$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Free cooling solution for a containerized data center 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G05D-023/00
  • F25D-023/12
  • H05K-007/20
  • F28D-015/00
  • G05D-023/19
  • G06F-001/20
  • G05B-019/042
  • H01L-023/427
출원번호 US-0022302 (2013-09-10)
등록번호 US-9066451 (2015-06-23)
발명자 / 주소
  • Canney, Brian A.
  • Karrat, Wally
  • Lehman, Bret W.
  • Molloy, Christopher L.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Pivnichny, John R.
인용정보 피인용 횟수 : 0  인용 특허 : 56

초록

A heat exchanger system having a container having an inner chamber containing the media from which heat is to be pulled, and further having an outer surface to which is attached corrugated columns of thermally conducting material, cooling fluid conduits through the corrugated columns supplied with c

대표청구항

1. A heat exchanger system comprising: a container enclosing a data center, the container comprising: one or more cooling items of an outer surface of the container, each of the one or more cooling items including a plurality of fins, each of the plurality of fins comprising an exterior frame, confi

이 특허에 인용된 특허 (56)

  1. Pun,John Yenkai, Active fluid and air heat exchanger and method.
  2. Kang, Ming-Feng; Tsou, Yung-Hung, Air conditioning system of portable data center.
  3. Neumann, Matthew Daniel; Cerniglia, Sean Anthony, Airflow restrictor door.
  4. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Porter,Donald W.; Schmidt,Roger R.; Simons,Robert E., Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack.
  5. Ashiwake Noriyuki (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki JPX) Sasaki Shigeyuki (Ibaraki JPX) Ohsone Yasuo (Tsuchiura JPX) Hatada Toshio (Tsuchiura JPX) Iino Toshiki (Ibaraki JPX) Kasai Kenichi (, Apparatus for cooling semiconductor device and computer having the same.
  6. Chu, Richard C.; Ellsworth, Jr., Michael J.; Porter, Donald W.; Schmidt, Roger R.; Simons, Robert E., Apparatus for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack.
  7. Iyengar, Madhusudan K.; Schmidt, Roger R.; Welz, Howard P., Apparatus for facilitating cooling of an electronics rack through the use of an air-to-liquid heat exchanger.
  8. Hillis,W. Daniel; Duttweiler,Mark; Salter,Kenneth D.; Yates,Randall A., Balanced chilled fluid cooling system for a data center in a shipping container.
  9. Giacoma,Lawrence M.; Austin,David Michael; Calanni,Daniel J., Cabinet with an environmentally-sealed air-to-air heat exchanger.
  10. Hamburgen, William; Clidaras, Jimmy; Carlson, Andrew B., Changing data center cooling modes.
  11. Hamburgen, William; Clidaras, Jimmy; Carlson, Andrew B., Changing data center cooling modes.
  12. Clidaras, Jimmy; Hamburgen, William; Carlson, Andrew; Chow, Steven T. Y.; Leung, Winnie; Sykora, Montgomery; Beaty, Donald L., Computing environments.
  13. Coglitore, Giovanni; Seibold, Lawrence B.; Enos, Jason; Malone, Conor, Container-based data center.
  14. Tozer, Robert; Bash, Cullen; Patel, Chandrakant, Cooling.
  15. Hillis, W. Daniel; Ferren, Bran, Cooling air flow loop for a data center in a shipping container.
  16. Chandrakant D. Patel, Cooling arrangement for high performance electronic components.
  17. Carlson, Andrew B.; Clidaras, Jimmy; Hamburgen, William, Cooling diversity in data centers.
  18. Yates, Randall A.; Ferren, Bran; Hillis, W. Daniel; Howe, Russel; Lichtman, Ira M.; Salter, Kenneth D., Cooling method for a data center in a shipping container.
  19. Patel, Chandrakant D.; Obermaier, Hannsjorg; Barber, Vernon Alan, Cooling plate arrangement for electronic components.
  20. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K; Schmidt,Roger R.; Simons,Robert E., Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack.
  21. Miller David Jonathan,GBX ; Sams Ian James,GBX ; Holland Michael James,GBX ; Fields Simon David,GBX, Cooling system for use in cooling electronic equipment.
  22. Chang, Yao-Ting; Wei, Chao-Ke, Data center.
  23. Hellriegel, Stephen V. R.; Jaena, Mario L.; Koblenz, Brian D.; Anderson, David Louis; Driggers, David; Haddock, Jr., Hampton Walker, Data center.
  24. Salpeter, Isaac A., Data center with fin modules.
  25. Tozer, Robert; Bash, Cullen; Patel, Chandrakant, Data centers.
  26. Malone,Christopher G.; Simon,Glenn C., External liquid loop heat exchanger for an electronic system.
  27. Wong,Shwin Chung, Flat-plate heat pipe containing channels.
  28. Canney, Brian A.; Karrat, Wally; Lehman, Bret W.; Molloy, Christopher L., Free cooling solution for a containerized data center.
  29. Chu Richard C. (Poughkeepsie NY) Gupta Omkarnath R. (Poughkeepsie NY) Hwang Un-Pah (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Gas encapsulated cooling module.
  30. Long, Maolin, Gas temperature control for a plasma process.
  31. Scanlan Harry J. (3 Cedar Pl. Garden City NY 11530) Liljegren Leif (550 Ramapo Valley Rd. Oakland NJ 07436), Heat exchanger.
  32. Steffen James E. (Woodbury MN) Grannis Vaughn B. (Inver Grove Heights MN) Schroder Frank S. (Afton MN), Heat exchanger.
  33. Brunner,Richard A., Heat recovery system for clothes dryer.
  34. Cray ; Jr. Seymour R. (Chippewa Falls WI), Immersion cooled high density electronic assembly.
  35. Monk, Brian; Meldrum, Iiye, Integrated computer equipment container and cooling unit.
  36. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Integrated heat sink system for a closed electronics container.
  37. Bartilson Bradley W., Large area, multi-device heat pipe for stacked MCM-based systems.
  38. Rohner, Thomas G., Mechanical cooler for electronics.
  39. Schmitt, Ty; Riegler, Robert, Method for configuring information handling systems and infrastructure equipment in plural containers.
  40. Clidaras, Jimmy; Whitted, William; Hamburgen, William; Sykora, Montgomery; Leung, Winnie; Aigner, Gerald; Beaty, Donald L., Modular computing environments.
  41. Salpeter, Isaac A., Modular system for outdoor data center.
  42. Gauthier, David Thomas; Seaton, Scott Thomas; Wenzel, Allan Joseph; Cheng, Cheerei; Andersen, Brian Clark; Costello, Daniel Gerard; Belady, Christian L.; Housley, Jens Conrad; Mattson, Brian Jon; Gilges, Stephan W.; Lundgren, Kenneth Allen, Modularization of data center functions.
  43. Ouyang, Chien; Gross, Kenneth C., Multichannel cooling system with magnetohydrodynamic pump.
  44. Frey ; Jr. Sydney W. (Brookfield WI) Herson Mark I. (South Milwaukee WI), Natural convection cooling system for electronic components.
  45. Frieser Rudolf G. (Poughkeepsie NY) Reeber Morton D. (Shrub Oak NY), Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant.
  46. Hillis, W. Daniel, Operation ready transportable data center in a shipping container.
  47. Hillis, W. Daniel, Operation ready transportable data center in a shipping container.
  48. Facusse, Mario; Kosch, David Scott, Passive cooling enclosure system and method for electronics devices.
  49. Rembach, Paul F., Rapid deployment mobile data center.
  50. Yates, Randall A.; Ferren, Bran; Hillis, W. Daniel; Khanlian, Luke W.; Salter, Kenneth D., Server rack service utilities for a data center in a shipping container.
  51. Keisling, Earl; Costakis, John; McDonnell, Gerald, Space-saving high-density modular data pod systems and energy-efficient cooling systems.
  52. Keisling, Earl; Costakis, John; McDonnell, Gerald, Space-saving high-density modular data pod systems and energy-efficient cooling systems.
  53. Fred Guerrero, Stackable heat sink for electronic components.
  54. Finamore,Peter, Storage container associated with a thermal energy management system.
  55. Whitted, William H., Systems and methods for close coupled cooling.
  56. Porter, Donald W.; Schmidt, Roger R.; Takayoshi, Jyunji; Tsukamoto, Takeshi; Yamada, Yasuharu, Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로