[특허]Method for making a film/board lamination

Method for making a film/board lamination 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B65D-073/00 B32B-037/00 B32B-027/32 B32B-007/12 B32B-027/10
출원번호	US-0706528 (2012-12-06)
등록번호	US-9278507 (2016-03-08)
발명자 / 주소	Rancich, Michael J. Hoffart, Jr., Ronald C.
출원인 / 주소	Illinois Tool Works Inc.
대리인 / 주소	Levenfeld Pearlstein, LLC
인용정보	피인용 횟수 : 0 인용 특허 : 35

초록 ▼

A method for making a film/board laminate for use in pilfer resistant packaging includes providing a non-treated paperboard substrate, adhering a single ply of an oriented film to the substrate, the oriented film being applied at an orientation angle to the board between but not equal to zero degrees and 180 degrees such that a film to substrate adhesion is about 0.5 pli to 1.4 pli, and applying a heat seal layer to the film.

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1. A method for making a film/board laminate for use in pilfer resistant packaging, comprising the steps of: providing a non-treated paperboard substrate;adhering a single ply of an oriented film to the substrate, the oriented film being applied at an orientation angle to the board between but not equal to zero degrees and 180 degrees, wherein adhering the single ply of the oriented film to the substrate includes controlling adhesion of the film to the substrate to be about 0.5 pli to 1.4 pli thereby forming a pilfer resistant laminate; andapplying a heat seal layer to the film,wherein an entirety of the laminate is pilfer resistant and the adhesion of the film to the substrate at a time of manufacture is related to a resistance to tear propagation of the laminate at a time after manufacture. 2. The method of claim 1 wherein the film to substrate adhesion is about 0.7 pli to 1.1 pli. 3. The method of claim 1 wherein the film to substrate adhesion is measured immediately following the adhering step and is no more than 1.4 pli four days following the adhering step. 4. The method of claim 1 wherein the oriented film is an oriented polyolefin film. 5. The method of claim 4 wherein the film is a polyethylene film. 6. The method of claim 5 wherein the polyethylene film is a high density polyethylene (HDPE) film. 7. The method of claim 6 wherein the HDPE film is a spiral cut film cut at an angle of about 37 degrees to 57 degrees relative to a machine direction of the film. 8. The method of claim 7 wherein the spiral cut film is cut an angle of about 37 degrees to 41 degrees relative to the machine direction of the film. 9. The method of claim 1 wherein the film/board laminate is folded over onto itself with the heat seal layers confronting one another. 10. The method of claim 1 wherein the film/board laminate is folded over onto itself with the heat seal layers contacting one another, and wherein the confronting oriented films are cross-oriented relative to one another at an angle of about 74 degrees to 114 degrees from a machine direction of the film. 11. The method of claim 1 wherein the film/board laminate is heat sealed to another film/board laminate, with the heat seal layers confronting one another at a predetermined temperature and pressure. 12. The method of claim 11 wherein the predetermined temperature is about 250 degrees F. to 350 degrees F. 13. The method of claim 11 wherein the film is monoaxially oriented. 14. A method for making a film/board laminate for use in pilfer resistant packaging, comprising the steps of: providing a non-treated paperboard substrate;adhering a single ply of an oriented polyolefin film to the substrate, the oriented polyolefin film being applied at an orientation angle to the board between but not equal to zero degrees and 180 degrees, the oriented polyolefin film being a spiral cut film cut at an angle of about 37 degrees to 57 degrees, and wherein adhering the single ply of the oriented polyolefin film to the substrate includes controlling adhesion of the film to the substrate to be about 0.5 pli to 1.4 pli immediately following the adhesion step and is no more than about 1.6 pli four days following the adhering step to form a pilfer resistant laminate; andapplying a heat seal layer to the film,wherein an entirety of the laminate is pilfer resistant and the adhesion of the film to the substrate at a time of manufacture is related to a resistance to tear propagation of the laminate at a time after manufacture. 15. The method of claim 14 wherein the oriented polyolefin film is spiral cut at an angle of about 37 degrees to 41 degrees. 16. The method of claim 14 wherein the film to substrate adhesion is about 0.7 pli to 1.1 pli. 17. The method of claim 14 wherein the film to substrate adhesion is about 1.4 pli four days following the adhering step. 18. The method of claim 14 wherein the oriented polyolefin film is a polyethylene film. 19. The method of claim 18 wherein the polyethylene film is a high density polyethylene (HDPE) film. 20. The method of claim 14 wherein the film/board laminate is folded over onto itself with the heat seal layers contacting one another, and wherein the confronting oriented films are cross-oriented relative to one another at an angle of about 74 degrees to 114 degrees from a machine direction of the film. 21. The method of claim 14 wherein the film/board laminate is heat sealed to another film/board laminate at a predetermined temperature and pressure. 22. The method of claim 21 wherein the predetermined temperature is about 250 degrees F. to 350 degrees F. 23. The method of claim 21 wherein the predetermined pressure is about 60 psi. 24. The method of claim 14 wherein the film is monoaxially oriented. 25. The method of claim 1, further comprising forming a window in one of or both of the film and substrate.

이 특허에 인용된 특허 (35)

Calvert Barry Gene (Covington VA) Peterson Ralph Scott (Clifton Forge VA), Apparatus for heat sealing paperboard substrates using a uniform energy distributed light energy beam.
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Hession, Christopher J., Blister and package system.
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Palm, Detlef; Schwarz, Peter, Blister box pack for sensitive packaged goods with highly volatile and/or moisture sensitive components.
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Ritter,Karl, Blister display package having tear-resistant security tape.
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Giovannone Anthony (Osterville MA), Blister packaging card for use in making plastic blister packages.
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Freeze, Timothy, Child resistant blister package.
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Hession, Christopher J., Child resistant blister package.
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Amendt,Charles E.; Barnes,Christopher C. E., Cross laminated oriented plastic film with integral paperboard core.
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Grosskopf, Glenn A., Display chamber packaging container and method for making.
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Smith, Keith; Durham, James C.; Greiwe, Scott D., Display packaging system.
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Levy, Gordon, Drug card.
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Finestone Arnold B. (2400 Presidential Way West Palm Beach FL 33401) Bloch Gilbert (3349 S. Malo Ct. Palm Beach Gardens FL 33410), Facing for wall board.
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Kenneth John Bryden ; David Hillis Hawes ; Ralph Scott Peterson, Laminate substrate with oxygen barrier properties.
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Calvert, Barry Gene; Mulcahy, Leo Thomas; Parks, Christopher Jude, Method and apparatus for enhancing film adhesion when extruding polyethylene terephthalate onto paperboard.
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Barnes Christopher C. E. ; Amendt Charles E. ; Nimz Steven S., Multi-layer films.
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Massouda Debora F. (Silver Spring MD), Oxygen and flavor barrier laminate for liquid packaging.
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Parks Christopher J. ; Massouda Debora F., Oxygen and flavor barrier laminate including amorphous nylon.
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Parks Christopher J. ; Massouda Debora F., Oxygen and flavor barrier laminate including amorphous nylon.
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Dillon Ralph L. (Fremont Township ; Lake County IL), Package having an improved opening feature.
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Kellar,David S.; Crystal,Jeremy B.; Hopfer,Timothy J.; Matthews,Peter M.; Hackleman,George N.; Sharkey,Deirdre M., Packaging.
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Lind Robert,FIX ; Uimonen Ulla,FIX ; Sonne Hanna,FIX ; Laiho Juhani,FIX ; Nummela Jarmo,FIX, Packaging.
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Tachikawa, Kimiko; Tamezumi, Daisuke, Packaging and assemblying method thereof.
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Grosskopf, Glenn A., Packaging container with criss-cross grain pattern having product holding chambers and method for making the same.
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Falat Ladislav ; Sasthav Mohan, Packaging material having good moisture barrier properties from C1S paperboard.
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Peterson Ralph Scott, Paperboard laminate for pharmaceutical blister packaging using a hot melt adhesive and calcium carbonate blend.
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Farrell Robert A. (Silver Spring MD) Parks Christopher J. (Ellicott City MD), Paperboard packaging containing a PVOH barrier.
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Holbert,Victor P.; Reed,David, Paperboard substrate for blister packaging.
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Casey Harry B. (Covington VA) Huffman Todd H. (Richmond VA) Massouda Debora F. (Silver Spring MD), Paperboard/polymer laminate for blister pack.
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Godfrey Thomas E. ; Usher Christopher T. ; Knauss Eric ; Mason ; Sr. Wayne G., Pharmaceutical containment package.
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Grosskopf,Glenn A., Pilfer-resistant packaging with criss-cross grain pattern.
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Tilton, Christopher R., Printed packaging.
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Pirro Jeffrey P. ; Casanova Julio C. ; Uren Wayne E. ; Ferguson Mark A., Product display package.
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Saito Toshiki,JPX, Protruding case for mail.
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Johnstone Scott Bowen ; Jones Brad Allen ; Mellon Mark ; Rigby William Roger, Unit dose packaging system (UDPS) having a child resistant locking feature.
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Jones, Brad A.; Karow, Meredith M.; Sasthav, Mohan, Unit dose packaging system with exterior pocket feature.
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