IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0296891
(2014-06-05)
|
등록번호 |
US-9123605
(2015-09-01)
|
우선권정보 |
JP-2013-123852 (2013-06-12) |
발명자
/ 주소 |
- Iguchi, Yasuhiro
- Inada, Hiroshi
- Migita, Masaki
|
출원인 / 주소 |
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
|
대리인 / 주소 |
Smith, Gambrell & Russell LLP.
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
3 |
초록
▼
An image sensor includes a package having a window; a sensor chip facing the window, the sensor chip having a pixel region, the sensor chip having an electrode; a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit having a read-out electrode connected to the
An image sensor includes a package having a window; a sensor chip facing the window, the sensor chip having a pixel region, the sensor chip having an electrode; a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit having a read-out electrode connected to the electrode of the sensor chip; and a shielding plate disposed outside the pixel region of the sensor chip. The shielding plate is configured to block transmission of light.
대표청구항
▼
1. An image sensor comprising: a package having a window;a sensor chip facing the window, the sensor chip having a pixel region;a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit being electrically connected to the sensor chip; anda shielding plate dispose
1. An image sensor comprising: a package having a window;a sensor chip facing the window, the sensor chip having a pixel region;a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit being electrically connected to the sensor chip; anda shielding plate disposed outside the pixel region of the sensor chip, whereinthe shielding plate is configured to block transmission of light, andthe shielding plate is inclined to be closer to a bottom of the package with increasing distance from the sensor chip, the bottom of the package being located at the opposite side of the window. 2. The image sensor according to claim 1, wherein the shielding plate extends to outside of the read-out circuit in plan view. 3. The image sensor according to claim 1, wherein the shielding plate is secured to an edge of the sensor chip. 4. The image sensor according to claim 1, further comprising a relay board disposed under the read-out circuit, wherein the read-out circuit includes a pad electrode at an area extending from the sensor chip,the relay board includes an interconnection electrode at an area extending from the sensor chip, andthe shielding plate is secured to an edge of the read-out circuit or an edge of the relay board. 5. The image sensor according to claim 1, wherein the shielding plate is made of aluminum nitride. 6. The image sensor according to claim 1, further comprising: bumps electrically connecting the sensor chip to the read-out circuit, andan underfill resin filling spaces between the bumps, whereinthe shielding plate is secured by means of a resin serving as a fixing agent, andthe resin is made of the same material as that of the underfill resin. 7. An image sensor comprising: a package having a window;a sensor chip facing the window, the sensor chip having a pixel region;a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit being electrically connected to the sensor chip; anda shielding plate disposed outside the pixel region of the sensor chip, whereinthe shielding plate is configured to block transmission of light, andthe shielding plate is secured to an edge of the sensor chip. 8. The image sensor according to claim 7, wherein the shielding plate extends to outside of the read-out circuit in plan view. 9. The image sensor according to claim 7, wherein the shielding plate is inclined to reflect light entering through the window in a direction away from the sensor chip. 10. The image sensor according to claim 7, wherein the shielding plate is inclined to be closer to a bottom of the package with increasing distance from the sensor chip, the bottom of the package being located at the opposite side of the window. 11. The image sensor according to claim 7, further comprising a relay board disposed under the read-out circuit, wherein the read-out circuit includes a pad electrode at an area extending from the sensor chip,the relay board includes an interconnection electrode at an area extending from the sensor chip, andthe shielding plate is secured to an edge of the read-out circuit or an edge of the relay board. 12. The image sensor according to claim 7, wherein the shielding plate is made of aluminum nitride. 13. The image sensor according to claim 7, further comprising: bumps electrically connecting the sensor chip to the read-out circuit, andan underfill resin filling spaces between the bumps, whereinthe shielding plate is secured by means of a resin serving as a fixing agent, andthe resin is made of the same material as that of the underfill resin.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.