초록 ▼

Self-corrugating laminates useful in the manufacture of thermoelectric devices are disclosed. The laminates include an upper and a lower shrinkable film layer and a non-shrinkable core with a thermoelectric pattern formed thereon bonded between said upper and lower shrinkable film along bond lines a

Self-corrugating laminates useful in the manufacture of thermoelectric devices are disclosed. The laminates include an upper and a lower shrinkable film layer and a non-shrinkable core with a thermoelectric pattern formed thereon bonded between said upper and lower shrinkable film along bond lines arranged parallel, substantially parallel, radially, or annularly. The bond lines that bond the upper shrinkable film layer to top surface of the nonshrinkable core are staggered relative to the bond lines that bond the lower shrinkable film layer to the bottom surface of the non-shrinkable core such that upon shrinkage of the shrinkable film layers, structural corrugations are formed in the non-shrinkable core. Thermoelectric modules or devices and methods for forming them from the self-corrugating laminates are also described.

대표청구항 ▼

1. A self-corrugating laminate useful in the manufacture of thermoelectric devices said laminate comprising an upper and a lower shrinkable film layer each having an axis of shrinkage and a non-shrinkable core having a top surface and a bottom surface and bonded between said upper and lower shrinkab

1. A self-corrugating laminate useful in the manufacture of thermoelectric devices said laminate comprising an upper and a lower shrinkable film layer each having an axis of shrinkage and a non-shrinkable core having a top surface and a bottom surface and bonded between said upper and lower shrinkable film layers along bond lines, wherein the bond lines that bond the upper shrinkable film layer to said top surface of said non-shrinkable core are staggered relative to the bond lines that bond said lower shrinkable film layer to said bottom surface of said non-shrinkable core such that upon shrinkage of said shrinkable film layers, structural corrugations are formed in said non-shrinkable core, wherein at least a portion of the bond lines are arranged substantially perpendicular to an axis of shrinkage of the shrinkable film layer to which the bond lines are attached, andwherein said non-shrinkable core further includes a thermoelectric pattern on at least one surface thereof. 2. The self-corrugating laminate of claim 1 wherein said shrinkable film layers exhibit a percent shrinkage along said axis of shrinkage of from about 10 to about 45 percent. 3. The self-corrugating laminate of claim 1 wherein said nonshrinkable core comprises multiple layers of non-shrinkable film. 4. The self-corrugating laminate of claim 1 wherein said thermoelectric pattern comprises a series of adjacent alternating electrically conductive or semiconductive thermoelectric elements of differing electrical conductivity connected at junctions. 5. The self-corrugating laminate of claim 4 wherein said junctions include overlapping edges of said alternating elements. 6. The self-corrugating laminate of claim 4 wherein said junctions include conductive deposits. 7. The self-corrugating laminate of claim 1 wherein at least one of the shrinkable film layers further includes a thermally conductive layer. 8. A corrugated structure, useful as a thermoelectric device, formed from the self-corrugating laminate of claim 1. 9. A method for forming a thermoelectric device comprising (i) procuring a self-corrugating laminate, said according to claim 1; and(ii) subjecting said self-corrugating laminate to conditions sufficient to impart corrugation to said non-shrinkable core of said self-corrugating laminate. 10. The method of claim 9 wherein the subjecting step includes exposing said shrinkable film layers of said self-corrugating laminate to a temperature laminate to a temperature sufficient to cause shrinkage thereof. 11. The method of claim 10 wherein said temperature is above the shrinkage temperature of both of said shrinkable film layers. 12. The method of claim 11 does not exceed the softening temperature of the materials from which said non-shrinkable core is formed.