Binary epoxy ink and enhanced printer systems, structures, and associated methods
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01D-011/00
C09D-011/00
B41J-002/21
B41J-011/00
출원번호
US-0369082
(2012-02-08)
등록번호
US-8960880
(2015-02-24)
우선권정보
WO-PCT/US2011/025084 (2011-02-16)
발명자
/ 주소
Mills, Michael D.
Byrne, Joe
Mills, Stephen
출원인 / 주소
Redwood Technologies, LLC
대리인 / 주소
Glenn, Michael A.
인용정보
피인용 횟수 :
0인용 특허 :
32
초록▼
Enhanced media transport systems and structures are provided for printing environments. Enhanced vacuum table structures and associated methods may also be implemented for a variety of printer systems. Enhanced rail systems and associated carriage structures may preferably be used within a variety o
Enhanced media transport systems and structures are provided for printing environments. Enhanced vacuum table structures and associated methods may also be implemented for a variety of printer systems. Enhanced rail systems and associated carriage structures may preferably be used within a variety of printing environments, such as for but not limited to grand scale printers. Water-based binary epoxy ink compositions and associated processes provide adhesion and material compatibility that exceeds that of currently available UV curable products, while providing ultra-low volatile organic carbon (VOCs), and no hazardous air pollutants (HAPs). An integrated system and method for identification of consumables through a central database may also be implemented within different printing systems.
대표청구항▼
1. A water based binary epoxy ink for use in an inkjet printer, comprising: a first part comprising an epoxy resin and water; anda second part comprising a curative and water;wherein the first part and the second part are configured to be jetted separately and impingedly mixed on a media. 2. The wat
1. A water based binary epoxy ink for use in an inkjet printer, comprising: a first part comprising an epoxy resin and water; anda second part comprising a curative and water;wherein the first part and the second part are configured to be jetted separately and impingedly mixed on a media. 2. The water based binary epoxy ink of claim 1, wherein the first part further comprises a pigment. 3. The water based binary epoxy ink of claim 2, wherein the pigment in the first part comprises 0 to 10 percent by weight. 4. The water based binary epoxy ink of claim 1, wherein the epoxy resin comprises BisPhenol-A epoxy resin. 5. The water based binary epoxy ink of claim 1, wherein the epoxy resin comprises 0.1 to 20 percent by weight of the first part. 6. The water based binary epoxy ink of claim 1, wherein the first part further comprises at least one dispersant. 7. The water based binary epoxy ink of claim 6, wherein the dispersant in the first part comprises up to 20 percent by weight. 8. The water based binary epoxy ink of claim 1, wherein the first part further comprises an anti-skinning agent. 9. The water based binary epoxy ink of claim 8, wherein the anti-skinning agent in the first part comprises up to 10 percent by weight of the first part. 10. The water based binary epoxy ink of claim 1, wherein the first part further comprises at least one co-solvent. 11. The water based binary epoxy ink of claim 10, wherein the at least one co-solvent in the first part comprises any of a freezing point reducer, a dry speed modifier, a film former, or any combination thereof. 12. The water based binary epoxy ink of claim 10, wherein the at least one co-solvent in the first part comprises up to 50 percent by weight of the first part. 13. The water based binary epoxy ink of claim 1, wherein the first part further comprises at least one surfactant. 14. The water based binary epoxy ink of claim 13, wherein the at least one surfactant in the first part comprises any of a wetting agent, a film former, a defoamer, a polysiloxanes, butanedioic acid, or any combination thereof. 15. The water based binary epoxy ink of claim 1, wherein the water in the first part comprises 1 to 99 percent by weight of the first part. 16. The water based binary epoxy ink of claim 1, wherein the second part further comprises a pigment. 17. The water based binary epoxy ink of claim 16, wherein the pigment in the second part comprises up to 10 percent by weight. 18. The water based binary epoxy ink of claim 1, wherein the curative comprises a modified polyamine resin. 19. The water based binary epoxy ink of claim 1, wherein the curative comprises 0.1 to 50 percent by weight of the second part. 20. The water based binary epoxy ink of claim 1, wherein the second part further comprises one or more dispersants. 21. The water based binary epoxy ink of claim 20, wherein the dispersants in the second part comprise high molecular weight block copolymers with pigment affinic groups. 22. The water based binary epoxy ink of claim 20, wherein the dispersants in the second part comprise up to 10 percent by weight. 23. The water based binary epoxy ink of claim 1, wherein the second part further comprises an anti-skinning agent. 24. The water based binary epoxy ink of claim 23, wherein the anti-skinning agent in the second part comprises a high flash point alcoholic solvent. 25. The water based binary epoxy ink of claim 23, wherein the anti-skinning agent in the second part comprises up to 10 percent by weight of the second part. 26. The water based binary epoxy ink of claim 1, wherein the second part further comprises at least one co-solvent. 27. The water based binary epoxy ink of claim 26, wherein the at least one co-solvent in the second part comprises any of a freezing point reducer, a dry speed modifier, a film former, or any combination thereof. 28. The water based binary epoxy ink of claim 26, wherein the at least one co-solvent in the second part comprises up to 50 percent by weight of the second part. 29. The water based binary epoxy ink of claim 1, wherein the second part further comprises at least one surfactant or defoamer. 30. The water based binary epoxy ink of claim 29, wherein the at least one surfactant or defoamer in the second part comprises any of polysiloxanes, butanedioic acid, or any combination thereof. 31. The water based binary epoxy ink of claim 29, wherein the at least one surfactant or defoamer in the second part comprises up to 10 percent by weight of the second part. 32. The water based binary epoxy ink of claim 1, wherein the water in the second part comprises 1 to 99 percent by weight of the second part.
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