Epoxy resins with high thermal stability and toughness
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C08G-059/14
C09J-163/00
C08L-063/00
C08G-059/06
C08G-059/18
C08G-059/22
출원번호
US-0110300
(2012-05-04)
등록번호
US-9051498
(2015-06-09)
국제출원번호
PCT/US2012/036421
(2012-05-04)
§371/§102 date
20131007
(20131007)
국제공개번호
WO2012/158363
(2012-11-22)
발명자
/ 주소
Kincaid, Derek Scott
Le, Dong
Johnson, David Lanham
출원인 / 주소
Huntsman Advanced Materials Americas LLC
인용정보
피인용 횟수 :
0인용 특허 :
4
초록▼
Epoxy resin compositions contain (i) a polyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin compositio
Epoxy resin compositions contain (i) a polyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics.
대표청구항▼
1. An epoxy resin composition comprising: (a) a polyepoxide resin obtained from the reaction of an epoxy compound presented by structural formulae (IA) or (IB): where each R is independently a divalent hydrocarbyl group having from 1 to 12 carbon atoms; each R1 is independently hydrogen or an alkyl
1. An epoxy resin composition comprising: (a) a polyepoxide resin obtained from the reaction of an epoxy compound presented by structural formulae (IA) or (IB): where each R is independently a divalent hydrocarbyl group having from 1 to 12 carbon atoms; each R1 is independently hydrogen or an alkyl group having from 1 to 4 carbon atoms; each X is independently hydrogen, a hydrocarbyl or hydrocarbyloxy group having from 1 to 12 carbon atoms, or a halogen; each t is independently 0 or 1; and n is an integer having a value of 0 to about 150 and a chain extension agent of the general formula (V): R2O-A-OR2 (V) where A is a group having the formula (IV) where Z is hydrogen, methyl, or phenyl; and A1 represents an organic group required to complete an aromatic residue and R2 is an epoxy-functionalized alkyl group having 1 to 6 carbon atoms and optionally a non-benzofuran containing chain extension agent; (b) a toughening agent;(c) a curing agent; and optionally(d) a bisphenol compound. 2. The epoxy resin composition of claim 1, wherein A1 is phenyl, diphenylmethane, biphenyl, diphenylmethane substituted at the methane group by one or two C1-C4 alkyl groups, diphenylketone or diphenylsulfone. 3. The epoxy resin composition of claim 1, wherein A is a group having the formula: wherein Z is defined as in claim 1 and Y is a direct bond, CH2, C(C1-C4 alkyl)2, —C═O or —S(═O)2; and d is an integer from 0 to 3. 4. The epoxy resin composition of claim 1, wherein the toughening agent is a carboxylated or amine terminated acrylonitrile/butadiene elastomer. 5. The epoxy resin composition of claim 1, further comprising a bisphenol compound selected from bisphenol A, bisphenol F, bisphenol R, bisphenol S and a mixture thereof. 6. An epoxy resin composition comprising a reaction product of a polyepoxide resin, benzofuran di-epoxide component and a toughening agent and which is represented by the formula (VI) where R is a divalent hydrocarbyl group having from 1 to 12 carbon atoms; X is independently hydrogen or a hydrocarbyl or hydrocarbyloxy group having from 1 to 12 carbon atoms, or a halogen; t is 0 or 1; A is a group having the formula (IV) where Z is hydrogen, methyl, or phenyl and A1 represents an organic group required to complete an aromatic residue; a is an integer from 1-100; and, b is an integer from 1-100; e is an integer from 1-100; and f and g are integers from 1-1000. 7. A method of bonding at least two substrates together comprising: a) providing an epoxy resin composition according to claim 1b) applying the epoxy resin composition to at least one surface of one or more of the substrates; andc) matingly engaging the surfaces of the substrates which are to be bonded together permitting the composition to cure to form a bond there between. 8. An uncured epoxy resin composition comprising: (a) a polyepoxide resin obtained by the reaction of(i) an epoxy compound represented by structural formulae (IA), (IB), or (IC): where each R is independently a divalent hydrocarbyl group having from 1 to 12 carbon atoms; each R1 is independently hydrogen or an alkyl group having from 1 to 4 carbon atoms; each X is independently hydrogen, a hydrocarbyl or hydrocarbyloxy group having from 1 to 12 carbon atoms, or a halogen; each t is independently 0 or 1; and n is an integer having a value of 0 to about 150; each R0 is independently hydrogen, methyl or phenyl; D and E are each independently —(CH2)i— or —(CH2)i—R5- where i is an integer of 0 to 5 and R5 is selected from the group of O, N, S, S—S, Si(R)2, and P(R)2, where R is independently a divalent hydrocarbyl group having from 1 to 12 carbon atoms, (ii) a chain extension agent of the general formula (III): OH-A-OH (III) where A is a group having the formula (IV) where Z is hydrogen, methyl, or phenyl; and A1 represents an organic group required to complete an aromatic residue and (iii) a toughening agent; (b) a curing agent; and optionally(c) a bisphenol compound.
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이 특허에 인용된 특허 (4)
Treybig Duane S. (Lake Jackson TX) Wang David S. (Lake Jackson TX) Sheih Pong S. (Lake Jackson TX) Ho Loan A. (Lake Jackson TX), Advanced epoxy compositions, curable compositions and cured products.
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