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Top cover of a load lock chamber 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • 15-09
출원번호 US-0468197 (2013-09-27)
등록번호 US-D734377 (2015-07-14)
우선권정보 JP-2013-007035 (2013-03-28); JP-2013-007036 (2013-03-28)
발명자 / 주소
  • Hirakida, Junichi
출원인 / 주소
  • HIRATA CORPORATION
대리인 / 주소
    Buchanan Ingersoll & Rooney PC
인용정보 피인용 횟수 : 48  인용 특허 : 30

초록

초록이 없습니다.

대표청구항

The ornamental design for a top cover for a load lock chamber, as shown and described.

이 특허에 인용된 특허 (30)

  1. Oohashi,Kaoru; Mizukami,Shunsuke; Ueda,Takehiro, Absorption board for an electric chuck used in semiconductor manufacture.
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  2. Davis, Jeffry Alan; Purnomohadi, Andro Ardiano; Potter, Daniel Thomas, Apparatus and method for loading of carriers containing semiconductor wafers and other media.
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  3. Hayashi,Daisuke, Attracting disc for an electrostatic chuck for semiconductor production.
    상세보기
  4. Hayashi,Daisuke, Attracting disc for an electrostatic chuck for semiconductor production.
    상세보기
  5. Sasaki,Yasuharu, Attracting plate of an electrostatic chuck for semiconductor manufacturing.
    상세보기
  6. Matye Reinhard, Automated hatch.
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  7. Fukasawa Kazuo (Nirasaki JPX), Electrode for a semiconductor processing apparatus.
    상세보기
  8. Nagakubo, Keiichi, Electrode member for a plasma processing apparatus.
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  9. Meuschke Robert E. (Penn Hills PA) Sherwood Donald G. (Monroeville PA) Silverblatt Bernard L. (Pittsburgh PA), Fuel transfer tube quick opening hatch.
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  10. Imafuku Kosuke,JPX ; Endo Shosuke,JPX ; Fukasawa Kazuo,JPX, Gas diffusion plate for electrode of semiconductor wafer processing apparatus.
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  11. Bergin Paul F. (58471 Fir Rd. ; South Mishawaka IN 46544), Hatch cover.
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  12. Miller Roy W. (Highland IN), Hatch cover assembly.
    상세보기
  13. Kleykamp Donald L. (Washington Township ; Montgomery County OH), Hatch cover for hopper cars.
    상세보기
  14. Collier Lyn D. (7310 Woodland West Dr. Houston TX 77040) Stark Marvin (727 Wax Myrtle Houston TX 77079), Hatch cover locking mechanism.
    상세보기
  15. Nakano, Hitoshi, Load-lock chamber and exposure apparatus using the same.
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  16. Wallace,Jay; Hamelin,Thomas, Method and apparatus for thermally insulating adjacent temperature controlled processing chambers.
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  17. David Robert C., Multi-directional vent hatch.
    상세보기
  18. Binnard, Mike; Watson, Douglas C., Multiple chamber fluid mount.
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  19. Yielding Bryan A., Pivoting hatch cover assembly.
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  20. Ishii Katsutoshi,JPX, Ring for use in a semiconductor wafer heat processing apparatus.
    상세보기
  21. Lee, Jeong Ho; Jeong, Sang Jin; Jung, Dong Rak, Substrate support for a semiconductor deposition apparatus.
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  22. Choi, Seung Woo; Noh, Hyung Wook; Woo, Jeong Jun; Kim, Dae Youn; Jang, Hyun Soo, Substrate supporter for semiconductor deposition apparatus.
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  23. Jang, Hyun Soo; Kim, Dae Youn; Lee, Jeong Ho; Lee, Seung Seob; Kwon, Hak Yong, Substrate supporter for semiconductor deposition apparatus.
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  24. Makino,Akitaka; Takahashi,Youji; Soraoka,Minoru; Kihara,Hideki; Tauchi,Susumu, Vacuum processing apparatus.
    상세보기
  25. Anderson John D. ; Peach ; Jr. Walter J., Vent-on-demand hatch cover.
    상세보기
  26. Bramlett Kevin D. ; DiLuigi Michael W., Vented hatch cover.
    상세보기
  27. Burke Michael K. ; Anderson John D. ; Peach ; Jr. Walter J., Vented hatch cover.
    상세보기
  28. Early Stephen R., Vented hatch cover.
    상세보기
  29. Schultz Francis R. (Woodridge IL), Vented hatch cover.
    상세보기
  30. Kujawa ; Jr. ; Anthony ; Kujawa ; Frank J., Ventilator hatch assembly.
    상세보기

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  1. Ootsuka, Fumio, 3D stacked multilayer semiconductor memory using doped select transistor channel.
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  2. Oosterlaken, Theodorus; de Ridder, Chris; Jdira, Lucian, Apparatus and method for manufacturing a semiconductor device.
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  3. Kamiya, Tatsuo, Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum.
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  4. den Hartog Besselink, Edwin; Garssen, Adriaan; Dirkmaat, Marco, Cassette holder assembly for a substrate cassette and holding member for use in such assembly.
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  5. Zaitsu, Masaru; Fukazawa, Atsuki; Fukuda, Hideaki, Continuous process incorporating atomic layer etching.
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  6. Raisanen, Petri; Shero, Eric; Haukka, Suvi; Milligan, Robert Brennan; Givens, Michael Eugene, Deposition of metal borides.
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  7. Zhu, Chiyu; Shrestha, Kiran; Haukka, Suvi, Deposition of metal borides.
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  8. Milligan, Robert Brennan, Formation of boron-doped titanium metal films with high work function.
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  9. Jang, Hyun Soo; Lee, Jeong Ho; Kim, Young Hoon; Jeon, Young Hyo, Gas dispersing plate for semiconductor manufacturing apparatus.
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  10. Jang, Hyun Soo; Lee, Jeong Ho; Kim, Young Hoon; Jeon, Young Hyo, Gas flow control plate for semiconductor manufacturing apparatus.
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  11. Tauchi, Susumu; Uemura, Takashi; Sato, Kohei, Lower chamber for a plasma processing apparatus.
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  12. Pore, Viljami, Method and apparatus for filling a gap.
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  13. Pore, Viljami; Knaepen, Werner; Jongbloed, Bert; Pierreux, Dieter; Van Aerde, Steven R. A.; Haukka, Suvi; Fukuzawa, Atsuki; Fukuda, Hideaki, Method and apparatus for filling a gap.
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  14. Pore, Viljami; Knaepen, Werner; Jongbloed, Bert; Pierreux, Dieter; Van Der Star, Gido; Suzuki, Toshiya, Method and apparatus for filling a gap.
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  15. Suemori, Hidemi, Method for depositing dielectric film in trenches by PEALD.
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  16. Kang, DongSeok, Method for depositing thin film.
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  17. Takamure, Noboru; Okabe, Tatsuhiro, Method for forming Ti-containing film by PEALD using TDMAT or TDEAT.
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  18. Shiba, Eiichiro, Method for forming aluminum nitride-based film by PEALD.
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  19. Fukazawa, Atsuki, Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition.
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  20. Fukazawa, Atsuki; Fukuda, Hideaki; Takamure, Noboru; Zaitsu, Masaru, Method for forming dielectric film in trenches by PEALD using H-containing gas.
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  21. Kimura, Yosuke; de Roest, David, Method for forming film having low resistance and shallow junction depth.
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  22. Ishikawa, Dai; Fukazawa, Atsuki, Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches.
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  25. Yamagishi, Takayuki; Suwada, Masaei; Tanaka, Hiroyuki, Method for positioning wafers in multiple wafer transport.
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  26. Kato, Richika; Nakano, Ryu, Method for protecting layer by forming hydrocarbon-based extremely thin film.
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  27. Kato, Richika; Okuro, Seiji; Namba, Kunitoshi; Nonaka, Yuya; Nakano, Akinori, Method for protecting layer by forming hydrocarbon-based extremely thin film.
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  28. Zaitsu, Masaru, Method of atomic layer etching using functional group-containing fluorocarbon.
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  29. Zaitsu, Masaru; Kobayashi, Nobuyoshi; Kobayashi, Akiko; Hori, Masaru; Kondo, Hiroki; Tsutsumi, Takayoshi, Method of cyclic dry etching using etchant film.
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  30. Knaepen, Werner; Maes, Jan Willem; Jongbloed, Bert; Kachel, Krzysztof Kamil; Pierreux, Dieter; De Roest, David Kurt, Method of forming a structure on a substrate.
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  31. Lee, Choong Man; Yoo, Yong Min; Kim, Young Jae; Chun, Seung Ju; Kim, Sun Ja, Method of forming metal interconnection and method of fabricating semiconductor apparatus using the method.
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  32. Chun, Seung Ju; Yoo, Yong Min; Choi, Jong Wan; Kim, Young Jae; Kim, Sun Ja; Lim, Wan Gyu; Min, Yoon Ki; Lee, Hae Jin; Yoo, Tae Hee, Method of processing a substrate and a device manufactured by using the method.
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  33. Kohen, David; Profijt, Harald Benjamin, Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures.
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  34. Raisanen, Petri; Givens, Michael Eugene, Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures.
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  35. Zhu, Chiyu; Asikainen, Timo; Milligan, Robert Brennan, NbMC layers.
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  36. Jang, Hyun Soo; Lee, Jeong Ho; Kim, Young Hoon, Outer wall of reactor for semiconductor manufacturing apparatus.
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  37. Margetis, Joe; Tolle, John; Bartlett, Gregory; Bhargava, Nupur, Process for forming a film on a substrate using multi-port injection assemblies.
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  38. Alokozai, Fred; Milligan, Robert Brennan, Process gas management for an inductively-coupled plasma deposition reactor.
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  39. Nabeya, Osamu; Yasuda, Hozumi; Fukushima, Makoto; Namiki, Keisuke; Togashi, Shingo; Yamaki, Satoru, Retainer ring for substrate.
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  40. Zhu, Chiyu, Selective film deposition method to form air gaps.
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  41. Kim, Young Jae; Choi, Seung Woo; Yoo, Yong Min, Semiconductor device and manufacturing method thereof.
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  42. Arai, Izumi, Single-and dual-chamber module-attachable wafer-handling chamber.
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  43. Xie, Qi; de Roest, David; Woodruff, Jacob; Givens, Michael Eugene; Maes, Jan Willem; Blanquart, Timothee, Source/drain performance through conformal solid state doping.
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  44. Tolle, John, Structures and devices including germanium-tin films and methods of forming same.
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  45. Fukushima, Makoto; Yasuda, Hozumi; Namiki, Keisuke; Nabeya, Osamu; Togashi, Shingo; Yamaki, Satoru, Substrate retaining ring.
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  46. Fukushima, Makoto; Yasuda, Hozumi; Namiki, Keisuke; Nabeya, Osamu; Togashi, Shingo; Yamaki, Satoru, Substrate retaining ring.
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  47. Jeong, Sang Jin; Han, Jeung Hoon; Choi, Young Seok; Park, Ju Hyuk, Susceptor for semiconductor substrate processing apparatus.
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  48. Yamagishi, Takayuki; Sato, Kazuo; Tsuji, Naoto, Top plate.
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