[미국특허]
Chassis having an internal air plenum and an arrangement of multiple chassis to form a vertical air plenum
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
G06F-001/20
출원번호
US-0777608
(2007-07-13)
등록번호
US-9017154
(2015-04-28)
발명자
/ 주소
Moss, David L.
Hoss, Shawn P.
출원인 / 주소
Dell Products L.P.
대리인 / 주소
Baker Botts L.L.P.
인용정보
피인용 횟수 :
0인용 특허 :
16
초록▼
A chassis and rack system is disclosed in which a chassis separated into two separate enclosures by a central partition. Each of the enclosures is sized to receive a computer system. The partition includes a pair of vertically oriented vents, with each of the vents in fluid communication with one of
A chassis and rack system is disclosed in which a chassis separated into two separate enclosures by a central partition. Each of the enclosures is sized to receive a computer system. The partition includes a pair of vertically oriented vents, with each of the vents in fluid communication with one of the enclosures and the computer system contained therein. Heated air is removed from each computer system through the vent in the partition that is associated with the computer system. Multiple chassis may be placed one atop another in a vertical configuration in which each chassis is either directly above or directly below another chassis. In this vertical configuration, the vents form a vertically oriented common plenum that can be used to evacuate air from multiple chassis arranged in a rack.
대표청구항▼
1. A chassis for a computing system, comprising: a back;a front;sides;a central portion including first and second vents and a partition wall, the central portion being positioned within the interior of the chassis and coupled to the base, wherein the positioning of the central portion forms front a
1. A chassis for a computing system, comprising: a back;a front;sides;a central portion including first and second vents and a partition wall, the central portion being positioned within the interior of the chassis and coupled to the base, wherein the positioning of the central portion forms front and back portions within the interior of the chassis, wherein the first and second vents are an open space that extends through the vertical length of the chassis, and wherein the first and second vents are open at each respective base and respective end opposite the base;a first and second open apertures at the first and second vents, respectfully, wherein positioning of the first and second open apertures permits airflow in a transverse direction through the first and second open apertures;an opening of the central portion, wherein the opening of the central portion aligns with a subfloor fresh air duct to permit fresh air to pass from the subfloor fresh air duct upward through the central portion;wherein each of the first and second vents is open at the base of the chassis and in the direction opposite the base of the chassis;wherein access to the front portion is provided through the front of the chassis and access to the back portion is provided through the back of the chassis; andwherein the first vent is in fluid communication with the front portion of the chassis, and wherein the second vent is in fluid communication with the back portion of the chassis. 2. The chassis of claim 1, wherein heated air leaves the chassis through the front of the chassis; and wherein heated air leaves the chassis through the back of the chassis. 3. The chassis of claim 1, wherein a computer system is housed within the each of the front and back portions. 4. The chassis of claim 3, wherein heated air from the first computer system leaves the chassis through the first vent; andwherein heated air from the second computer system leaves the chassis through the second vent. 5. The chassis of claim 3, wherein heated air from the first computer system leaves the chassis in an upward direction through the first vent; andwherein heated air from the second computer system leaves the chassis in an upward direction through the second vent. 6. The chassis of claim 1, wherein the chassis has a 1U size. 7. The chassis of claim 1, wherein the chassis has a size that is a multiple of 1U. 8. The chassis of claim 1, wherein the chassis has a size that is smaller than 1U and wherein multiple chassis can be placed within a slot sized for a chassis having a size of 1U. 9. A chassis for a computing system, comprising: a back;a front;sides;a base coupled to each of the back, front, and sides;a central portion including first and second vents and a partition wall, the central portion being positioned within the interior of the chassis and the partition wall being coupled to one of the sides, wherein the positioning of the central portion forms front and back portions within the interior of the chassis, wherein the first and second vents are an open space that extends through the vertical length of the chassis, and wherein the first and second vents are open at each respective base and respective end opposite the base;a first and second open apertures at the first and second vents, respectfully, wherein positioning of the first and second open apertures permits airflow in a transverse direction through the first and second open apertures;an opening of the central portion, wherein the opening of the central portion aligns with a subfloor fresh air duct to permit fresh air to pass from the subfloor fresh air duct upward through the central portion;wherein each of the first and second vents is open at the base of the chassis and in the direction opposite the base of the chassis;wherein access to the front portion is provided through the front of the chassis and access to the back portion is provided through the back of the chassis; andwherein the first vent is in fluid communication with the front portion of the chassis, and wherein the second vent is in fluid communication with the back portion of the chassis. 10. The chassis of claim 9, wherein heated air leaves the chassis through the front of the chassis; andwherein heated air leaves the chassis through the back of the chassis. 11. The chassis of claim 9, wherein a computer system is housed within the each of the front and back portions. 12. The chassis of claim 11, wherein heated air from the first computer system leaves the chassis through the first vent; andwherein heated air from the second computer system leaves the chassis through the second vent. 13. The chassis of claim 11, wherein heated air from the first computer system leaves the chassis in an upward direction through the first vent; andwherein heated air from the second computer system leaves the chassis in an upward direction through the second vent. 14. The chassis of claim 9, wherein the chassis has a 1U size. 15. The chassis of claim 9, wherein the chassis has a size that is a multiple of 1U.
Gagnon Kevin M. (1668 Larwood Rd. Lemon Grove CA 91945) Goulter Victor H. (485 Molimo Dr. San Francisco CA 94127-1655), Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control p.
Eberhardt Anthony N. ; Dailey William L. ; Harada John A., Hard disk drive assembly which has a plenum chamber and a fan assembly that is perpendicular to a rack chamber.
Basara Michael (Milan NC ITX) Kneale Collan B. (Ashville NC) Lucente Samuel A. (Stamford CT) Natoli John (Woodstock NY), Rack based packaging system for computers with cable, cooling and power management module.
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