect structures comprising: a substantially annular insulative body disposed within the housing and generally conformal with the cavity, the substantially annular insulative body extending between neighboring PCBs in the plurality of PCBs to provide structural support, wherein the substantially annular insulative body comprises a single unitary body having a substantially continuous annular sidewall to provide robust structural support to the electronics module, the insulative body being configured to provide axial spacing; anda plurality of vias extending axially through the substantially annular insulative body to electrically couple neighboring PCBs in the plurality of PCBs,wherein an axial height of the substantially annular insulative body of each of the plurality of supportive interconnect structures is minimized to accommodate the different maximum heights of the pluralities of electronic devices, an axial height of a first substantially annular insulative body being different from an axial height of a second substantially annular insulative body, such that a usable space within the housing is maximized. 19. An electronics module according to claim 18 wherein the plurality of supportive interconnect structures are substantially co-axial. 20. An electronics module according to claim 18, further comprising: a plurality of notches formed in the plurality of PCBs and the substantially annular insulative bodies, the plurality of notches aligning axially to produce at least one longitudinal keyway; andat least one longitudinal key projecting radially inward from an inner surface of the housing and into the at least one longitudinal keyway. 21. A method for producing an electronics module for an airborne object, the method comprising: providing a housing having a cavity therein; disposing first, second, and third printed circuit boards (PCBs) in the cavity, the first PCB supporting a first plurality of electronic devices having a first maximum height, the second PCB supporting a second plurality of electronic devices having a second maximum height different from the first maximum height; electrically coupling the first and second PCBs utilizing a first supportive interconnect structure disposed between the first and second PCBs, the first supportive interconnect structure comprising: a first substantially annular insulative body extending around an inner circumferential portion of the housing between the first PCB and the second PCB to support the second PCB and to axially space the second PCB from the first PCB, wherein the first substantially annular insulative body comprises a single unitary body having a substantially continuous annular sidewall to provide robust structural support to the electronics module; and a first plurality of vias formed through the first substantially annular insulative body and electrically coupling the first PCB to the second PCB; and electrically coupling the second and third PCBs utilizing a second supportive interconnect structure disposed between the second and third PCBs, the second supportive interconnect structure comprising: a second substantially annular insulative body extending around an inner circumferential portion of the housing between the second PCB and the third PCB to support the third PCB and to axially space the third PCB from the second PCB, wherein the second substantially annular insulative body comprises a single unitary body having a substantially continuous annular sidewall; and a second plurality of vias formed through the second substantially annular insulative body and electrically coupling the second PCB to the third PCB, wherein a first axial height of the first substantially annular insulative body is minimized to accommodate the first a maximum height of the first plurality of electronic devices, and a second axial height of the second substantially annular insulative body is minimized to accommodate the second maximum height of the second plurality of electronic devices, the first axial height of the first substantially annular insulative body being different from the second axial height of the second substantially annular insulative body, such that a usable space within the housing is maximized.