[미국특허]
Anti-extrusion compositions for sealing and wear components
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C08G-008/28
C08K-005/053
C09K-003/10
C08L-065/02
C08L-071/12
C08L-075/02
C08L-075/04
C08L-077/10
C08L-079/04
C08L-079/08
C08L-081/06
C08G-073/14
C08G-073/18
C08G-061/12
C08L-065/00
출원번호
US-0165497
(2014-01-27)
등록번호
US-9127138
(2015-09-08)
발명자
/ 주소
Drake, Kerry A.
Burke, Charles P.
Campbell, Ronald R.
Burgoyne, William F.
Bekisli, Burak
출원인 / 주소
Delsper LP
대리인 / 주소
Flaster/Greenberg P.C.
인용정보
피인용 횟수 :
0인용 특허 :
42
초록▼
A method and compositions are described which improve extrusion- and creep-resistance of components for use in a high temperature applications including sealing elements and seal connectors among others. The method includes providing a composition having an aromatic polymer and a crosslinking compou
A method and compositions are described which improve extrusion- and creep-resistance of components for use in a high temperature applications including sealing elements and seal connectors among others. The method includes providing a composition having an aromatic polymer and a crosslinking compound, and subjecting the composition to a heat molding process to form the component and crosslink the aromatic polymer.
대표청구항▼
1. A method of improving extrusion- and creep-resistance of a component for use in a high temperature sealing element or seal connector, comprising, providing a composition comprising an aromatic polymer and a crosslinking compound, andsubjecting the composition to a heat molding process to form the
1. A method of improving extrusion- and creep-resistance of a component for use in a high temperature sealing element or seal connector, comprising, providing a composition comprising an aromatic polymer and a crosslinking compound, andsubjecting the composition to a heat molding process to form the component and crosslink the aromatic polymer,wherein the crosslinking compound has a structure according to formula (II) below: wherein A is an arene moiety having a molecular weight of less than 10,000 g/mol, R1 is selected from a group consisting of hydroxide (—OH), amine (—NH2), halide, ether, ester, or amide, and x=2.0 to 6.0. 2. The method according to claim 1, wherein the composition is unfilled. 3. The method according to claim 1, wherein the aromatic polymer is selected from the group consisting of a polyarylene polymer, a polysulfone, a polyphenylene sulfide, a polyimide, a polyamide, a polyurea, a polyurethane, a polyththalamide, a polyamide-imide, an aramid, a polybenzimidazole, and blends, copolymers and derivatives thereof. 4. The method according to claim 3, wherein the aromatic polymer is a polyarylene ether polymer including polymer repeating having units of structure according to formula (IV) below: (—O—Ar1—O—Ar2—)m(—O—Ar3—O—Ar4—)n (IV)wherein Ar1, Ar2, Ar3 and Ar4 are identical or different aryl radicals, m is 0 to 1, and n is 1−m. 5. A sealing component formed by the method of claim 1. 6. The sealing component according to claim 5, wherein the composition is unfilled. 7. The sealing component according to claim 5, wherein the sealing component is a seal back-up element, a packer element, a labyrinth seal or a dual-lip sealing component. 8. A sealing connector formed by the method of claim 1. 9. The sealing connector formed by the method of claim 8, wherein the composition is unfilled. 10. A method of improving extrusion- and creep-resistance of a component for use in a high temperature sealing element or seal connector, comprising, providing a composition comprising an aromatic polymer and a crosslinking compound, andsubjecting the composition to a heat molding process to form the component and crosslink the aromatic polymerwherein the crosslinking compound is 9,9′-(biphenyl-4,4′-diyl)bis(9H-fluoren-9-ol) and has a general structure according to formula (V): 11. A sealing component formed by the method of claim 10. 12. The sealing component according to claim 11, wherein the composition is unfilled. 13. The sealing component according to claim 11, wherein the sealing component is a seal back-up element, a packer element, a labyrinth seal or a dual-lip sealing component. 14. A sealing connector formed by the method of claim 10. 15. The sealing connector formed by the method of claim 14, wherein the composition is unfilled. 16. A method of improving extrusion- and creep-resistance of a component for use in a high temperature sealing element or seal connector, comprising, providing a composition comprising an aromatic polymer and a crosslinking compound, andsubjecting the composition to a heat molding process to form the component and crosslink the aromatic polymer,further comprising a cross-linking reaction additive capable of reacting with the cross-linking compound to form a reactive intermediate in the form of an oligomer, which reactive intermediate oligomer is capable of cross-linking an organic polymer. 17. The method according to claim 16, wherein the cross-linking reaction additive is an organic acid which may be glacial acetic acid, formic acid, and/or benzoic acid. 18. The method according to claim 16, wherein the cross-linking reaction additive may be is an acetate compound that has a structure according to formula (III): wherein M is a Group I or a Group II metal; and R2 is an alkyl, aryl, or aralkyl group, wherein the alkyl group is a hydrocarbon group of 1 to about 15 carbon atoms having 0 to about 5 ester or ether groups along or in the chain of the hydrocarbon group, wherein R2 has 0 to about 5 functional groups. 19. A sealing component formed by the method of claim 16. 20. The sealing component according to claim 19, wherein the composition is unfilled. 21. The sealing component according to claim 19, wherein the sealing component is a seal back-up element, a packer element, a labyrinth seal or a dual-lip sealing component. 22. A sealing connector formed by the method of claim 16. 23. The sealing connector formed by the method of claim 22, wherein the composition is unfilled.
Stokich ; Jr. Theodore M. ; Martin Brian B. ; Townsend ; III Paul H., Adhesion promoter and self-priming resin compositions and articles made therefrom.
Lau Aldrich N. K. (Palo Alto CA) Vo Lanchi P. (San Jose CA) Mercer Frank W. (Belmont CA), Bistriazene compounds and polymeric compositions crosslinked therewith.
Mercer Frank W. (Belmont CA) Lau Aldrich N. K. (Palo Alto CA) Vo Lanchi P. (San Jose CA), Compounds having oxadiazole and triazene moieties, crosslinkable polymers therefrom, and methods therefor.
Mercer Frank W. (Belmont CA) Goodman Timothy D. (Redwood City CA) Lau Aldrich N. K. (Palo Alto CA) Vo Lanchi P. (San Jose CA), Crosslinkable fluorinated aromatic ether composition.
Mercer Frank W. (Belmont CA) Goodman Timothy D. (Redwood City CA) Lau Aldrich N. K. (Palo Alto CA) Vo Lanchi P. (San Jose CA), Crosslinkable fluorinated polyarylene ether composition.
Huang,Diyun; Londergan,Timothy M., Crosslinked compositions comprising a poly(arylene ether) and a nonlinear optical chromophore, and devices incorporating same.
Mercer Frank W. (Belmont CA) Goodman Timothy D. (Redwood City CA) Lau Aldrich N. K. (Palo Alto CA) Vo Lanchi P. (San Jose CA) Sovish Richard C. (Los Altos CA), Electronic articles containing a fluorinated poly(arylene ether) dielectric.
Lindley Patricia M. (Springfield VA) Reinhardt Bruce A. (New Carlisle OH) Arnold Fred E. (Centerville OH), High temperature solvent resistant amorphous thermoplastic phenylethynyl quinoxaline resin composition.
Burgoyne ; Jr. William Franklin (Allentown PA) Robeson Lloyd Mahlon (Mucungie PA) Vrtis Raymond Nicholas (Carlsbad CA), Nonfunctionalized poly(arylene ether) dielectrics.
Shaffer, II,Edward O.; Howard,Kevin E.; Waeterloos,Joost J. M.; Hetzner,Jack E.; Townsend, III,Paul H.; Mills,Lynne K.; Gombar Fetner,Sheila; Wilson,Larry R., Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices.
McGrath James E. (Blacksburg VA) Mohanty Dillip K. (Mount Pleasant MI), Polyarylene ethers and polyarylene sulfides containing phosphine oxide group and modified by reaction with organoamine.
Burgoyne, Jr., William Franklin; Conner, Mark David; Nordquist, Andrew Francis; Collins, William Steven, Polymeric compositions comprising per(phenylethynyl) arene derivatives.
Kretz, Christine Peck; Burgoyne, Jr., William Franklin; Markley, Thomas John, Thin film transistors with poly(arylene ether) polymers as gate dielectrics and passivation layers.
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