초록

This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

대표청구항 ▼

1. A method comprising: delivering a molten combination of a first volume of solder and a second volume of dross into a first vessel, the second volume of the dross including a mixture of a third volume of the solder and a fourth volume of one or more oxides of the solder, the second volume of the d

1. A method comprising: delivering a molten combination of a first volume of solder and a second volume of dross into a first vessel, the second volume of the dross including a mixture of a third volume of the solder and a fourth volume of one or more oxides of the solder, the second volume of the dross floating on a surface of the first volume of the solder;cutting through the second volume of the dross that is floating on the surface of the first volume of the solder; andseparating the second volume of the dross into the third volume of the solder and the fourth volume of the one or more oxides of the solder such that the second and third volumes are separated from each other by injecting a gas into the first volume of the solder below the second volume of the dross in the first vessel,wherein the gas is injected into the first volume of the solder via a multiplicity of apertures distributed in a lengthwise direction along a plurality of stationary pipes that are submerged in the first volume of the solder below the second volume of the dross. 2. The method of claim 1, wherein the gas is insert gas. 3. The method of claim 1, further comprising delivering the first volume of the solder and the third volume of the solder that was separated from the fourth volume of the one or more oxides of the solder the first vessel to a second vessel. 4. A method comprising: cutting a first volume of dross that is floating on a surface of a second volume of molten solder in a vessel by moving a plurality of knives back and forth through the first volume of dross and into the second volume of molten solder, the first volume of the dross including a third volume of the solder and a fourth volume of one or more oxides of the solder with the third and fourth volumes mixed together in the first volume of the dross; andseparating the third volume of the solder from the fourth volume of the one or more oxides of the solder in the first volume of the dross by injecting gas into the second volume of the molten solder while the knives are moving back and forth through the first volume of the dross in a manner that forms gas bubbles which rise to and erupt at the surface of the second volume of the molten solder on which the first volume of the dross is floating. 5. The method as recited in claim 4, wherein the knives are moved linearly back and forth in parallel planes and the gas is injected in spaces between the parallel planes. 6. The method as recited in claim 4, further comprising skimming the fourth volume of the one or more oxides of the solder on the surface of the second volume of the molten solder in by moving a plate through at least a portion of the first volume of the dross. 7. The method as recited in claim 6, further comprising sucking the fourth volume of the one or more oxides of the solder that is skimmed from the surface of the second volume of the molten solder. 8. The method as recited in claim 6, wherein the knives and the plate are connected and move together. 9. The method as recited in claim 6, wherein the knives and the plate are parts of a unit that is vertically displaceable between first and second vertical positions, and further comprising: lifting the plate being out of contact with the surface of the second volume of the molten solder when the unit is in the first vertical position such that the knives are at least partially submerged in the second volume of the molten solder; andlowering the plate into contact with the surface of the second volume of molten solder when the unit is in the first vertical position such that the knives enter into and are at least partially submerged in the second volume of the molten solder. 10. The method as recited in claim 4, wherein the gas is inert gas. 11. The method as recited in claim 4, wherein at least some of the injected gas is injected at a plurality of apertures spaced along a pipe that is submerged in the second volume of the molten solder held in the vessel. 12. A method comprising: generating at least one soldering wave in a first volume of molten solder in a soldering vessel;moving a printed circuit board into contact with the at least one soldering wave, wherein a second volume of dross is formed and floats on a surface of the first volume of the molten solder responsive to the printed circuit board being moved into contact with the at least one soldering wave, the second volume of the dross including a third volume of the solder and a fourth volume of one or more oxides of the solder mixed together;moving the first volume of the molten solder and the second volume of the dross floating on the first volume of the molten solder from the soldering vessel into a separating vessel;cutting the second volume of the dross that is floating on the surface of the first volume of the molten solder in the separating vessel by moving a plurality of knives back and forth through the second volume of the dross and at least partially into the first volume of the molten solder;separating the third volume of the solder from the fourth volume of the one or more oxides of the solder in the second volume of the dross by injecting gas into the first volume of the molten solder in a manner that forms gas bubbles which rise to and erupt at the surface of the first volume of the molten solder on which the second volume of the dross is floating while the plurality of knives move back and forth across the surface of the first volume of the molten solder;skimming the fourth volume of the one or more oxides of the solder from the surface of the first volume of the molten solder by moving a plate across the surface of the first volume of the molten, solder;removing the fourth volume of the one or more oxides of the solder that is skimmed from the surface of the first volume of the molten solder in the separating vessel; andreturning the first volume of the molten solder and the third volume of the solder that previously was part of the second volume of the dross from the separating vessel back to the soldering vessel. 13. The method as recited in claim 12, wherein the knives are moved linearly back and forth in parallel planes and the gas is injected in spaces between the parallel planes. 14. The method as recited in claim 12, wherein the knives and the plate are connected and move together. 15. The method as recited in claim 12, wherein the knives and the plate are parts of a unit that is vertically displaceable between first and second vertical positions, and further comprising: lifting the plate being out of contact with the surface of the first volume of the molten solder while the knives extend through the second volume of the dross and are at least partially submerged in the first volume of the molten solder when the unit is in the first vertical position; andlowering the plate into contact with the surface of the first volume of the molten solder while the knives extend through the second volume of the dross and are at least partially submerged in the first volume of the molten solder when the unit is in the second vertical position. 16. The method of claim 1, wherein the molten combination of the first volume of the solder and the second volume of the dross is delivered into the first vessel from a second vessel where part of the first volume of the solder was placed into contact with one or more objects to solder the objects and thereby forming the second volume of the dross, and further comprising: removing at least part of the third volume of the solder from the second volume of the dross; andreturning the at least part of the third volume of the solder that is removed from the second volume of the dross to the second vessel where the at least part of the third volume of the solder is placed into contact with one or additional objects to solder the one or more additional objects. 17. The method of claim 16, further comprising soldering one or more additional objects in the second vessel with the at least part of the third volume of the solder that is removed from the second volume of the dross and returned to the second vessel. 18. The method of claim 4, further comprising: receiving the first volume of the dross and the second volume of the molten solder into a separating vessel from a soldering vessel;removing the fourth volume of the one or more oxides of the solder from the separating vessel; andreturning at least part of the third volume of the solder that is separated from the second volume of the dross to the soldering vessel. 19. The method of claim 18, further comprising soldering one or more objects with the at least part of the third volume of the solder that is separated from the second volume of the dross and returned to the soldering vessel. 20. The method of claim 12, further comprising soldering one or more objects with at least part of the third volume of the solder that was separated from the second volume of the dross and returned to the soldering vessel. 21. The method of claim 20, wherein the one or more objects are soldered with the at least part of the third volume of the solder in the soldering vessel.