Light-emitting device, flexible light-emitting device, electronic device, lighting apparatus, and method of manufacturing light-emitting device and flexible-light emitting device
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-027/14
H01L-051/52
H01L-027/12
H01L-027/32
출원번호
US-0005768
(2011-01-13)
등록번호
US-9000443
(2015-04-07)
우선권정보
JP-2010-010421 (2010-01-20)
발명자
/ 주소
Hatano, Kaoru
출원인 / 주소
Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
Robinson, Eric J.
인용정보
피인용 횟수 :
6인용 특허 :
43
초록▼
An object is to provide a light-emitting device or a flexible light-emitting device having low surface temperature, a long lifetime, and high reliability. Another object is to provide a simple method of manufacturing the light-emitting device or the flexible light-emitting device. Provided is a ligh
An object is to provide a light-emitting device or a flexible light-emitting device having low surface temperature, a long lifetime, and high reliability. Another object is to provide a simple method of manufacturing the light-emitting device or the flexible light-emitting device. Provided is a light-emitting device or a flexible light-emitting device which includes: a substrate having a light-transmitting property with respect to visible light; a first adhesive layer provided over the substrate; an insulating layer located over the first adhesive layer; a light-emitting element comprising a first electrode formed over the insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property between the first electrode and the second electrode, a second adhesive layer formed over the second electrode; a metal substrate provided over the second adhesive layer; and a heat radiation material layer formed over the metal substrate.
대표청구항▼
1. A light-emitting device comprising: a substrate having a light-transmitting property with respect to visible light;a first adhesive layer over the substrate;an insulating layer over the first adhesive layer;a light-emitting element comprising a first electrode formed over the insulating layer, a
1. A light-emitting device comprising: a substrate having a light-transmitting property with respect to visible light;a first adhesive layer over the substrate;an insulating layer over the first adhesive layer;a light-emitting element comprising a first electrode formed over the insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property between the first electrode and the second electrode,a second adhesive layer over the second electrode;a metal substrate over the second adhesive layer;a resin layer over the metal substrate; anda heat radiation material layer over the resin layer,wherein the substrate includes an inorganic filler having a particle diameter of 40 nm or less, andwherein the heat radiation material layer is a titanium oxide layer, an iron oxide layer, an aluminum oxide layer, a copper oxide layer, or a ceramic material layer. 2. The light-emitting device according to claim 1, wherein a film sealing layer is formed between the second electrode of the light-emitting element and the second adhesive layer. 3. The light-emitting device according to claim 1, wherein the metal substrate comprises a material selected from stainless steel, aluminum, copper, nickel, and an aluminum alloy. 4. The light-emitting device according to claim 1, wherein the first adhesive layer comprises at least one selected from an epoxy resin, an acrylic resin, a silicone resin, and a phenol resin. 5. The light-emitting device according to claim 1, wherein the first adhesive layer includes a thermally conductive filler. 6. The light-emitting device according to claim 5, wherein a thermal conductivity of the thermally conductive filler is higher than a thermal conductivity of another material used in the first adhesive layer. 7. The light-emitting device according to claim 1, wherein the second adhesive layer comprises at least one selected from an epoxy resin, an acrylic resin, a silicone resin, and a phenol resin. 8. The light-emitting device according to claim 1, wherein the second adhesive layer includes a thermally conductive filler. 9. The light-emitting device according to claim 8, wherein a thermal conductivity of the thermally conductive filler is higher than a thermal conductivity of another material used in the second adhesive layer. 10. The light-emitting device according to claim 1, wherein the resin layer includes at least one thermosetting resin selected from an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, and a polyester resin, or includes at least one thermoplastic resin selected from polypropylene, polyethylene, polycarbonate, polystyrene, polyamide, polyetherketone, a fluorine resin, and polyethylenenaphthalate. 11. The light-emitting device according to claim 1, wherein at least one of the substrate having the light-transmitting property, the first adhesive layer, and the second adhesive layer further includes a fibrous body. 12. The light-emitting device according to claim 11, wherein the fibrous body is a glass fiber. 13. The light-emitting device according to claim 1, wherein a waterproof layer is formed between the substrate having the light-transmitting property and the first adhesive layer. 14. The light-emitting device according to claim 13, wherein the waterproof layer is a layer including silicon and nitrogen or a layer including aluminum and nitrogen. 15. The light-emitting device according to claim 1, wherein the substrate having the light-transmitting property includes a surface facing the metal substrate, and includes a surface opposite to the surface facing the metal substrate being provided with a coat layer. 16. The light-emitting device according to claim 15, wherein the coat layer has a property of transmitting visible light and high hardness. 17. The light-emitting device according to claim 15, wherein the coat layer is a conductive layer having a property of transmitting visible light. 18. The light-emitting device according to claim 1, wherein the insulating layer comprises a layer including silicon and nitrogen. 19. The light-emitting device according to claim 1, wherein the substrate has flexibility. 20. The light-emitting device according to claim 1, wherein the light-emitting device is a flexible light-emitting device. 21. An electronic device comprising the light-emitting device according to claim 1 in a display portion. 22. A lighting apparatus comprising the light-emitting device according to claim 1. 23. The light-emitting device according to claim 1, wherein a surface of the substrate is uneven. 24. The light-emitting device according to claim 1, wherein the resin layer includes a fibrous body. 25. A light-emitting device comprising: a substrate having a light-transmitting property with respect to visible light;a first adhesive layer over the substrate;an insulating layer over the first adhesive layer;a transistor over the insulating layer;an interlayer insulating layer covering the transistor;a light-emitting element comprising a first electrode over the interlayer insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property between the first electrode and the second electrode, the first electrode being electrically connected to a source electrode or a drain electrode of the transistor;a second adhesive layer over the second electrode;a metal substrate over the second adhesive layer;a resin layer over the metal substrate; anda heat radiation material layer formed over the resin layer,wherein the substrate includes an inorganic filler having a particle diameter of 40 nm or less, andwherein the heat radiation material layer is a titanium oxide layer, an iron oxide layer, an aluminum oxide layer, a copper oxide layer, or a ceramic material layer. 26. The light-emitting device according to claim 25, further comprising: a pixel portion including the light-emitting element and the transistor; anda driver circuit portion including a second transistor and being provided outside the pixel portion,wherein the transistor in the pixel portion and the second transistor in the driver circuit portion are formed in same steps. 27. The light-emitting device according to claim 25, wherein crystalline silicon is used in the transistor. 28. The light-emitting device according to claim 25, wherein an oxide semiconductor is used in the transistor. 29. The light-emitting device according to claim 25, wherein a film sealing layer is formed between the second electrode of the light-emitting element and the second adhesive layer. 30. The light-emitting device according to claim 25, wherein the metal substrate comprises a material selected from stainless steel, aluminum, copper, nickel, and an aluminum alloy. 31. The light-emitting device according to claim 25, wherein the first adhesive layer comprises at least one selected from an epoxy resin, an acrylic resin, a silicone resin, and a phenol resin. 32. The light-emitting device according to claim 25, wherein the first adhesive layer includes a thermally conductive filler. 33. The light-emitting device according to claim 32, wherein a thermal conductivity of the thermally conductive filler is higher than a thermal conductivity of another material used in the first adhesive layer. 34. The light-emitting device according to claim 25, wherein the second adhesive layer comprises at least one selected from an epoxy resin, an acrylic resin, a silicone resin, and a phenol resin. 35. The light-emitting device according to claim 25, wherein the second adhesive layer includes a thermally conductive filler. 36. The light-emitting device according to claim 35, wherein a thermal conductivity of the thermally conductive filler is higher than a thermal conductivity of another material used in the second adhesive layer. 37. The light-emitting device according to claim 25, wherein the resin layer includes at least one thermosetting resin selected from an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, and a polyester resin, or includes at least one thermoplastic resin selected from polypropylene, polyethylene, polycarbonate, polystyrene, polyamide, polyetherketone, a fluorine resin, and polyethylenenaphthalate. 38. The light-emitting device according to claim 25, wherein at least one of the substrate having the light-transmitting property, the first adhesive layer, and the second adhesive layer further includes a fibrous body. 39. The light-emitting device according to claim 38, wherein the fibrous body is a glass fiber. 40. The light-emitting device according to claim 25, wherein a waterproof layer is formed between the substrate having the light-transmitting property and the first adhesive layer. 41. The light-emitting device according to claim 40, wherein the waterproof layer is a layer including silicon and nitrogen or a layer including aluminum and nitrogen. 42. The light-emitting device according to claim 25, wherein the substrate having the light-transmitting property includes a surface facing the metal substrate, and includes a surface opposite to the surface facing the metal substrate being provided with a coat layer. 43. The light-emitting device according to claim 42, wherein the coat layer has a property of transmitting visible light and high hardness. 44. The light-emitting device according to claim 42, wherein the coat layer is a conductive layer having a property of transmitting visible light. 45. The light-emitting device according to claim 25, wherein the insulating layer comprises a layer including silicon and nitrogen. 46. The light-emitting device according to claim 25, wherein the substrate has flexibility. 47. The light-emitting device according to claim 25, wherein the light-emitting device is a flexible light-emitting device. 48. An electronic device comprising the light-emitting device according to claim 25 in a display portion. 49. A lighting apparatus comprising the light-emitting device according to claim 25. 50. The light-emitting device according to claim 25, wherein a surface of the substrate is uneven. 51. The light-emitting device according to claim 25, wherein the resin layer includes a fibrous body. 52. A light-emitting device comprising: a substrate having a light-transmitting property with respect to visible light;a first adhesive layer over the substrate;an insulating layer over the first adhesive layer;a light-emitting element comprising a first electrode formed over the insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property between the first electrode and the second electrode,a second adhesive layer over the second electrode;a metal substrate having a thickness greater than or equal to 10 μm and less than or equal to 200 μm over the second adhesive layer;a resin layer over the metal substrate; anda heat radiation material layer over the resin layer,wherein the substrate includes an inorganic filler having a particle diameter of 40 nm or less. 53. The light-emitting device according to claim 52, wherein a film sealing layer is formed between the second electrode of the light-emitting element and the second adhesive layer. 54. The light-emitting device according to claim 52, wherein the first adhesive layer includes a thermally conductive filler. 55. The light-emitting device according to claim 54, wherein a thermal conductivity of the thermally conductive filler is higher than a thermal conductivity of another material used in the first adhesive layer. 56. The light-emitting device according to claim 52, wherein the second adhesive layer includes a thermally conductive filler. 57. The light-emitting device according to claim 56, wherein a thermal conductivity of the thermally conductive filler is higher than a thermal conductivity of another material used in the second adhesive layer. 58. The light-emitting device according to claim 52, wherein the resin layer includes at least one thermosetting resin selected from an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, and a polyester resin, or includes at least one thermoplastic resin selected from polypropylene, polyethylene, polycarbonate, polystyrene, polyamide, polyetherketone, a fluorine resin, and polyethylenenaphthalate. 59. The light-emitting device according to claim 52, wherein at least one of the substrate having the light-transmitting property, the first adhesive layer, and the second adhesive layer further includes a fibrous body. 60. The light-emitting device according to claim 59, wherein the fibrous body is a glass fiber. 61. The light-emitting device according to claim 52, wherein a waterproof layer is formed between the substrate having the light-transmitting property and the first adhesive layer. 62. The light-emitting device according to claim 61, wherein the waterproof layer is a layer including silicon and nitrogen or a layer including aluminum and nitrogen. 63. The light-emitting device according to claim 52, wherein the substrate having the light-transmitting property includes a surface facing the metal substrate, and includes a surface opposite to the surface facing the metal substrate being provided with a coat layer. 64. The light-emitting device according to claim 63, wherein the coat layer has a property of transmitting visible light and high hardness. 65. The light-emitting device according to claim 63, wherein the coat layer is a conductive layer having a property of transmitting visible light. 66. The light-emitting device according to claim 52, wherein the insulating layer comprises a layer including silicon and nitrogen. 67. The light-emitting device according to claim 52, wherein the substrate has flexibility. 68. The light-emitting device according to claim 52, wherein the light-emitting device is a flexible light-emitting device. 69. An electronic device comprising the light-emitting device according to claim 52 in a display portion. 70. A lighting apparatus comprising the light-emitting device according to claim 52. 71. The light-emitting device according to claim 52, wherein a surface of the substrate is uneven. 72. The light-emitting device according to claim 52, wherein the resin layer includes a fibrous body. 73. A light-emitting device comprising: a substrate having a light-transmitting property with respect to visible light;a first adhesive layer over the substrate;an insulating layer over the first adhesive layer;a transistor over the insulating layer;an interlayer insulating layer covering the transistor;a light-emitting element comprising a first electrode over the interlayer insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property between the first electrode and the second electrode, the first electrode being electrically connected to a source electrode or a drain electrode of the transistor;a second adhesive layer over the second electrode;a metal substrate having a thickness greater than or equal to 10 μm and less than or equal to 200 μm over the second adhesive layer;a resin layer over the metal substrate; anda heat radiation material layer formed over the resin layer,wherein the substrate includes an inorganic filler having a particle diameter of 40 nm or less. 74. The light-emitting device according to claim 73, wherein crystalline silicon is used in the transistor. 75. The light-emitting device according to claim 73, wherein an oxide semiconductor is used in the transistor. 76. The light-emitting device according to claim 73, wherein a film sealing layer is formed between the second electrode of the light-emitting element and the second adhesive layer. 77. The light-emitting device according to claim 73, wherein the first adhesive layer includes a thermally conductive filler. 78. The light-emitting device according to claim 77, wherein a thermal conductivity of the thermally conductive filler is higher than a thermal conductivity of another material used in the first adhesive layer. 79. The light-emitting device according to claim 73, wherein the second adhesive layer includes a thermally conductive filler. 80. The light-emitting device according to claim 79, wherein a thermal conductivity of the thermally conductive filler is higher than a thermal conductivity of another material used in the second adhesive layer. 81. The light-emitting device according to claim 73, wherein the resin layer includes at least one thermosetting resin selected from an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, and a polyester resin, or includes at least one thermoplastic resin selected from polypropylene, polyethylene, polycarbonate, polystyrene, polyamide, polyetherketone, a fluorine resin, and polyethylenenaphthalate. 82. The light-emitting device according to claim 73, wherein at least one of the substrate having the light-transmitting property, the first adhesive layer, and the second adhesive layer further includes a fibrous body. 83. The light-emitting device according to claim 82, wherein the fibrous body is a glass fiber. 84. The light-emitting device according to claim 73, wherein a waterproof layer is formed between the substrate having the light-transmitting property and the first adhesive layer. 85. The light-emitting device according to claim 84, wherein the waterproof layer is a layer including silicon and nitrogen or a layer including aluminum and nitrogen. 86. The light-emitting device according to claim 73, wherein the substrate having the light-transmitting property includes a surface facing the metal substrate, and includes a surface opposite to the surface facing the metal substrate being provided with a coat layer. 87. The light-emitting device according to claim 86, wherein the coat layer has a property of transmitting visible light and high hardness. 88. The light-emitting device according to claim 86, wherein the coat layer is a conductive layer having a property of transmitting visible light. 89. The light-emitting device according to claim 73, wherein the insulating layer comprises a layer including silicon and nitrogen. 90. The light-emitting device according to claim 73, wherein the substrate has flexibility. 91. The light-emitting device according to claim 73, wherein the light-emitting device is a flexible light-emitting device. 92. An electronic device comprising the light-emitting device according to claim 73 in a display portion. 93. A lighting apparatus comprising the light-emitting device according to claim 73. 94. The light-emitting device according to claim 73, wherein a surface of the substrate is uneven. 95. The light-emitting device according to claim 73, wherein the resin layer includes a fibrous body.
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