IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0406982
(2012-02-28)
|
등록번호 |
US-8964374
(2015-02-24)
|
발명자
/ 주소 |
- Sheng, Honggang
- Kim, Sangsun
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
10 |
초록
▼
Systems and methods are provided for cooling electronic equipment in a data center. Ambient air is vertically circulated from a workspace across a plurality of rack-mounted electronic devices. The electronic devices are located in a plurality of trays such that each tray has a major plane that is su
Systems and methods are provided for cooling electronic equipment in a data center. Ambient air is vertically circulated from a workspace across a plurality of rack-mounted electronic devices. The electronic devices are located in a plurality of trays such that each tray has a major plane that is substantially parallel to a side plane of the rack. The circulated air is cooled with a heat exchanger that is connected to a vertical end of the rack via a sealed interface. Multiple racks can be arrayed in a distributed cooling arrangement, which increases reliability and scalability of the data center.
대표청구항
▼
1. A method of cooling electronic equipment on a rack, the method comprising: vertically circulating ambient air from a workspace across a plurality of rack-mounted electronic devices, wherein the electronic devices are located in a plurality of trays, and wherein each tray has a major plane and is
1. A method of cooling electronic equipment on a rack, the method comprising: vertically circulating ambient air from a workspace across a plurality of rack-mounted electronic devices, wherein the electronic devices are located in a plurality of trays, and wherein each tray has a major plane and is arranged so that its major plane is substantially parallel to a side plane of the rack;cooling the circulated air with a heat exchanger, wherein the heat exchanger is connected to a vertical end of the rack via a sealed interface, and the cooling comprises capturing air heated by the electronic devices in a hot air plenum that is local to the rack and is thermally isolated from the workspace, and cooling the captured air using cooling equipment; andre-circulating the cooled air to the workspace. 2. The method of claim 1, wherein the re-circulated cooled air has a temperature that is substantially equal to a target temperature of the ambient air in the workspace. 3. The method of claim 1, wherein each device has a width dimension, a depth dimension, and a height dimension, wherein the height dimension is longer than the width dimension, and wherein the device is mounted to a corresponding tray having the major plane substantially parallel to the height dimension. 4. The method of claim 1, wherein each tray is arranged so that the major plane is substantially perpendicular to said vertical end plane of the rack and to a front plane of the rack. 5. The method of claim 1, wherein air is captured by one or more ambient air circulation fans located in a plenum that is local to the rack, wherein the plenum is located at the vertical end of the rack. 6. The method of claim 1, wherein the ambient air is circulated by one or more air circulation fans located in a plenum that is local to the rack, wherein the plenum is located at another vertical end of the rack. 7. The method of claim 1, wherein the rack-mounted electronic devices are open to the workspace from at least one of a front side or a back side of the rack during operation. 8. The method of claim 1, further comprising: monitoring an ambient temperature of the workspace;determining if the monitored ambient temperature exceeds a threshold; andin response to determining that the monitored ambient temperature exceeds the threshold, performing at least one of: increasing a flow of the circulated air across the plurality of rack-mounted electronic devices, ordecreasing a cooling temperature in the heat exchanger. 9. A system for cooling electronic equipment on a rack, the system comprising: one or more air circulation fans for vertically circulating ambient air from a workspace across a plurality of rack-mounted electronic devices, wherein the electronic devices are located in a plurality of trays and wherein each tray has a major plane and is arranged so that its major plane is substantially parallel to a side plane of the rack;a heat exchanger, local to the rack, for cooling the circulated air and re-circulating the cooled air to the workspace, wherein the heat exchanger is connected to a vertical end of the rack via a sealed interface;a hot air plenum, local to the rack, for capturing air heated by the electronic devices, wherein the hot air plenum is thermally isolated from the workspace; andcooling equipment for cooling the captured air. 10. The cooling system of claim 9, wherein the re-circulated cooled air has a temperature that is substantially equal to a target temperature of the ambient air in the workspace. 11. The cooling system of claim 9, wherein each device has a width dimension, a depth dimension, and a height dimension, wherein the height dimension is longer than the width dimension, and wherein the device is mounted to a corresponding tray having the major plane substantially parallel to the height dimension. 12. The cooling system of claim 9, wherein each tray is arranged so that the major plane is substantially perpendicular to said vertical end plane of the rack and to a front plane of the rack. 13. The cooling system of claim 9, wherein at least one of the one or more air circulation fans are located in a plenum that is local to the rack, wherein the plenum is located at the vertical end of the rack. 14. The cooling system of claim 9, wherein at least one of the one or more air circulation fans are located in a plenum that is local to the rack, wherein the plenum is located at another vertical end of the rack. 15. The cooling system of claim 9, wherein the rack-mounted electronic devices are open to the workspace from at least one of a front side or a back side of the rack during operation. 16. The cooling system of claim 9, further comprising processing circuitry located at least in part on the rack, the processing circuitry configured to: monitor an ambient temperature of the workspace;determine if the monitored ambient temperature exceeds a threshold; andin response to determining that the monitored ambient temperature exceeds the threshold, perform at least one of: increasing a flow of the circulated air across the plurality of rack-mounted electronic devices, ordecreasing a cooling temperature in the heat exchanger. 17. A system of cooling electronic equipment on a rack, the system comprising: means for vertically circulating ambient air from a workspace across a plurality of rack-mounted electronic devices, wherein the electronic devices are located in a plurality of trays and wherein each tray has a major plane and is arranged so that its major plane is substantially parallel to a side plane of the rack;means for cooling the circulated air, wherein the means for cooling is connected to a vertical end of the rack via a sealed interface, the means for cooling comprising: means for capturing air heated by the electronic devices in a hot air plenum local to the rack, wherein the hot air plenum is thermally isolated from the workspace; andmeans for cooling the captured air to the temperature that is substantially equal to the temperature of the ambient air in the workspace; andmeans for re-circulating the cooled air to the workspace. 18. The cooling system of claim 17, wherein the re-circulated cooled air has a temperature that is substantially equal to a target temperature of the ambient air in the workspace. 19. The cooling system of 17, wherein air is circulated vertically downward from a top to a bottom of the rack. 20. A system for cooling electronic equipment on a rack, the system comprising: one or more air circulation fans for vertically circulating ambient air from a workspace across a plurality of rack-mounted electronic devices, wherein the electronic devices are located in a plurality of trays and wherein each tray has a major plane and is arranged so that its major plane is substantially parallel to a side plane of the rack; anda heat exchanger, local to the rack, for cooling the circulated air and re-circulating the cooled air to the workspace, wherein the heat exchanger is connected to a vertical end of the rack via a sealed interface,wherein the rack-mounted electronic devices are open to the workspace from at least one of a front side or a back side of the rack during operation.
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