초록 ▼

An electronic substrate includes: an electronic element provided on a first face of a semiconductor substrate having a through hole; a passive element provided on a second face of the semiconductor substrate; a first part of an interconnection pattern provided on the second face of the semiconductor

An electronic substrate includes: an electronic element provided on a first face of a semiconductor substrate having a through hole; a passive element provided on a second face of the semiconductor substrate; a first part of an interconnection pattern provided on the second face of the semiconductor substrate; an insulating layer provided on the second face of the semiconductor substrate; and a second part of the interconnection pattern provided on the insulating layer.

대표청구항 ▼

1. An electronic substrate comprising: an electronic element provided at a first face side of a semiconductor substrate having a through hole the through hole having an inner wall;a passive element provided at a second face side of the semiconductor substrate;a first part of an interconnection patte

1. An electronic substrate comprising: an electronic element provided at a first face side of a semiconductor substrate having a through hole the through hole having an inner wall;a passive element provided at a second face side of the semiconductor substrate;a first part of an interconnection pattern provided at the second face side of the semiconductor substrate;a first insulating layer provided on a surface of the first face side of the semiconductor substrate;another insulating layer provided on a surface of the second face side of the semiconductor substrate;a second part of the interconnection pattern provided on the another insulating layer; andan insulating film provided on the inner wall of the through hole. 2. An electronic substrate according to claim 1, wherein the electronic element is formed from a semiconductor element integrated with the semiconductor substrate. 3. An electronic substrate according to claim 1, further comprising: an electrode provided at the first face side; anda penetrative conductive portion formed in the inner wall the semiconductor substrate and connecting the electrode to the passive element. 4. An electronic substrate according to claim 1, wherein the passive element is formed from the first part and the second part of the interconnection pattern. 5. An electronic substrate comprising: an electronic element provided at a first face side of a semiconductor substrate having a through hole, the through hole having an inner wall;a first part of an interconnection pattern provided at a second face side of the semiconductor substrate;a first insulating layer provided on a surface of the first face side of the semiconductor substrate;another insulating layer provided on a surface of the second face side of the semiconductor substrate;a passive element provided on the another insulating layer;a second part of the interconnection pattern provided on the another insulating layer; andan insulating film provided on the inner wall of the through hole. 6. An electronic substrate according to claim 5, wherein the electronic element is formed from a semiconductor element integrated with the semiconductor substrate. 7. An electronic substrate according to claim 1, further comprising: an electrode provided at the first face side; anda penetrative conductive portion formed in the inner wall the semiconductor substrate and connecting the electrode to the passive element. 8. An electronic substrate according to claim 1, wherein the passive element is formed from the first part and the second part of the interconnection pattern. 9. An electronic device comprising the electronic substrate according to claim 1. 10. An electronic device comprising the electronic substrate according to claim 5.