$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

LED light fixture with fluid flow to and from the heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F21V-029/00
  • F21V-005/04
  • F21V-027/00
  • F21V-031/03
  • F21S-008/00
  • F21S-008/08
  • F21S-009/02
  • F21V-019/00
  • F21V-019/04
  • F21V-021/30
  • F21V-023/02
  • F21V-029/71
  • F21V-029/74
  • F21V-029/75
  • F21V-029/76
  • F21V-029/83
  • F21K-099/00
  • F21V-021/005
  • F21W-131/10
  • F21W-131/103
  • F21Y-101/02
  • F21Y-105/00
  • F21V-021/116
  • F21V-029/507
출원번호 US-0764743 (2013-02-11)
등록번호 US-9243794 (2016-01-26)
발명자 / 주소
  • Wilcox, Kurt S.
  • Kinnune, Brian
  • Snell, Nathan
출원인 / 주소
  • Cree, Inc.
대리인 / 주소
    Jansson Munger McKinley & Kirby Ltd.
인용정보 피인용 횟수 : 2  인용 특허 : 137

초록

An LED light fixture including a housing and an LED assembly secured with respect to the housing. The LED assembly includes a heat sink and an LED illuminator secured with respect to an LED-supporting region of the heat sink with heat-dissipating surfaces extending therefrom. The heat sink having fr

대표청구항

1. An LED light fixture comprising: a housing; andan LED assembly secured with respect to the housing and comprising (a) a heat sink including an LED-supporting region and heat-dissipating surfaces extending therefrom, the heat sink having front, rear and lateral sides and being open to ambient-flui

이 특허에 인용된 특허 (137)

  1. Brench Colin E., Apparatus to minimize integrated circuit heatsink E.M.I. radiation.
  2. Samarov Victor M. (Carlisle MA), Arcuate profiled heatsink apparatus and method.
  3. Hubbell, David A.; Desantis, Philip V., Area lighting device using discrete light sources, such as LEDs.
  4. Ignatius Ronald W. (Dodgeville WI) Martin Todd S. (Dodgeville WI), Arrays of optoelectronic devices and method of making same.
  5. Wang,Pei Choa, Assembling structure for LED road lamp and heat dissipating module.
  6. Hsin-Mao Hsieh TW, Base for a heat dissipating assembly.
  7. Ryu,Ho Chul; Bae,Sung Won, Case for covering electronic parts and display apparatus including the same.
  8. Sloan, Thomas C.; Quaal, Bruce, Channel letter lighting using light emitting diodes.
  9. Campanella Vincent (Wakefield MA) Vasconcelos Osvaldo M. (Milton MA), Clamping heat sink.
  10. Campanella Vincent ; Vasconcelos Osvaldo M., Clamping heat sink.
  11. Vasconcelos Osvaldo M. (Milton MA) Campanella Vincent (Wakefield MA), Clamping heat sink.
  12. Campanella Vincent (Wakefield MA) Vasconcelos Osvaldo M. (Milton MA), Clamping heat sink for an electric device.
  13. Harmon Ronald A. (Hudson MA) Urrata Giovanni (Wakefield MA), Clip for clamping heat sink module to electronic module.
  14. Glovatsky,Andrew Zachary; Lemecha,Myron; Reddy,Prathap Amervai, Convectively cooled headlamp assembly.
  15. Lavochkin, Ronald B.; Whitney, Bradley R., Corrugated fin heat exchanger and method of manufacture.
  16. Trojanowski, Alan; Nickel, Jonathan, Dual LED point-source assembly.
  17. Johnson Philip A. (Exeter NH) McCarthy Alfred F. (Belmount NH), Electronic chip-carrier heat sinks.
  18. Clark,Kevin; Clarke,Carl, Exterior luminaire.
  19. Sahyoun Youssef Y. (1418 E. 3rd Ave. San Mateo CA 94401), Exterior surface of a heat sink.
  20. Morosas Christopher G. (Sutton MA), Fan driven heat sink.
  21. Becker,Charles Adrian; Weaver,Stanton Earl; Stecher,Thomas Elliot, Flexible interconnect structures for electrical devices and light sources incorporating the same.
  22. Pyrtle, Randy, Fluorescent light fixture with lateral ballast.
  23. Krames Michael R ; Kish ; Jr. Fred A ; Tan Tun S, Forming LED having angled sides for increased side light extraction.
  24. Hochstein Peter A., Heat dissipating L.E.D. traffic light.
  25. Kuan,Hsin Ning, Heat dissipating pole illumination device.
  26. Wong, Shwin Chung, Heat dissipation devices for an LED lamp set.
  27. James T. Petroski, Heat dissipation system for high power LED lighting system.
  28. Asanuma Yoshihiko (Oyama JPX), Heat releasing plate for mounting semiconductor components.
  29. Asanuma Yoshihiko (Tochigi JPX), Heat releasing plate for mounting semiconductor components.
  30. Asanuma Yoshihiko (Tochigi JPX), Heat releasing plate for mounting semiconductor components.
  31. Campanella Vincent, Heat sink.
  32. Campanella Vincent, Heat sink.
  33. Chou Fargo,TWX ; Lee Edward,TWX, Heat sink.
  34. Chou Fargo,TWX ; Lee Edward,TWX, Heat sink.
  35. Frerichs Wayne R. (Andover MA) Panek Jeff J. (Derry NH), Heat sink.
  36. Harmon Ronald A. (Hudson MA), Heat sink.
  37. Hsia, Chih-Hao; Lin, Kuo-Cheng; Huang, Wen-Shi, Heat sink.
  38. Lin Chi-Hsiung,TWX ; Teng Chi-Chang,TWX ; Chan Shen-Feng,TWX, Heat sink.
  39. Lorenzetti Victor (Dedham MA) Pontes Manuel (Somerville MA), Heat sink.
  40. Lee, Hsieh Kun; Lai, Cheng-Tien; Zhou, Shi Wen, Heat sink assembly.
  41. Tsung Lung Lee TW; Chung Tien Lai TW; Zili Zhang CH, Heat sink assembly.
  42. Chun-Chi Chen CN, Heat sink assembly having fastening means for attaching fan to heat sink.
  43. Lee, Hsieh Kun; Xia, Wan Lin; Li, Tao; Li, Lei, Heat sink assembly with fixing mechanism.
  44. Harmon Ronald A. (Hudson MA) Felps Jimmie D. (Colorado Springs CO), Heat sink device.
  45. Earl George F. (Meredith NH) Panek Jeffrey J. (Laconia NH) Churchill Jack (Laconia NH) Villaume Henry F. (Intervale NH), Heat sink for an electronic pin grid array.
  46. Scott,Robert R.; Jessop,Dee, Heat sink for dental curing light comprising a plurality of different materials.
  47. McCarthy Alfred F. (Belmount NH), Heat sink for integrated-circuit chip carrier.
  48. Villaume Henry F. (Intervale NH), Heat sink plate for multiple semi-conductors.
  49. Kikuchi Shunichi,JPX ; Hirano Minoru,JPX ; Seyama Kiyotaka,JPX ; Yoshimura Hideaki,JPX ; Kanda Takashi,JPX ; Nori Hitoshi,JPX, Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure.
  50. Miyahara, Masaharu; Mehara, Koji; Yoshida, Shinji, Heat sink unit and electronic apparatus using the same.
  51. Johnson, Philip A.; McCarthy, Alfred F., Heat sinks for integrated circuit modules.
  52. McCarthy Alfred F. (Belmount NH), Heat sinks for integrated circuit modules.
  53. Lee, Sang-cheol, Heat-conducting block of VGA chipset cooling device.
  54. Newby,Theodore A., Heatsinking electronic devices.
  55. Yen, George, High efficient tubular light emitting cylinder.
  56. Shane Harrah ; Douglas P. Woolverton, High flux LED array.
  57. Martin J. Steffensmeier, High reliability lighting system.
  58. Triner James E. ; Cech Steven D., High-density solid-state lighting array for machine vision applications.
  59. Sasse, Christoph, Hydrodynamic clutch device.
  60. Krames, Michael R; Steigerwald, Daniel A.; Kish, Jr., Fred A.; Rajkomar, Pradeep; Wierer, Jr., Jonathan J.; Tan, Tun S, III-Nitride Light-emitting device with increased light generating capability.
  61. Michael R Krames ; Daniel A. Steigerwald ; Fred A. Kish, Jr. ; Pradeep Rajkomar ; Jonathan J. Wierer, Jr. ; Tun S Tan, III-nitride light-emitting device with increased light generating capability.
  62. Ruffin, Marvin, Integrated LED heat sink.
  63. Zampini, II, Thomas L.; Zampini, Thomas L.; Zampini, Mark A., Interconnection arrangement having mortise and tenon connection features.
  64. Hoss, Shawn P., Interlocking heat sink.
  65. Peter A. Hochstein, L.E.D. thermal management.
  66. Krames, Michael R; Kish, Jr., Fred A; Tan, Tun S, LED having angled sides for increased side light extraction.
  67. Wang, Pei Choa, LED illumination apparatus.
  68. Hochstein, Peter A., LED integrated heat sink.
  69. Takahashi, Yuji; Kaga, Koichi; Kato, Hideaki; Ikeda, Tadaaki; Miyawaki, Michio, LED lamp.
  70. Hochstein Peter A., LED lamp assembly with means to conduct heat away from the LEDS.
  71. Zheng,Shi Song; Yu,Guang; He,Li, LED lamp with a heat sink assembly.
  72. Tsai, Chin Sung, LED lamp with plural radially arranged heat sinks.
  73. Stopa, James L.; Smith, Todd J., LED light assembly.
  74. Li,Mingzhu; Yu,Jingjing, LED light module and series connected light modules.
  75. Ruud, Alan J.; Wilcox, Kurt; Walczak, Steven R.; Guillien, Wayne, LED lighting fixture.
  76. Villard, Russell George, LED lighting fixture.
  77. Roberge, Brian; Roberts, Ron; Shikh, Igor; Lys, Ihor; Koerner, Brad; Mollnow, Tomas, LED-based fixtures and related methods for thermal management.
  78. Staufert,Gerhard, LED-luminous panel and carrier plate.
  79. Alois Biebl DE; Guenther Hirschmann DE, Led component group with heat dissipating support.
  80. Bolta,Charles; Watts,Phillip C., Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement.
  81. Tom Jory TW; Po-Hsien Lee TW; Chen-Lun Hsing Chen TW, Light emitting diode assembly with low thermal resistance.
  82. Lin, Ting-Hao; Kuo, Li-Wei, Light emitting diode bulb having high heat dissipating efficiency.
  83. Chen Der-Jong (3F ; No. 7 ; Lane 118 ; An Chu Street Taipei TWX), Light emitting diode display.
  84. Chen Der-Jong (8 ; Alley 16 ; Lane 37 ; Tatung Rd. Sec. 1. Hsi-Chih Town ; Taipei Hsien TWX), Light emitting diode display with PCB base.
  85. Yasuoka Tuyoshi,JPX, Light emitting diode dot matrix unit.
  86. Dry, Joel M., Light emitting diode light source.
  87. Dry,Joel M., Light emitting diode light source.
  88. Yen George,TWX, Light emitting diode lighting device.
  89. Egawa,Kazuo; Yamaji,Takao, Light emitting diode module.
  90. Ho, Wen-Chih, Light emitting diode module.
  91. Wu, Chen H.; Chuang, Han-Jen, Light emitting diode modules for illuminated signs.
  92. Krames Michael R ; Kish ; Jr. Fred A ; Tan Tun S, Light extraction from a semiconductor light-emitting device via chip shaping.
  93. Kishimura, Toshiji; Kishimura, Harumi; Matsuno, Yasuhisa; Abe, Satoshi; Takahashi, Toshifumi; Tsunashima, Toshiyuki; Osawa, Masakatsu; Hotta, Noboru, Light source for white color LED lighting and white color LED lighting device.
  94. Kuan, Yew Cheong; Lim, Seong Choon; Foong, Kar Phooi; Ou, Wen Ya, Light unit having light emitting diodes.
  95. Matheson,George E., Light-emitting module.
  96. Nagai, Hideo; Matsui, Nobuyuki; Tamura, Tetsushi, Light-emitting unit, light-emitting unit combination, and lighting apparatus assembled from a plurality of light-emitting units.
  97. Matsui, Nobuyuki; Nagai, Hideo; Tamura, Tetsushi, Lighting apparatus with enhanced capability of heat dissipation.
  98. Roberge,Brian; Piepgras,Colin; Hyer,Jeffrey; McCormick,Kevin; Swai,Peter; Morgan,Frederick M., Lighting methods and systems.
  99. Harris Edward H. (1065 E. Flamingo Road ; Apt. 524 Las Vegas NV 89109), Lighting panel.
  100. East John W. (Witney GB2) Frindle Paul (Charlbury GB2), Linear control arrangements.
  101. Maxik,Fredric S., Low-bay light fixture.
  102. Wijbenga Hendrik,NLX ; Entrop Jean P.,NLX, Luminaire.
  103. Chan Alexius C. (Hacienda Heights CA) Wheeler Phillip L. (Laguna Hills CA) Chandler Lloyd H. (Orange CA), Luminaire shield.
  104. Keuper, Matthijs H., Luminaire, optical element and method of illuminating an object.
  105. Lavochkin Ronald B. (Newton MA) Coe Thomas D. (Boxford MA), Method and apparatus for producing a high fin density extruded heat dissipator.
  106. Harmon Ronald A. (Hudson MA) Madan Nanak C. (Lowell MA) Tremblay Donald P. (Nashua NH), Method of and apparatus for forming a unitary heat sink body.
  107. Feldman, Alan Stuart; Cull, Brian David; Davey, Dennis Michael, Methods and apparatus for a light source with a raised LED structure.
  108. Swaris, Jagath; Van Ness, Scott, Modular mounting arrangement and method for light emitting diodes.
  109. Hediger Edwin A. (Fairport NY) Ng Yee S. (Fairmont NY) Pham Hieu (Webster NY), Modular optical printhead for hard copy printers.
  110. Collins, III, William David; Bhat, Jerome Chandra; Steigerwald, Daniel Alexander, Monolithic series/parallel led arrays formed on highly resistive substrates.
  111. Green Ross M. (Cambridge GB2) Kellaway Michael J. (Cambridge GB2) Shemmans David J. (Herts GB2) McShane David J. (Herts GB2), Mounting assembly for power semiconductors.
  112. Wilcox, Kurt S.; Guillien, Wayne, Multi-LED light fixture with secure arrangement for LED-array wiring.
  113. Bhat, Jerome C.; Steigerwald, Daniel A.; Khare, Reena, Multi-chip semiconductor LED assembly.
  114. Bucher,John C.; Geyer,Charles W., Outdoor lighting lamp with water-resistant cover.
  115. Bachl,Bernhard; Bl체mel,Simon; Kirchberger,G체nter; Stoyan,Harald, Passive radiation optical system module especially for use with light-emitting diodes.
  116. Mullins, Patrick, Photosensor control unit for a lighting module.
  117. Durocher, Kevin Matthew; Balch, Ernest Wayne; Krishnamurthy, Vikram B.; Saia, Richard Joseph; Cole, Herbert Stanley; Kolc, Ronald Frank, Plastic packaging of LED arrays.
  118. Chen,Yen Cheng; Tseng,Ching Lin; Wei,Sher Chain; Chang,Ming Li, SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power.
  119. Matheson,George, Sealed housing unit for lighting system.
  120. Harmon Ronald A. (Hudson MA), Self clamping heat sink.
  121. Johnson Philip A. (Melrose MA) McCarthy Alfred F. (Belmount NH), Self-fastened heat sinks.
  122. Johnson Philip A. (Melrose MA) McCarthy Alfred F. (Belmount NH), Self-fastened heat sinks.
  123. Soule Christopher A. (Concord NH) Kuzmin Gary F. (Gilford NH), Self-locking heat sinks for surface mount devices.
  124. Blandford, Robert Michael, Shutter for use with a light source.
  125. Masami Tsuzawa (14-15 Minamitsukushino 4-chome Machida-shi ; Tokyo JPX) Muneharu Tominaga (2-47-102 ; Shiohama 4-chome Ichikawa-shi ; Chiba JPX) Yoshinori Uchiyama (16-22 Tsurukawa ; 3-chome Machida-, Signal light unit having heat dissipating function.
  126. McCarthy Alfred F. (Belmount NH), Slip-on heat sink for long integrated-circuit modules.
  127. McCarthy Alfred F. (Belmount NH), Slotted dual-channel heat sink for electronic devices.
  128. Hutchison, Michael C., Solid state light with solar shielded heatsink.
  129. Cook Randolph H., Spring clamp assembly for improving thermal contact between stacked electronic components.
  130. Wieland ; Jr. Howard N. (Holliston MA), Spring clip and heat sink assembly for electronic components.
  131. Morosas Christopher G. (Sutton MA), Spring clip for clamping a heat sink module to an electronic module.
  132. Lee, Sang-cheol, Supporting block of VGA chipset cooling device.
  133. Carey Julian A. ; Collins ; III William D. ; Loh Ban Poh ; Sasser Gary D., Surface mountable LED package.
  134. Hochstein Peter A., Thermal management system for L.E.D. arrays.
  135. Woodward, Ronald Owen, Thermal management system for solid state automotive lighting.
  136. Gibson,David J., Vehicle light assembly and its associated method of manufacture.
  137. Yang Chung-Chin,TWX, Waterproof led display.

이 특허를 인용한 특허 (2)

  1. Wilcox, Kurt S.; Kinnune, Brian; Sorenson, Jeremy; Goldstein, Corey, LED light fixture.
  2. Kinnune, Brian; Goelz, David P.; Wilcox, Kurt S.; Raleigh, Craig, LED light fixture having heat sink with fins at flow-through opening.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로