[특허]Manufacturing methods for a sensor package including a lead frame

[미국특허] Manufacturing methods for a sensor package including a lead frame 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01R-033/00 G01R-033/09 H01L-021/56 H01L-023/00
출원번호	US-0156296 (2014-01-15)
등록번호	US-9222989 (2015-12-29)
우선권정보	EP-07003414 (2007-02-19)
발명자 / 주소	Hesen, Paulus Martinus Catharina Groenhuis, Roelf Anco Jacob Bosch, Johannes Wilhelmus Dorotheus
출원인 / 주소	NXP B.V.
인용정보	피인용 횟수 : 3 인용 특허 : 14

초록 ▼

A sensor package includes a lead frame with a first portion extending and a second portion extending in a direction inclined with respect to the first potion. The sensor package also includes an application specific integrated circuit and a magneto resistive sensor and a ferrite provided with a mold

대표청구항 ▼

1. A method for manufacturing a sensor package comprising; bending a lead frame so as to achieve a first portion extending in a direction along a first longitudinal axis and having a die pad, and a second portion extending in a direction inclined to the longitudinal axis, which second portion has a first side facing away from the first portion and a second side opposing to the first side;mounting an application specific integrated circuit onto the die pad, and mounting a magneto resistive sensor and a ferrite to the second portion;wherein the lead frame is formed as a plurality of fingers in the transit from the first portion to the second portion, at least a part of the fingers are electrically isolated from the die pad and at least one finger being electrically connected to the die pad, which fingers are connected to a tie bar for positioning purposes before mounting, which tie bar is removed after mounting one out of a group consisting of the magneto resistive sensor and the ferrite to the fingers thus fixing the position of the fingers relative to each other;electrically connecting the magneto resistive sensor to the application specific integrated circuit via the fingers of the lead frame that are electrically isolated from the die pad, wherein electrically connecting is carried out as coupling the magneto resistive sensor to the fingers with wire bonds that are attached to the fingers at a side remote from the application specified integrated circuit; andmoulding in a single moulding step a body covering the second portion of the lead frame, the magneto resistive sensor, the ferrite, the die pad, the application specific integrated circuit and an electrical connection between the sensor and the application specific integrated circuit, so as to achieve a one-piece moulding body. 2. Method of claim 1, wherein the inclination of the first portion and the second portion is substantially perpendicular. 3. Method of claim 1, wherein the ferrite is provided on at least one side with a die attach foil or wafer back laminate adhesive coating. 4. Method of claim 1, wherein leads on a flexible foil structure are mounted as electrical connection. 5. Method of claim 1, further comprising submounting the ferrite and the magneto resistive sensor together to form a subassembly, and mounting the subassembly to the second portion of the sensor package. 6. Method of one of claim 1, wherein the ferrite is mounted to the second portion prior to the mounting of the magneto resistive sensor. 7. Method of one claim 1, wherein the ferrite is mounted on the second side of the second portion and the magneto resistive sensor is mounted on the first side of the second portion. 8. Method of claim 7, wherein mounting of the magneto resistive sensor and the ferrite is carried out with a flip chip technique.

이 특허에 인용된 특허 (14) 인용/피인용 타임라인 분석

Gagliardi Michael A. (Forreston IL), Encapsulatable sensor assembly.
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Auburger,Albert; Dangelmaier,Jochen; Gottlieb,Alfred; Petz,Martin; Schindler,Uwe; Theuss,Horst, Integrated magnetic sensor component.
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Davidson Robert M. (Freeport IL) Eaton William E. (Stockton IL) Furlong Gregory R. (Freeport IL) Michelhaugh Scott E. (Cedarville IL) Rowley James W. (German Valley IL) Ross Gordon F. (Freeport IL) S, Magnet carrier disposed within an outer housing.
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Lamb,Wayne A.; Frazee,Lawrence E.; Schelonka,Peter A.; Stolfus,Joel D., Magnet orientation and calibration for small package turbocharger speed sensor.
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Shinjo Izuru,JPX ; Nada Takuji,JPX ; Hatazawa Yasuyoshi,JPX ; Hiraoka Naoki,JPX, Magnetic detector having separate base and connector units and production process therefor.
상세보기
Braun, Alexander; Herzberger, Andreas; Waldenmeier, Steffen, Magnetic field sensor.
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Davidson Robert M. (Freeport IL), Magnetic sensor with encapsulated magnetically sensitive component and magnet.
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Sumcad Gustavo L. (Freeport IL), Method for calibrating a sensor by moving a magnet while monitoring an output signal from a magnetically sensitive compo.
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Thomas,David L.; Woychik,Charles G., Method of making an electronic package.
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Borst,Peter; Barth,Dietmar, Sensor holder and method for the production thereof.
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Hesen, Paulus Martinus Catharina; Groenhuis, Roelf Anco Jacob; Bosch, Johannes Wilhelmus Dorotheus, Sensor packages including a lead frame and moulding body and methods of manufacturing.
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Gonsalves Edward M. (Swansea MA) Offiler Stephen B. (Atleboro MA) Strott Douglas B. (Atleboro MA) Beringhause Steven (West Roxbury MA), Speed/position sensor calibration method with angular adjustment of a magnetoresistive element.
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Kim,Woojin; Dancaster,John; Logan,John; Bryzek,Aniela, Surface mount package and method for forming multi-chip microsensor device.
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Lamb,Wayne A.; Michelhaugh,Scott E.; Schelonka,Peter A.; Stolfus,Joel D., Thermoplastic overmolding for small package turbocharger speed sensor.
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이 특허를 인용한 특허 (3) 인용/피인용 타임라인 분석

Seth, Rohit, Wearable wireless HMI device.
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Seth, Rohit, Wearable wireless HMI device.
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Seth, Rohit, Wearable wireless HMI device.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Manufacturing methods for a sensor package including a lead frame 원문보기