초록 ▼

The present invention relates to the use of ternary nickel-containing metal alloys of the NiMR type (where M=Mo, W, Re or Cr, and R=B or P) deposited by an electroless process in semiconductor technology. In particular, the present invention relates to the use of these deposited ternary nickel-conta

The present invention relates to the use of ternary nickel-containing metal alloys of the NiMR type (where M=Mo, W, Re or Cr, and R=B or P) deposited by an electroless process in semiconductor technology. In particular, the present invention relates to the use of these deposited ternary nickel-containing metal alloys as barrier material or as selective encapsulation material for preventing the diffusion and electromigration of copper in semiconductor components.

대표청구항 ▼

1. A process for the production of an electrically conductive structure, comprising: (i) electrolessly depositing a first layer comprising at least one on at least one of a catalytically activated semiconductor layer and a catalytically activated insulating layer,(ii) depositing a copper interconnec

1. A process for the production of an electrically conductive structure, comprising: (i) electrolessly depositing a first layer comprising at least one on at least one of a catalytically activated semiconductor layer and a catalytically activated insulating layer,(ii) depositing a copper interconnect on the first layer, and(iii) electrolessly depositing a second layer comprising at least one alloy on the copper interconnect,wherein the first layer is a diffusion barrier, and the second layer is an encapsulation barrier,to form an electrically conductive structure comprising (1) at least one of the catalytically activated semiconductor layer and the catalytically activated insulating layer, (2) the first layer, (3) the copper interconnect, and (4) the second layer, wherein the first layer and the second layer are adjacent the copper interconnect, andwherein an alloy in at least one of the first layer and the second layer comprises Mo, Re or W in an amount of from 2 to 25 at-% as a refractory metal which increases the thermal stability of the barrier layer, andwherein during the electroless depositing of the first layer a concentration of Mo in an electroless plating solution is 3×10−2 mol/l or less, a concentration of W is 1×10−1 mol/l or less and a concentration of Re is 1×10−1 mol/l or less. 2. The process according to claim 1, wherein the electroless depositing forms at least one of the first layer and the second layer which comprise at least one of NiReP, NiMoP, NiWP, NiReB, NiMoB, NiWB, NiRePB, NiMoPB and NiWPB alloys. 3. The process according to claim 1, wherein, as the refractory metal, molybdenum is present in at least one of the first layer and the second layer in an amount of from 3 to 24 at-% or Re in an amount of from 2 to 23 at-% or tungsten in an amount of from 5 to 15 at-%. 4. The process according to claim 1, wherein the electroless deposition comprises depositing a thin metal-alloy film on a surface of a metal substrate, wherein the electroless deposition is carried out by spraying a semiconductor substrate with an autocatalytic plating solution or dipped into the autocatalytic solution, causing the electroless deposition of a thin metal-alloy film comprising at least one metal selected from the group consisting of Ni, Co, Pd, Ag, Rh, Ru, Re, Pt, Sn, Pb, Mo, W and Cr. 5. The process according to claim 4, wherein the metal substrate consists of a metal selected from the group consisting of Cu, Ag, Co, Ni, Pd and Pt. 6. The process according to claim 4, wherein the autocatalytic plating solution is essentially free from surface-active substances. 7. The process according to claim 4, wherein the autocatalytic plating solution comprises at least one surface-active substance and optionally at least one additive for improving the layer properties and nature of one of the first layer and the second layer. 8. The process according to claim 4, wherein the autocatalytic plating solution comprises one or more stabilisers for extending the bath service lives of the electroplating solutions. 9. The process according to claim 4, further comprising cleaning and activating one or more surfaces of the copper interconnect with ammonia- and hydrofluoric acid-free solutions. 10. The process according to claim 1, wherein the electroless depositing forms a first layer comprising at least one alloy selected from the group consisting of NiReP, NiReB, NiMoB, NiMoP, NiWB, NiRePB, NiMoPB and NiWPB. 11. The process according to claim 1, wherein the electroless depositing forms a second layer comprising at least one alloy selected from the group consisting of NiReP, NiReB, NiMoB, NiWB, NiMoP, NiRePB, NiMoPB and NiWPB. 12. A process for the production of an electrically conductive structure, comprising: (i) electrolessly depositing a first layer comprising at least one alloy selected from the group consisting of NiRePB, NiMoPB and NiWPB on at least one of a catalytically activated semiconductor layer and a catalytically activated insulating layer,(ii) depositing a copper interconnect on the first layer, andwherein the first layer is a diffusion barrier,to form an electrically conductive structure comprising (1) at least one of the catalytically activated semiconductor layer and the catalytically activated insulating layer, (2) the first layer, and (3) the copper interconnect, wherein the first layer is adjacent the copper interconnect. 13. The process of claim 12, wherein the alloy comprises at least one of Mo, Re and W in an amount of from 2 to 25 at-%. 14. The process according to claim 12, wherein the first layer comprises from 3 to 24 at-% of Re. 15. The process according to claim 12, wherein the first layer comprises Mo in an amount of from 3 to 24 at-%. 16. The process according to claim 12, wherein the first layer comprises W in an amount of from 5 to 15 at-%. 17. A process for the production of an electrically conductive structure, comprising: (i) cleaning and/or activating a copper interconnect with at least one of chemical mechanical planarization, an ammonia-free solution and a hydrofluoric acid-free solution, and(ii) electrolessly depositing an encapsulation layer on the cleaned and/or activate copper interconnect, wherein the encapsulation layer comprises at least one alloy selected from the group consisting of NiRePB, NiMoPB and NiWPB,to form an electrically conductive structure wherein the encapsulation layer is adjacent the copper interconnect. 18. The process of claim 17, wherein the alloy comprises at least one of Mo, Re and W in an amount of from 2 to 25 at-%. 19. The process according to claim 17, wherein the encapsulation layer comprises Mo in an amount of from 3 to 24 at-%. 20. The process according to claim 17, wherein the encapsulation layer comprises Re in an amount of from 2 to 23 at-%. 21. The process according to claim 17, wherein the encapsulation layer comprises W in an amount of from 5 to 15 at-%.