초록 ▼

Structures and methods relating to electrodes for incorporation into a feedthrough with a profile adapted for subcutaneous sensing of physiologic and cardiac signals. Electrode assemblies are adapted for integration with feedthroughs and provide reliable insulation from the implantable medical devic

Structures and methods relating to electrodes for incorporation into a feedthrough with a profile adapted for subcutaneous sensing of physiologic and cardiac signals. Electrode assemblies are adapted for integration with feedthroughs and provide reliable insulation from the implantable medical device housing. Various structures and manufacturing processes are implemented to provide a large sensing surface with a low profile. The subcutaneous sensing electrode assembly can provide a leadless sensing system and further enhances installation and follow-up procedures.

대표청구항 ▼

1. An implantable medical device comprising: a housing having an inner surface and an outer surface;electronics enclosed by the housing;an electrode assembly coupled to the housing, the electrode assembly comprising: a feedthrough extending through the housing, between the inner and outer surfaces t

1. An implantable medical device comprising: a housing having an inner surface and an outer surface;electronics enclosed by the housing;an electrode assembly coupled to the housing, the electrode assembly comprising: a feedthrough extending through the housing, between the inner and outer surfaces thereof, the feedthrough including a ferrule, an insulator, and an electrically conductive pin, the ferrule being coupled to the housing, the pin extending through the ferrule from an internal end thereof, adjacent the inner surface of the housing, to an external end thereof, adjacent the outer surface of the housing, the insulator filling an area between the pin and ferrule, and the internal end of the pin being coupled to the electronics;an electrode coupled to the external end of the conductive pin of the feedthrough; anda securing assembly connected to the outer surface of the housing, the securing assembly including an insulator cup that surrounds a perimeter of the electrode, and a retention bracket coupled to the insulator cup and to the housing, the retention bracket extending between the outer surface of the housing and the electrode. 2. The device of claim 1, wherein the retention bracket of the securing assembly is welded to the housing. 3. An assembly for an implantable medical device, the device including electronics, a hermetically sealed housing enclosing the electronics, and a feedthrough extending through the housing, between an inner surface of the housing and an outer surface of the housing, the feedthrough including an electrically conductive pin, the pin extending from an internal end thereof, adjacent the inner surface of the housing, to an external end thereof, adjacent the outer surface of the housing, and the internal end of the pin being coupled to the electronics; and wherein the assembly comprises: an electrode coupled to the external end of the conductive pin;an insulator cup surrounding a perimeter of the electrode; anda retention bracket coupled to the insulator cup and to the housing, the retention bracket extending between the outer surface of the housing and the electrode. 4. The device of claim 1, wherein the retention bracket of the securing assembly is molded into the insulator cup. 5. The device of claim 1, wherein the insulator cup of the securing assembly snaps onto the retention bracket. 6. The device of claim 1, wherein the insulator cup of the securing assembly protrudes less than about 0.175 inches perpendicular from the outer surface of the housing. 7. The device of claim 1, wherein the insulator cup of the securing assembly protrudes less than about 0.1 inches perpendicular from the outer surface of the housing. 8. The device of claim 1, wherein the securing assembly further comprises adhesive, the adhesive filling a void between the insulator cup and the outer surface of the housing. 9. The device of claim 1, wherein the electrode of the electrode assembly is non-planar. 10. The device of claim 1, wherein the electrode of the electrode assembly is dome shaped. 11. The device of claim 1, wherein the electrode of the electrode assembly is rectangular. 12. The device of claim 1, wherein the electrode of the electrode assembly has a high-surface area coating. 13. The device of claim 1, wherein the insulator cup of the securing assembly includes an indentation in which the electrode resides. 14. The device of claim 1, wherein the securing assembly includes at least one adhesive fill hole or vent. 15. The assembly of claim 3, further comprising at least one adhesive fill hole or vent. 16. The assembly of claim 3, wherein the retention bracket is welded to the housing. 17. The assembly of claim 3, wherein the retention bracket is molded into the insulator cup. 18. The assembly of claim 3, wherein the insulator cup snaps onto the retention bracket. 19. The assembly of claim 3, wherein the insulator cup protrudes less than about 0.175 inches perpendicular from the outer surface of the housing. 20. The assembly of claim 3, wherein the insulator cup protrudes less than about 0.1 inches perpendicular from the outer surface of the housing. 21. The assembly of claim 3, further comprising adhesive, the adhesive filling a void between the insulator cup and the outer surface of the housing. 22. The assembly of claim 3, wherein the electrode is non-planar. 23. The assembly of claim 3, wherein the electrode is dome shaped. 24. The assembly of claim 3, wherein the electrode is rectangular. 25. The assembly of claim 3, wherein the electrode has a high-surface area coating. 26. The assembly of claim 3, wherein the insulator cup includes an indentation in which the electrode resides. 27. The assembly of claim 3, wherein the retention bracket includes radially extending legs, between which the conductive pin extends. 28. The assembly of claim 3, wherein the retention bracket is disk shaped and includes a hole through which the conductive pin extends.