A brazing method is disclosed. The brazing method includes providing a substrate, providing at least one groove in the substrate, providing a support member, positioning the support member over the at least one groove in the substrate, providing a braze material, applying the braze material over the
A brazing method is disclosed. The brazing method includes providing a substrate, providing at least one groove in the substrate, providing a support member, positioning the support member over the at least one groove in the substrate, providing a braze material, applying the braze material over the support member to form an assembly, and heating the assembly to braze the braze material to the substrate. Another brazing method includes providing a preform, providing a wire mesh, pressing the wire mesh into the preform, heating the preform to form a braze material including the wire mesh, providing a substrate, providing at least one groove in the substrate, applying the braze material over the at least one groove in the substrate, then brazing the braze material to the substrate.
대표청구항▼
1. A brazing method, comprising: providing a substrate having at least one groove;providing a support member;positioning the support member over the at least one groove in the substrate;providing a braze material, the braze material including a preform comprising a high-melting alloy, a low-melting
1. A brazing method, comprising: providing a substrate having at least one groove;providing a support member;positioning the support member over the at least one groove in the substrate;providing a braze material, the braze material including a preform comprising a high-melting alloy, a low-melting alloy, and a binder;applying the preform over the support member, the braze material and the support member forming a first braze assembly; andheating the first braze assembly to braze the first braze assembly to the substrate;wherein heating the first braze assembly sinters the preform and brazes the first braze assembly to the substrate. 2. The brazing method of claim 1, comprising maintaining the braze material above the at least one groove without the braze material entering the groove and forming a convex border. 3. The brazing method of claim 1, further comprising the steps of: providing a second substrate; andpositioning the second substrate over the first braze assembly so that the first braze assembly is intermediate the substrate having the at least one groove and the second substrate;wherein the heating step brazes the second substrate to the substrate having the at least one groove. 4. The brazing method of claim 1, wherein each of the at least one grooves forms a cooling microchannel with unimpeded flow between the substrate and the braze assembly. 5. The brazing method of claim 1, wherein the braze material comprises a nickel-based braze alloy. 6. The brazing method of claim 1, wherein the braze material includes a coefficient of thermal expansion compatible with the coefficient of thermal expansion of the substrate. 7. The brazing method of claim 1, wherein the support member is a wire. 8. The brazing method of claim 1, wherein the support member is a mesh. 9. The brazing method of claim 1, wherein the brazing comprises vacuum brazing. 10. The brazing method of claim 1, wherein the brazing comprises atmospheric brazing. 11. The brazing method of claim 1, wherein the substrate comprises a nickel-based alloy. 12. The brazing method of claim 1, wherein the substrate comprises a cobalt-based alloy.
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이 특허에 인용된 특허 (14)
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