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특허 상세정보

Method and apparatus for enhanced cooling of mobile computing device surfaces

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-005/00    H05K-007/20    G06F-001/20   
미국특허분류(USC) 361/679.5; 361/679.49; 361/679.51
출원번호 US-0890420 (2010-09-24)
등록번호 US-8953313 (2015-02-10)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Kacvinsky Daisak Bluni PLLC
인용정보 피인용 횟수 : 0  인용 특허 : 28
초록

An apparatus with some embodiments is described having ducts positioned above and below a main device housing to provide cooling air flow to at least a portion of the top and bottom surfaces of the associated computing device. In some embodiments, the device is a mobile computing device. In some embodiments, air may be drawn through inlets located on at least one side of the device. The inlet air may be supplied via upper and lower air ducts to an air mover positioned on an opposite side of the device. In some embodiments, air discharged from the air mov...

대표
청구항

1. An apparatus, comprising: a housing to enclose a heat producing component therein, the housing arranged adjacent to a first air duct comprising a first opening and a second air duct comprising a second opening, the first air duct and the second air duct comprising separate air ducts to facilitate two or more separate airflows;the first air duct arranged above the housing between the housing and a palm rest portion of the apparatus;the second air duct arranged below the housing between the housing and a bottom portion of the apparatus; andan air mover ...

이 특허에 인용된 특허 (28)

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