초록 ▼

A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measu

A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically. Therefore, the structure achieves the goal of keeping the operating temperature of each electronic component in the corresponding environment.

대표청구항 ▼

1. A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic component(s), comprising: at least one electronic component; anda multi-layer printed circuit board (PCB), wherein the electronic component(s) is/are in contact with outer surfaces

1. A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic component(s), comprising: at least one electronic component; anda multi-layer printed circuit board (PCB), wherein the electronic component(s) is/are in contact with outer surfaces of the multi-layer PCB, at least the two layers adjacent to each of the electronic component(s) is/are configured with at least one heating circuit and at least one thermal conduction element at the position corresponding to the contact position of the electronic component(s), and the multi-layer PCB further includes: a temperature sensing circuit in electrical connection with at least one of the heating circuits or in connection with at least one of the thermal conduction elements configured on the multi-layer PCB to detect a temperature thereof and using the temperature as the operating temperature thereof; anda control circuit in electrical connection with at least one of the heating circuits, whereinwhen the operating temperature of one of the electronic component(s) measured by the temperature sensing circuit is lower than a first default value corresponding to the electronic component, the heating circuit corresponding to the contact position of the electronic component is enabled, with the corresponding thermal conduction element transferring heat, to heat up the electronic component, with the first default value being set to have different values for different electronic component(s); andwhen the operating temperature of one of the electronic component(s) measured by the temperature sensing circuit is lower than a second default value corresponding to the electronic component, the heating circuit corresponding to the contact position of the electronic component is disabled, with the corresponding thermal conduction element transferring heat, to cool down the electronic component, with the second default value being set to have different values for different electronic component(s). 2. The heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic component(s) of claim 1, wherein the electronic component(s) is/are selected from the combination of chip(s), hard disk drive(s), and panel(s). 3. The heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic component(s) of claim 1, wherein the thermal conduction elements are made of the combination of metal, semiconductor, and polymer materials of high thermal conductivities. 4. The heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic component(s) of claim 1, wherein the electronic component(s) is/are glued to have contact with the outer surfaces of the multi-layer PCB. 5. The heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic component(s) of claim 1, wherein the electronic component(s) is/are welded to have contact with the outer surfaces of the multi-layer PCB. 6. The heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic component(s) of claim 1, wherein the heating circuit have different ranges of coverage and circuit densities for the different electronic component(s). 7. The heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic component(s) of claim 1, wherein the thermal conduction elements have different ranges of coverage for the different electronic component(s).