An inexpensive light emitting device and inexpensive electric equipment are provided. A substrate on which a semiconductor element or a light emitting element is formed and a color filter are manufactured by separate manufacturing processes, and they are bonded to each other to complete the light em
An inexpensive light emitting device and inexpensive electric equipment are provided. A substrate on which a semiconductor element or a light emitting element is formed and a color filter are manufactured by separate manufacturing processes, and they are bonded to each other to complete the light emitting device. Thus, the yield of the light emitting device is improved and the manufacture period is shortened.
대표청구항▼
1. A method of manufacturing a light emitting device, the method comprising the steps of: forming a base film over a first substrate;forming a light emitting element over the base film;providing a second substrate over the light emitting element;separating the first substrate from the base film; and
1. A method of manufacturing a light emitting device, the method comprising the steps of: forming a base film over a first substrate;forming a light emitting element over the base film;providing a second substrate over the light emitting element;separating the first substrate from the base film; andbonding a color filter to the base film after the separating step by forming a resin layer between the color filter and the base film,wherein the base film is an inorganic insulating film containing silicon, nitrogen and oxygen,wherein the resin layer is in direct contact with the color filter and the base film, andwherein the color filter comprises a flexible film and a colored layer provided on the flexible film. 2. The method according to claim 1, wherein the light emitting element emits white color light. 3. The method according to claim 1, wherein light emitted from the light emitting element is passed through the base film and the color filter. 4. The method according to claim 1, wherein the colored layer includes a red colored layer, a green colored layer and a blue colored layer. 5. The method according to claim 4, wherein at least two of the red colored layer, the green colored layer and the blue colored layer overlap with each other. 6. The method according to claim 1, wherein the light emitting element includes Ir complex. 7. The method according to claim 1, wherein the light emitting device is flexible. 8. The method according to claim 1, wherein the color filter is bonded to the base film on a side of the base film opposite to a side on which the light emitting element is located. 9. A method of manufacturing a light emitting device, the method comprising the steps of: forming a base film over a first substrate;forming a transistor over the base film;forming a light emitting element electrically connected to the transistor;providing a second substrate over the light emitting element;separating the first substrate from the base film; andbonding a color filter to the base film after the separating step by forming a resin layer between the color filter and the base film,wherein the base film is an inorganic insulating film containing silicon, nitrogen and oxygen,wherein the resin layer is in direct contact with the color filter and the base film, andwherein the color filter comprises a flexible film and a colored layer provided on the flexible film. 10. The method according to claim 9, wherein the light emitting element emits white color light. 11. The method according to claim 9, wherein light emitted from the light emitting element is passed through the base film and the color filter. 12. The method according to claim 9, wherein the colored layer includes a red colored layer, a green colored layer and a blue colored layer. 13. The method according to claim 9, wherein at least two of the red colored layer, the green colored layer and the blue colored layer overlap with each other. 14. The method according to claim 9, wherein the light emitting element includes Ir complex. 15. The method according to claim 9, wherein the light emitting device is flexible. 16. The method according to claim 9, wherein the color filter is bonded to the base film on a side of the base film opposite to a side on which the light emitting element is located. 17. A method of manufacturing a light emitting device, the method comprising the steps of: forming a light emitting element over a base film provided on a first substrate;providing a second substrate over the light emitting element;separating the first substrate from base film; andbonding, after the separating step, a third substrate provided with a colored layer to the second substrate with the light emitting element and the colored layer interposed therebetween by forming a resin layer between the third substrate and the base film,wherein the base film is an inorganic insulating film containing silicon, nitrogen and oxygen, andwherein the resin layer is in direct contact with the colored layer and the base film. 18. The method according to claim 17, wherein the light emitting element emits white color light. 19. The method according to claim 17, wherein light emitted from the light emitting element is passed through the colored layer and the third substrate. 20. The method according to claim 17, wherein the colored layer includes a red colored layer, a green colored layer and a blue colored layer. 21. The method according to claim 20, wherein at least two of the red colored layer, the green colored layer and the blue colored layer overlap with each other. 22. The method according to claim 17, wherein the light emitting element includes Ir complex. 23. The method according to claim 17, wherein the light emitting device is flexible. 24. A method of manufacturing a light emitting device, the method comprising the steps of: forming a transistor over a base film provided on a first substrate;forming a light emitting element electrically connected to the transistor;providing a second substrate over the light emitting element;separating the first substrate from the base film; andbonding, after the separating step, a third substrate provided with a colored layer to the second substrate with the transistor, the light emitting element and the colored layer interposed therebetween by forming a resin layer between the base film and the third substrate,wherein the base film is an inorganic insulating film containing silicon, nitrogen and oxygen, andwherein the resin layer is in direct contact with the colored layer and the base film. 25. The method according to claim 24, wherein the light emitting element emits white color light. 26. The method according to claim 24, wherein light emitted from the light emitting element is passed through the colored layer and the third substrate. 27. The method according to claim 24, wherein the colored layer includes a red colored layer, a green colored layer and a blue colored layer. 28. The method according to claim 27, wherein at least two of the red colored layer, the green colored layer and the blue colored layer overlap with each other. 29. The method according to claim 24, wherein the light emitting element includes Ir complex. 30. The method according to claim 24, wherein the light emitting device is flexible.
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