[특허]Vertical probe array arranged to provide space transformation

[미국특허] Vertical probe array arranged to provide space transformation 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01R-001/073 G01R-001/067
출원번호	US-0693971 (2012-12-04)
등록번호	US-9274143 (2016-03-01)
발명자 / 주소	Kister, January
출원인 / 주소	FormFactor, Inc.
대리인 / 주소	Peacock Myers, P.C.
인용정보	피인용 횟수 : 1 인용 특허 : 212

초록 ▼

Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section.

대표청구항 ▼

1. A probe array comprising: at least two rows of probes, each probe comprising a vertical base section and a vertical tip section;said tip sections aligned along an axis parallel to said at least two rows of probes;adjacent tip sections of said probes comprising a first center to center spacing;adjacent base sections of said probes in each said row comprising a second center to center spacing; andsaid base sections comprising thicknesses greater than said center to center spacing of said adjacent tip sections;wherein said at least two rows are disposed on a same side of said axis so that a distance from the base sections of probes in a first row to said axis is different than a distance from the base sections of probes in a second row to said axis. 2. The apparatus of claim 1 wherein said probe array contacts a contact surface and said rows of said probe array are parallel to a plurality of contact pads on the contact surface, wherein the contact pads are contacted by said tip sections. 3. The apparatus of claim 1 wherein said second center to center spacing is greater than said first center to center spacing. 4. The apparatus of claim 1 wherein said probes comprise vertical probes. 5. The apparatus of claim 4 wherein said vertical probes comprise straight sections. 6. The apparatus of claim 4 wherein said vertical probes comprise curved sections. 7. The apparatus of claim 1 wherein said probes in each said row of said probe array comprise a same shape. 8. The apparatus of claim 1 wherein said probes in each said row of said probe array comprise a different shape. 9. The apparatus of claim 1 wherein said probes provide a substantially same scrub motion on a contact surface. 10. The apparatus of claim 1 wherein said base sections are thicker than said tip sections. 11. The apparatus of claim 1 wherein said probes comprise vertical knee probes. 12. The apparatus of claim 1 wherein at least one probe comprises a positive base to tip offset. 13. The apparatus of claim 1 wherein at least one probe comprises a negative base to tip offset. 14. The apparatus of claim 1 wherein at least one probe comprises a zero base to tip offset. 15. The apparatus of claim 1 wherein a distance between said rows varies from row to row. 16. The apparatus of claim 1 wherein said first center to center spacing of said tip sections is from about 50 μm to about 100 μm. 17. The apparatus of claim 1 wherein said second center to center spacing of said base sections is between about 150 μm to about 200 μm. 18. The apparatus of claim 1 wherein said probes deform primarily in a single plane. 19. The apparatus of claim 1 wherein said probes deform primarily in a single plane, said plane perpendicular to an axis. 20. The apparatus of claim 1 wherein said probes comprise minimal out-of-plane deformation during contact. 21. The apparatus of claim 1 wherein said probes contact a single row of contact pads on a contact surface. 22. The apparatus of claim 1 comprising multiple probe arrays for contacting multiple rows of contact pads on a contact surface. 23. The apparatus of claim 1 wherein said rows of said base array are staggered. 24. The apparatus of claim 1 wherein said probes contact a plurality of contact pads disposed in a corner of an integrated electric circuit. 25. The apparatus of claim 1 wherein said probes comprise at least one base to tip transition region. 26. The apparatus of claim 1 wherein each said tip section comprises a skate. 27. The apparatus of claim 26 wherein said skate comprises a narrower width than said tip section. 28. The apparatus of claim 1 wherein said tip sections comprise an electrically conductive and wear-resistant material. 29. The apparatus of claim 28 wherein said tip sections comprise Rh. 30. The apparatus of claim 28 wherein said tip sections comprise Cr.

이 특허에 인용된 특허 (212) 인용/피인용 타임라인 분석

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Wood, Alan G.; Doan, Trung T.; Hembree, David R., Probe card for testing microelectronic components.
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Kister, January, Probe cards employing probes having retaining portions for potting in a potting region.
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Kister,January, Probe cards employing probes having retaining portions for potting in a retention arrangement.
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Kister,January, Probe cards employing probes having retaining portions for potting in a retention arrangement.
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Kimoto, Gunsei, Probe device.
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Kimoto, Gunsei; Takai, Shinkichi, Probe pin assembly.
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Kister, January, Probe skates for electrical testing of convex pad topologies.
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Kister,January, Probe skates for electrical testing of convex pad topologies.
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Tracy ; John M., Probe station.
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Verkuil Roger Leonard, Probe-oxide-semiconductor method and apparatus for measuring oxide charge on a semiconductor wafer.
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Kister, January, Probes with offset arm and suspension structure.
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Kister, January, Probes with self-cleaning blunt skates for contacting conductive pads.
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Karasawa Wataru (Yokohama JPX), Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer.
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Thomas T. Montoya, Process for testing a semiconductor device.
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Eldridge,Benjamin Niles; Grube,Gary William; Khandros,Igor Yan; Mathieu,Gaetan L., Resilient contact structures formed and then attached to a substrate.
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Wickramasinghe Hermantha K. (Chappaqua NY) Williams Clayton C. (Peekskill NY), Scanning thermal profiler.
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Kister,January; Jaquette,James; Tokraks,Gene, See-saw interconnect assembly with dielectric carrier grid providing spring suspension.
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Kister,January; Jaquette,James; Tokraks,Gene, See-saw interconnect assembly with dielectric carrier grid providing spring suspension.
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Yu, Yuet-Ying; Berger, Daniel G; Bowne, Camille Proietti; Langenthal, Scott; Perry, Charles H; Spoor, Terence; Weiss, Thomas, Self-scrub buckling beam probe.
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Otsuka Kanji (Higashiyamato JPX) Kato Masao (Hadano JPX) Kumagai Takashi (Isehara JPX) Usami Mitsuo (Ohme JPX) Kuroda Shigeo (Ohme JPX) Sahara Kunizo (Nishitama JPX) Yamada Takeo (Koganei JPX) Miyamo, Semiconductor device having leads for mounting to a surface of a printed circuit board.
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Takemoto,Megumi; Maekawa,Shigeki; Kashiba,Yoshihiro; Deguchi,Yoshinori; Miki,Kazunobu, Semiconductor device test probe.
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Takemoto, Megumi; Maekawa, Shigeki; Kashiba, Yoshihiro; Deguchi, Yoshinori; Miki, Kazunobu, Semiconductor device test probe having improved tip portion and manufacturing method thereof.
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Kister,January; Jaquette,James; Fahrner,Steve, Sheet metal interconnect array.
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Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Sockets for electronic components and methods of connecting to electronic components.
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Kister, January, Space transformers employing wire bonds for interconnections with fine pitch contacts.
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Kister,January, Space transformers employing wire bonds for interconnections with fine pitch contacts.
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Kister, January, Straight protruding probe beam contour surfaces.
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Pedder David John,GBX, Structure for testing bare integrated circuit devices.
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Theissen, William F.; Evans, Stephen; McQuade, Francis T.; Kukielka, Zbigniew, Temperature compensated vertical pin probing device.
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Chien,Duke, Terminal for an electrical connector.
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Lenz Seymour S. (P.O. Box 669 Longwood FL 32750), Test probe assembly for microelectronic circuits.
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Beaman Brian S. (Hyde Park NY) Fogel Keith E. (Bardonia NY) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer.
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Jones William H. (Villa Park IL) Chambers Worthy L. (Lombard IL), Thermally responsive controller and switch assembly therefor.
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Byrnes Herbert P. (Poughkeepsie NY) Halbout Jean-Marc (Larchmont NY) Scheuermann Michael R. (Katonah NY) Shapiro Eugene (Stamford CT), Thin interface pellicle for dense arrays of electrical interconnects.
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Vinh Nguyen T., Variable contact pressure probe.
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Kister, January, Vertical guided probe array providing sideways scrub motion.
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Kister, January, Vertical probe array arranged to provide space transformation.
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Okubo, Masao; Okubo, Kazumasa; Iwata, Hiroshi, Vertical probe card.
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Anderson,Michael L.; McCloud,Edward A.; Mostarshed,Shahriar; Casolo,Michael A., Vertical probe card and air cooled probe head system.
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Reeds John W. (Thousand Oaks CA), Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy.
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Longson, Simon; Slocum, Alex, Wafer-level contactor.
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Secker, David A.; Jain, Nirmal, Wirebond assembly for high-speed integrated circuits.
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Kister, January, Probes with high current carrying capability and laser machining methods.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

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[미국특허] Vertical probe array arranged to provide space transformation 원문보기

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[미국특허] Vertical probe array arranged to provide space transformation 원문보기

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이 특허에 인용된 특허 (212) 인용/피인용 타임라인 분석

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