[미국특허]
Multiple chip package module having inverted package stacked over die
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/02
H01L-023/28
H01L-021/70
H01L-025/03
H01L-023/433
H01L-025/065
H01L-023/00
출원번호
US-0014257
(2004-12-16)
등록번호
US-8970049
(2015-03-03)
발명자
/ 주소
Karnezos, Marcos
출원인 / 주소
ChipPAC, Inc.
대리인 / 주소
Ishimaru & Associates LLP
인용정보
피인용 횟수 :
18인용 특허 :
108
초록▼
A module having multiple die includes a first die on a first substrate and an inverted second package stacked over the first die, with, where necessary, provision is made for a standoff between the second package and the first die. Also, methods for making the module include steps of providing a fir
A module having multiple die includes a first die on a first substrate and an inverted second package stacked over the first die, with, where necessary, provision is made for a standoff between the second package and the first die. Also, methods for making the module include steps of providing a first package having a first die attached onto an upward facing side of a first package substrate, and stacking an inverted second package over the die on the first package, provision being made where necessary for a standoff between the second package and the first package die to avoid damaging impact between the downward-facing side of the second package and wire bonds connecting the first die to the first package substrate.
대표청구항▼
1. A multiple chip module comprising: a substrate; a die mounted onto the substrate; a wire connected to the die and the substrate; a spacer mounted onto the die; a package stacked on the spacer with a surface of a molding of the package affixed to a surface of the spacer opposite the die, the packa
1. A multiple chip module comprising: a substrate; a die mounted onto the substrate; a wire connected to the die and the substrate; a spacer mounted onto the die; a package stacked on the spacer with a surface of a molding of the package affixed to a surface of the spacer opposite the die, the package overlying and directly over the wire and having a top package substrate in direct contact with a surface of the molding opposite the spacer; and a wire bond attached directly to the substrate and an upward facing side of the top package substrate. 2. The module of claim 1, comprising a plurality of die attached to the substrate. 3. A multiple chip module comprising: a substrate; a die attached to a substrate; a wire connected to the die and the substrate; a spacer mounted on the die; and a package stacked on the spacer with a surface of a molding of the package affixed to a surface of the spacer opposite the die by an adhesive, the package overlying and directly over the wire and having a top package substrate in direct contact with a surface of the molding opposite the spacer; and a wire bond attached directly to the substrate and an upward facing side of the top package substrate. 4. A multiple chip module comprising: a BGA substrate; a die attached to the BGA substrate; a wire connected to the die and the BGA substrate, a spacer mounted on the die; and an inverted package stacked on the spacer with a surface of a molding of the inverted package affixed to a surface of the spacer opposite the die, the inverted package is overlying and directly over the wire and includes an inverted package substrate in direct contact with a surface of the molding opposite the spacer; and a wire bond attached directly to the BGA substrate and an upward facing side of the inverted package substrate. 5. The multi-chip module of claim 4 wherein the package is an LGA package. 6. The multi-chip module of claim 4 wherein the package is a saw-singulated package. 7. The multi-chip module of claim 4 wherein the package is a chip scale package. 8. The multi-chip module of claim 4 wherein the package has a tape-based package substrate. 9. The multi-chip module of claim 4 wherein the package is a bump chip carrier package. 10. The module of claim 4 comprising a plurality of die attached to said BGA substrate. 11. The module of claim 4, comprising a plurality of stacked die attached to said BGA substrate, and wherein the inverted package is mounted over an uppermost one of the stacked die. 12. The module of claim 4, comprising a flip chip die bonded to the BGA substrate. 13. The module of claim 4 wherein the inverted package includes a package substrate of the inverted package; and a flip chip die bonded to the package substrate. 14. The module of claim 4, further comprising a heat spreader over the package. 15. The module of claim 4, comprising a laminate substrate. 16. The module of claim 4, comprising a build-up substrate. 17. The module of claim 4, comprising a flexible substrate. 18. The module of claim 4, comprising a ceramic substrate. 19. The module of claim 4, further comprising an additional package mounted over the inverted package. 20. The module of claim 19 wherein the additional package is wire bonded to the inverted package substrate. 21. The module of claim 19 wherein the additional package is wire bonded to the BGA substrate. 22. The module of claim 4, further comprising an additional die mounted over the inverted package. 23. The module of claim 22 wherein the additional die is wire-bonded to the upper substrate. 24. The module of claim 22 wherein the additional die is wire-bonded to the BGA substrate. 25. The module of claim 4, further comprising a heat spreader. 26. The module of claim 4 further comprising a heat spreader affixed to an upward facing surface of a topmost package. 27. The module of claim 4 further comprising an additional die on the inverted package; and a heat spreader affixed to an upward facing surface of the additional die. 28. The module of claim 4 wherein the inverted package is the uppermost package in the module, and further comprising a heat spreader affixed to an upward facing side of the inverted package. 29. The module of claim 4 further comprising a heat spreader molded in at the topmost surface of the module. 30. The module of claim 4 wherein an electrically nonconductive heat-conducting molding is employed for a module encapsulation. 31. A multiple chip module comprising: a first substrate; a first die mounted onto the first substrate; a wire connected to the first die and the first substrate; a spacer mounted on the first die; and an inverted package stacked on the spacer with a surface of a molding of the inverted package affixed to a surface of the spacer opposite the first die, the inverted package overlying and directly over the wire and having an inverted package substrate in direct contact with a surface of the molding opposite the spacer; and wire bonds attached directly to the first substrate and the inverted package substrate. 32. The module of claim 31 wherein the first substrate includes a BGA substrate. 33. The module of claim 31 comprising a plurality of die mounted on said first substrate. 34. The module of claim 31 wherein said first die is connected to said first substrate by wire bonds, and wherein said spacer is affixed onto an upward facing side of the die, and wherein the inverted package is affixed onto an upward facing side of the spacer. 35. The module of claim 31 wherein the wire bonds are in direct contact with a top side of the first substrate and the inverted package substrate. 36. The module of claim 34 wherein the wire bonds connect z-interconnect wire bond pads on an upward facing side of the inverted package with pads on the first substrate. 37. The module of claim 34 wherein the wire bonds connect z-interconnect wire bond pads on an upward facing side of the inverted package with z-interconnect wire bond pads on an upward-facing side of the first substrate. 38. The module of claim 34 wherein the wire bonds connect z-interconnect wire bond pads on an upward facing side of the inverted package with z-interconnect wire bond pads on the upward-facing side of the first substrate, and further comprising an additional die mounted on the upward facing side of the inverted package. 39. The module of claim 4 wherein the inverted package includes a package die attached to a package substrate by flip chip or wire bond interconnection. 40. The module of claim 4 wherein the inverted package comprises a laminate substrate LGA. 41. The module of claim 4 wherein the inverted package comprises a tape-based LGA. 42. The module of claim 4 wherein the inverted package comprises a QFN package. 43. The module of claim 4 wherein the inverted package comprises a BCC package. 44. The module of claim 4 wherein the inverted package comprises at least one die. 45. The module of claim 44 wherein the inverted package comprises a plurality of die. 46. The module of claim 44 wherein the inverted package comprises a plurality of stacked die. 47. A computer containing a multiple chip module comprising: a first substrate; a first die mounted onto the first substrate with a die attach epoxy, a wire connected to the first die and the first substrate, a spacer affixed onto the first die, and an inverted package stacked upon said spacer with a surface of a molding of the inverted package affixed to a surface of the spacer opposite the first die, the inverted package is overlying and directly over the wire and includes an inverted package substrate in direct contact with a surface of the molding opposite the spacer; and a wire bond attached directly to the first substrate and an upward facing side of the inverted package substrate. 48. A portable electronic apparatus containing a multiple chip module comprising: a first substrate; a first die mounted onto the first substrate with a die attach epoxy, a wire connected to the first die and the first substrate, a spacer affixed onto an active side of the first die, and an inverted package stacked upon the spacer with a surface of a molding of the inverted package affixed to a surface of the spacer opposite the first die, the inverted package is overlying and directly over the wire and has an inverted package substrate in direct contact with a surface of the molding opposite the spacer; and a wire bond attached directly to the first substrate and an upward facing side of the inverted package substrate. 49. A mobile telecommunications device containing a multiple chip module comprising: a first substrate, a first die mounted onto the first substrate with a die attach epoxy, a wire connected to the first die and the first substrate, a spacer affixed onto the first die, and an inverted package stacked upon the spacer with only an adhesive between the inverted package and the spacer and a surface of a molding of the inverted package affixed to a surface of the spacer opposite the first die, the inverted package overlying and directly over the wire and having an inverted package substrate in direct contact with a surface of the molding opposite the spacer; and a wire bond attached directly to the first substrate and an upward facing side of the inverted package substrate.
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