A display panel and a sealing process are provided. The display panel has a display area and a non-display area; the sealing process includes following steps. A first substrate having a pixel array in the display area is provided. An absorption material layer is formed in the non-display area of the
A display panel and a sealing process are provided. The display panel has a display area and a non-display area; the sealing process includes following steps. A first substrate having a pixel array in the display area is provided. An absorption material layer is formed in the non-display area of the first substrate. A second substrate having a sealing material layer in the non-display area is provided. The second substrate and the first substrate are assembled, and a display medium is formed therebetween. The absorption material layer and the sealing material layer at least partially overlap. A laser processing process is performed on the sealing material layer, so that the first substrate is adhered to the second substrate by the sealing material layer. The absorption material layer is adopted for absorbing a portion of a laser beam passing through the sealing material layer in the laser processing process.
대표청구항▼
1. A sealing method of a display panel, the display panel having a display area and a non-display area surrounding the display area, the sealing method comprising: providing a first substrate, the first substrate having a pixel array in the display area;forming an absorption material layer on the fi
1. A sealing method of a display panel, the display panel having a display area and a non-display area surrounding the display area, the sealing method comprising: providing a first substrate, the first substrate having a pixel array in the display area;forming an absorption material layer on the first substrate in the non-display area, wherein the absorption material layer is a single layer, and the absorption material layer comprises metal silicide;providing a second substrate, the second substrate having a sealing material layer in the non-display area;assembling the second substrate and the first substrate and forming a display medium between the first substrate and the second substrate, wherein the absorption material layer and the sealing material layer at least partially overlap; andperforming a laser processing process on the sealing material layer of the second substrate, such that the first substrate and the second substrate are adhered by the sealing material layer, wherein the absorption material layer is adopted for absorbing a portion of a laser beam passing through the sealing material layer in the laser processing process. 2. The sealing method as recited in claim 1, wherein the step of providing the first substrate comprises forming a plurality of lead lines in the non-display area, and the step of forming an absorption material layer comprises at least forming the absorption material layer in a lead line region of the first substrate, the lead line region is where the leads lines are located in the non-display area, and the absorption material layer at least covers the lead lines. 3. The sealing method as recited in claim 2, wherein the step of assembling the second substrate and the first substrate comprises overlapping the absorption material layer and the sealing material layer partially in a vertical projection direction. 4. The sealing method as recited in claim 1, wherein the step of assembling the second substrate and the first substrate comprises overlapping the absorption material layer and the sealing material layer completely in a vertical projection direction. 5. The sealing method as recited in claim 1, wherein a wavelength of the laser beam in the laser processing process ranges from about 800 nm to about 1100 nm. 6. The sealing method as recited in claim 5, wherein the wavelength of the laser beam in the laser processing process is about 808 nm, an absorption coefficient of the absorption material layer ranges from about 1.84E+5 cm−1 to about 1.03E+6 cm−1, and a thickness of the absorption material layer ranges from about 0.02 μm to about 0.21 μm. 7. The sealing method as recited in claim 5, wherein the wavelength of the laser beam in the laser processing process is about 940 nm, an absorption coefficient of the absorption material layer ranges from about 1.38E+5 cm−1 to about 6.09E+5 cm−1, and a thickness of the absorption material layer ranges from about 0.04 μm to about 0.28 μm. 8. The sealing method as recited in claim 1, wherein the sealing material layer comprises glass frit. 9. A display panel having a display area and a non-display area surrounding the display area, the display panel comprising: a first substrate comprising a pixel array and an absorption material layer, the pixel array being located in the display area, the absorption material layer being located in the non-display area, wherein the absorption material layer is a single layer and the absorption material layer comprises metal silicide;a second substrate comprising a sealing material layer in the non-display area, wherein the absorption material layer and the sealing material layer at least partially overlap in a vertical projection direction; anda display medium located between the first substrate and the second substrate. 10. The display panel as recited in claim 9, wherein the first substrate further comprises a plurality of lead lines in the non-display area, and the absorption material layer at least covers the lead lines. 11. The display panel as recited in claim 9, wherein the absorption material layer and the sealing material layer completely overlap in the vertical projection direction. 12. The display panel as recited in claim 9, wherein the absorption material layer is made of a material absorbing a laser beam, an absorption coefficient of the absorption material layer ranges from about 1.84E+5 cm−1 to about 1.03E+6 cm−1, and a thickness of the absorption material layer ranges from about 0.02 μm to about 0.21 μM. 13. The display panel as recited in claim 9, wherein the absorption material layer is made of a material absorbing a laser beam, an absorption coefficient of the absorption material layer ranges from about 1.38E+5 cm−1 to about 6.09E+5 cm−1, and a thickness of the absorption material layer ranges from about 0.04 μm to about 0.28 μm. 14. The display panel as recited in claim 9, wherein the sealing material layer comprises glass frit. 15. The display panel as recited in claim 9, wherein the absorption material layer is made of a material absorbing a laser beam, an absorption coefficient of the absorption material layer ranges from about 1.09E+4 cm−1 to about 3.72E+4 cm−1, and a thickness of the absorption material layer ranges from about 0.62 μm to about 3.59 μm. 16. A sealing method of a display panel, the display panel having a display area and a non-display area surrounding the display area, the sealing method comprising: providing a first substrate, the first substrate having a pixel array in the display area;forming an absorption material layer on the first substrate in the non-display area, wherein the absorption material layer is a single layer, and the absorption material layer comprises a group IIIA-VA compound;providing a second substrate, the second substrate having a sealing material layer in the non-display area;assembling the second substrate and the first substrate and forming a display medium between the first substrate and the second substrate, wherein the absorption material layer and the sealing material layer at least partially overlap; andperforming a laser processing process on the sealing material layer of the second substrate, such that the first substrate and the second substrate are adhered by the sealing material layer, wherein the absorption material layer is adopted for absorbing a portion of a laser beam passing through the sealing material layer in the laser processing process. 17. The sealing method as recited in claim 16, wherein the wavelength of the laser beam in the laser processing process is about 808 nm, an absorption coefficient of the absorption material layer ranges from about 1.34E+4 cm−1 to about 1.06E+5 cm−1, and a thickness of the absorption material layer ranges from about 0.22 μm to about 2.91 μm. 18. The sealing method as recited in claim 16, wherein the wavelength of the laser beam in the laser processing process is about 940 nm, an absorption coefficient of the absorption material layer ranges from about 1.09E+4 cm−1 to about 3.72E+4 cm−1, and a thickness of the absorption material layer ranges from about 0.62 μm to about 3.59 μm. 19. A display panel having a display area and a non-display area surrounding the display area, the display panel comprising: a first substrate comprising a pixel array and an absorption material layer, the pixel array being located in the display area, the absorption material layer being located in the non-display area, wherein the absorption material layer is a single layer and the absorption material layer comprises a group IIIA-VA compound;a second substrate comprising a sealing material layer in the non-display area, wherein the absorption material layer and the sealing material layer at least partially overlap in a vertical projection direction; anda display medium located between the first substrate and the second substrate. 20. The display panel as recited in claim 19, wherein the first substrate further comprises a plurality of lead lines in the non-display area, and the absorption material layer at least covers the lead lines. 21. The display panel as recited in claim 19, wherein the absorption material layer and the sealing material layer completely overlap in the vertical projection direction. 22. The display panel as recited in claim 19, wherein the absorption material layer is made of a material absorbing a laser beam, an absorption coefficient of the absorption material layer ranges from about 1.34E+4 cm−1 to about 1.06E+5 cm−1, and a thickness of the absorption material layer ranges from about 0.22 μm to about 2.91 μm. 23. The display panel as recited in claim 19, wherein the sealing material layer comprises glass frit.
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이 특허에 인용된 특허 (7)
Aitken, Bruce G.; Carberry, Joel P.; DeMartino, Steven E.; Hagy, Henry E.; Lamberson, Lisa A.; Miller, II, Richard J.; Morena, Robert; Schroeder, III, Joseph F.; Streltsov, Alexander; Widjaja, Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
Aitken, Bruce G.; Carberry, Joel P.; DeMartino, Steven E.; Hagy, Henry E.; Lamberson, Lisa A.; Miller, II, Richard J.; Morena, Robert; Schroeder, III, Joseph F.; Streltsov, Alexander; Widjaja, Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
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