A relief printing form is prepared from a photosensitive element. An in-situ mask is formed and disposed above a photopolymerizable layer of the photosensitive element, the element is exposed to actinic radiation through the in-situ mask in an environment having an inert gas and a concentration of o
A relief printing form is prepared from a photosensitive element. An in-situ mask is formed and disposed above a photopolymerizable layer of the photosensitive element, the element is exposed to actinic radiation through the in-situ mask in an environment having an inert gas and a concentration of oxygen between about 30,000 ppm and about 7500 ppm to form at least a polymerized portion and an unpolymerized portion of the layer, and the exposed element is processed by treating with at least one washout solution selected from solvent solution, aqueous solution, semi-aqueous solution, or water.
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1. A method for preparing a relief printing form from a photosensitive element, comprising the steps of: (a) forming an in-situ mask disposed above a layer of a photopolymerizable composition in the photosensitive element, wherein the photopolymerizable composition comprises a binder, an ethylenical
1. A method for preparing a relief printing form from a photosensitive element, comprising the steps of: (a) forming an in-situ mask disposed above a layer of a photopolymerizable composition in the photosensitive element, wherein the photopolymerizable composition comprises a binder, an ethylenically unsaturated compound and a photoinitiator;(b) exposing the photopolymerizable layer to actinic radiation through the mask in an environment having an inert gas and a concentration of oxygen between 30,000 ppm and 7500 ppm, forming at least a polymerized portion and at least an unpolymerized portion; and,(c) treating by processing the element of step b) with at least one washout solution selected from organic solvent solution, aqueous solution, semi-aqueous solution, or water, whereby the unpolymerized portion is removed by the washout solution leaving a relief printing form having a plurality of raised surface elements made of the polymerized portion, with each raised surface element having a print surface area, and wherein the in-situ mask includes actinic radiation opaque areas and open areas, and in one or more of the open areas that produce image areas comprising halftone dot image areas and in one or more of the open areas that produce image areas comprising solid image areas, comprises a microcell pattern comprising a plurality of features in which each feature has dimension between 5 and 30 microns that is opaque to actinic radiation, andwherein after the removing step, the print surface area of one or more of the raised surface elements that form halftone dot image areas have the microcell pattern induced therein, and the print surface area of one or more of the raised surface elements that form the solid image areas have the microcell pattern induced therein. 2. The method of claim 1 wherein the washout solution is an organic solvent solution. 3. The method of claim 1 wherein the inert gas is selected from the group consisting of argon, helium, neon, krypton, xenon, nitrogen, carbon dioxide, and combinations thereof. 4. The method of claim 1 wherein a layer of an actinic radiation opaque material is disposed above the photopolymerizable layer, and step a) comprises imagewise exposing the actinic radiation opaque layer with laser radiation to form the in-situ mask. 5. The method of claim 4 wherein the imagewise exposing with laser radiation is selected from the group consisting of (a) selectively ablating the actinic radiation opaque layer from the photopolymerizable layer, and (b) selectively transferring portions of the actinic radiation opaque layer to the photopolymerizable layer. 6. The method of claim 1 further comprising, prior to step b), placing the photosensitive element in a chamber for the environment. 7. The method of claim 6 wherein the step of exposing the photopolymerizable layer begins when the concentration of oxygen in the chamber is between 30,000 ppm and 7500 ppm. 8. The method of claim 6 wherein the step of exposing the photopolymerizable layer begins when the concentration of oxygen in the chamber is less than or equal to 30,000 ppm and the concentration of oxygen is reduced during the exposing by introducing the inert gas into the chamber. 9. The method of claim 6 wherein the step of exposing the photopolymerizable layer begins when the concentration of oxygen in the chamber is between 30,000 ppm and 7500 ppm and the concentration of oxygen is maintained for the exposing by introducing the inert gas and oxygen into the chamber. 10. The method of claim 6 wherein the step of exposing the photopolymerizable layer occurs for a total exposure time, and during said exposure the concentration of oxygen is a weighted average of the oxygen concentration based on the percentage of time at a particular oxygen concentration. 11. The method of claim 1 wherein the environment comprises nitrogen as the inert gas and the concentration of oxygen is 30,000 ppm to 7500 ppm. 12. The method of claim 1 wherein the environment comprises nitrogen as the inert gas and the concentration of oxygen is 25,000 ppm to 7500 ppm. 13. The method of claim 1 wherein the environment comprises nitrogen as the inert gas and the concentration of oxygen is 20,000 ppm to 7500 ppm. 14. The method of claim 1 wherein after step c) the element is a relief printing form having a pattern of printing areas, and the method further comprises: d) securing the printing form onto or adjacent a print cylinder;e) applying an ink to the printing areas of the printing form; andf) contacting the ink from the printing areas to a substrate, thereby transferring the pattern of ink onto the substrate. 15. The method of claim 14, wherein the ink is a solvent ink and the substrate is a polymeric film.
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