Switch circuit and method of switching radio frequency signals
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H04B-001/28
H01L-029/76
H04M-001/00
H04B-001/40
H01P-001/15
H03K-017/06
H03K-017/10
H03K-017/693
H03K-019/0185
H03K-019/0944
H03K-017/08
출원번호
US-0062791
(2013-10-24)
등록번호
US-9225378
(2015-12-29)
발명자
/ 주소
Burgener, Mark L.
Cable, James S.
출원인 / 주소
Peregrine Semiconductor Corpopration
대리인 / 주소
Jaquez Land Richman LLP
인용정보
피인용 횟수 :
14인용 특허 :
441
초록▼
An RF switch circuit and method for switching RF signals that may be fabricated using common integrated circuit materials such as silicon, particularly using insulating substrate technologies. The RF switch includes switching and shunting transistor groupings to alternatively couple RF input signals
An RF switch circuit and method for switching RF signals that may be fabricated using common integrated circuit materials such as silicon, particularly using insulating substrate technologies. The RF switch includes switching and shunting transistor groupings to alternatively couple RF input signals to a common RF node, each controlled by a switching control voltage (SW) or its inverse (SW_), which are approximately symmetrical about ground. The transistor groupings each comprise one or more insulating gate FET transistors connected together in a “stacked” series channel configuration, which increases the breakdown voltage across the series connected transistors and improves RF switch compression. A fully integrated RF switch is described including control logic and a negative voltage generator with the RF switch elements. In one embodiment, the fully integrated RF switch includes an oscillator, a charge pump, CMOS logic circuitry, level-shifting and voltage divider circuits, and an RF buffer circuit.
대표청구항▼
1. A circuit, comprising: (a) a first port configured to receive a first RF signal;(b) a second port configured to receive a second RF signal;(c) an RF common port;(d) a first switch transistor grouping having a first node coupled to the first port and a second node coupled to the RF common port, wh
1. A circuit, comprising: (a) a first port configured to receive a first RF signal;(b) a second port configured to receive a second RF signal;(c) an RF common port;(d) a first switch transistor grouping having a first node coupled to the first port and a second node coupled to the RF common port, wherein the first switch transistor grouping has a control node configured to receive a switch control signal (SW);(e) a second switch transistor grouping having a first node coupled to the second port and a second node coupled to the RF common port, wherein the second switch transistor grouping has a control node configured to receive an inverse (SW_) of the switch control signal (SW);(f) a first shunt transistor grouping having a first node coupled to the second port and a second node coupled to ground, wherein the first shunt transistor grouping has a control node configured to receive the switch control signal (SW); and(g) a second shunt transistor grouping having a first node coupled to the first port and a second node coupled to ground, wherein the second shunt transistor grouping has a control node configured to receive the inverse (SW_) of the switch control signal (SW),wherein the first switch transistor, the second switch transistor, the first shunt transistor, and the second shunt transistor are fabricated on a silicon-on-insulator (SOI) substrate, and wherein the SOI substrate comprises a thin-film substrate. 2. The circuit of claim 1, wherein the transistor groupings comprise a plurality of MOSFET transistors arranged in a stacked configuration. 3. The circuit of claim 1, wherein the circuit has an associated 1 dB compression point, and wherein the 1 dB compression point is increased using a stacked MOSFET transistor configuration. 4. A switch circuit, comprising: (a) the circuit as set forth in claim 1;(b) a control logic block, coupled to the circuit of claim 1, wherein the control logic block is configured to output the switch control signal (SW) and the inverse switch control signal (SW_); and(c) a negative voltage generator, coupled to the control logic block, wherein the negative voltage generator is configured to receive a clocking input signal and a positive power supply voltage from an external power supply, and wherein the negative voltage generator is configured to output a negative power supply voltage. 5. The circuit of claim 4, wherein the circuit is integrated in an integrated circuit (IC) with a plurality of digital and analog circuits. 6. The circuit of claim 4, further including: (a) an oscillator, wherein the oscillator is configured to output clocking input signals;(b) a charge pump, coupled to the oscillator, wherein the oscillator is configured to input the clocking input signals, and wherein the charge pump is configured to output a negative power supply voltage;(c) a logic circuit block, coupled to the charge pump, wherein the logic circuit block is configured to output control signals for use in controlling the switch and shunt transistor groupings;(d) a level-shifting circuit, coupled to the logic circuit block and the circuit, wherein the level-shifting circuit is configured to reduce gate-to-drain, gate-to-source, and drain-to-source voltages of MOSFET transistors used to implement the transistor groupings; and(e) an RF buffer circuit, coupled to the circuit, wherein the RF buffer circuit is configured to isolate RF signal energy from the charge pump and the logic circuit blocks. 7. The circuit of claim 6, wherein the charge pump comprises: (a) at least two P-channel MOSFET transistors;(b) at least two N-channel MOSFET transistors, wherein each N-channel MOSFET transistor is coupled in series with a respective and associated P-channel MOSFET transistor thereby forming a respective leg of the charge pump;(c) at least one coupling capacitor coupling each leg of the charge pump coupled to a successive leg; and(d) an output capacitor, coupled to an output leg of the charge pump; wherein the charge pump is configured to generate the negative power supply voltage by alternately charging and discharging the coupling and output capacitors using non-overlapping input clocking signals to drive the P-channel and N-channel MOSFET transistors. 8. The circuit of claim 7, wherein the non-overlapping input clocking signals comprise two non-overlapping clock control signals, and wherein a first non-overlapping clock control signal controls the P-channel transistors, and wherein a second non-overlapping clock control signal controls the N-channel transistors. 9. The circuit of claim 7, wherein the P-channel and N-channel transistors comprise single-threshold transistors. 10. The circuit of claim 7, wherein a pulse shift circuit is configured to generate the non-overlapping input clocking signals. 11. The circuit of claim 7, wherein the non-overlapping input clocking signals are derived from the oscillator clocking input signals. 12. The circuit of claim 7, wherein the oscillator comprises a relaxation oscillator. 13. The circuit of claim 7, wherein the non-overlapping input clocking signals vary in voltage amplitude from −Vdd to +Vdd. 14. The circuit of claim 6, wherein the level-shifting circuit comprises a plurality of inverters coupled together in a feedback configuration. 15. The circuit of claim 14, wherein the inverters comprise differential inverters having a first differential input, a second differential input, a logic input and a logic output, and wherein the level-shifting circuit comprises: (a) an input inverter group comprising two input differential inverters, wherein a first input differential inverter is configured to receive a logic input signal (input) and to output a first logic input signal (in), and wherein a second input differential inverter is configured to receive the first logic input signal (in) and to output an inverse (in_) of the first logic input signal;(b) a first inverter group comprising three differential inverters, wherein the logic output of a first inverter of the first inverter group is coupled to the first logic input signal (in), the logic output of the first inverter is coupled to a first differential input of an output inverter of the first inverter group, the logic output of a second inverter of the first inverter group is coupled to a second differential input of the output inverter of the first inverter group, and wherein the output inverter of the first inverter group is configured to output a first output signal (out); and(c) a second inverter group comprising three differential inverters, wherein the logic output of a first inverter of the second inverter group is coupled to the inverse (in_) of the first logic input signal, the logic output of the first inverter of the second inverter group is coupled to a first differential input of an output inverter of the second inverter group, the logic output of a second inverter of the second inverter group is coupled to a second differential input of the output inverter of the second inverter group, and wherein the output inverter of the second inverter group is configured to output a second output signal (out_);wherein the circuit is configured to provide the first output signal (out) as feedback and input to the logic input of the second inverter of the second inverter group, and wherein the circuit is configured to provide the second output signal (out_) as feedback and input to the logic input of the second inverter of the first inverter group. 16. The circuit of claim 15, wherein the switch and shunt transistor groupings are configured to be controlled by the first and second output signals. 17. The circuit of claim 14, wherein the level-shifting circuit is configured to shift the DC level of the logic input signal (input) without affecting the frequency response of the input signal.
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