[미국특허]
Materials, fabrication equipment, and methods for stable, sensitive photodetectors and image sensors made therefrom
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-029/06
H01L-031/00
H01L-031/0352
H01L-031/032
H01L-031/109
H01L-031/0336
H01L-031/0224
H01L-031/0384
H01L-031/09
H01L-027/146
출원번호
US-0336783
(2014-07-21)
등록번호
US-9209331
(2015-12-08)
발명자
/ 주소
Ivanov, Igor Constantin
Sargent, Edward Hartley
Tian, Hui
출원인 / 주소
InVisage Technologies, Inc.
대리인 / 주소
Schwegman Lundberg & Woessner, P.A.
인용정보
피인용 횟수 :
4인용 특허 :
61
초록▼
Optically sensitive devices include a device comprising a first contact and a second contact, each having a work function, and an optically sensitive material between the first contact and the second contact. The optically sensitive material comprises a p-type semiconductor, and the optically sensit
Optically sensitive devices include a device comprising a first contact and a second contact, each having a work function, and an optically sensitive material between the first contact and the second contact. The optically sensitive material comprises a p-type semiconductor, and the optically sensitive material has a work function. Circuitry applies a bias voltage between the first contact and the second contact. The optically sensitive material has an electron lifetime that is greater than the electron transit time from the first contact to the second contact when the bias is applied between the first contact and the second contact. The first contact provides injection of electrons and blocking the extraction of holes. The interface between the first contact and the optically sensitive material provides a surface recombination velocity less than 1 cm/s.
대표청구항▼
1. An optically sensitive device comprising: a first contact;an n-type semiconductor;an optically sensitive material comprising a p-type semiconductor;a second contact; a magnitude of the work function of the optically sensitive material being at least 0.4 eV greater than a magnitude of the work fun
1. An optically sensitive device comprising: a first contact;an n-type semiconductor;an optically sensitive material comprising a p-type semiconductor;a second contact; a magnitude of the work function of the optically sensitive material being at least 0.4 eV greater than a magnitude of the work function of the first contact, and also at least 0.4 eV greater than a magnitude of the work function of the second contact; the optically sensitive material having an electron lifetime that is greater than an electron transit time from the first contact to the second contact when a bias is applied between the first contact and the second contact; the n-type semiconductor providing injection of electrons and blocking the extraction of holes; and the interface between the n-type semiconductor and the optically sensitive material providing a surface recombination velocity less than 1 cm/s. 2. The device of claim 1, wherein the n-type semiconductor comprises a material selected from the group consisting of TiO2, TiO2 that has been chemically reduced, TiO2 that has been oxidized, CdTe, CdS, CdSe, Si, or nanoparticles selected from the group consisting of PbS, PbSe, PbTe, CdS, CdSe, CdTe, Si, Ge, or C. 3. The device of claim 1, wherein the bias is in the range of about −0.1 Volts to about −2.8 Volts. 4. The device of claim 1, wherein the optically sensitive material comprises a plurality of nanoparticles, wherein each of the nanoparticles has an oxide on a surface of the respective nanoparticle. 5. The device of claim 1, wherein the optically sensitive material comprises nanoparticles selected from the group consisting of PbS, PbSe, PbTe, CdS, CdSe, CdTe, Si, Ge, or C. 6. The device of claim 1, wherein the optically sensitive material comprises a plurality of interconnected nanoparticles. 7. The device of claim 1, wherein the first contact and the second contact are separated by a distance in the range of 200 nm to 2 μm. 8. The device of claim 1, wherein the first contact and the second contact each comprise a material selected from the group consisting of Al, Ag, In, Mg, Ca, Li, Cu, Ni, NiS, TiN, TaN, TiO2, TixNy, ITO, Ru, TiSi, WSi2, TiOx doped with B, TiOx doped with C, TiOx doped with Co, TiOx doped with Fe, TiOx doped with Nd, and TiOx doped with N.
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