Cooling systems and heat exchangers for cooling computer components
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
F28D-001/04
F28D-001/053
F28F-001/02
F28F-001/12
H01L-023/473
F28D-021/00
출원번호
US-0283299
(2014-05-21)
등록번호
US-9288935
(2016-03-15)
발명자
/ 주소
Yatskov, Alexander I.
출원인 / 주소
Cray Inc.
대리인 / 주소
Perkins Coie LLP
인용정보
피인용 횟수 :
1인용 특허 :
252
초록▼
Computer systems having heat exchangers for cooling computer components are disclosed herein. The computer systems include a computer cabinet having an air inlet, an air outlet spaced apart from the air inlet, and a plurality of computer module compartments positioned between the air inlet and the a
Computer systems having heat exchangers for cooling computer components are disclosed herein. The computer systems include a computer cabinet having an air inlet, an air outlet spaced apart from the air inlet, and a plurality of computer module compartments positioned between the air inlet and the air outlet. The air inlet, the air outlet, and the computer module compartments define an air flow path through the computer cabinet. The computer systems also include a heat exchanger positioned between two adjacent computer module compartments. The heat exchanger includes a plurality of heat exchange elements canted relative to the air flow path.
대표청구항▼
1. A computer system, comprising: a computer cabinet having a plurality of computer module compartments positioned between an air inlet and an air outlet, wherein the air inlet, the air outlet, and the computer module compartments define an air flow path through the computer cabinet; anda heat excha
1. A computer system, comprising: a computer cabinet having a plurality of computer module compartments positioned between an air inlet and an air outlet, wherein the air inlet, the air outlet, and the computer module compartments define an air flow path through the computer cabinet; anda heat exchanger positioned between two adjacent computer module compartments, the heat exchanger including: a first manifold having a first divider separating the first manifold into a first inlet volume and a first outlet volume;a second manifold having a second divider separating the second manifold into a second inlet volume and a second outlet volume;a first heat exchange element in fluid communication with the first inlet volume and the second outlet volume while being isolated from the second inlet volume and the first outlet volume; anda second heat exchange element in fluid communication with the second inlet volume and the first outlet volume while being isolated from the first inlet volume and the second outlet volume, wherein the first inlet volume, the first heat exchange element, and the second outlet volume at least partially define a first flow path and the second inlet volume, the second heat exchange element, and the first outlet volume at least partially define a second flow path in fluid isolation from the first flow path. 2. The computer system of claim 1, further comprising a first working fluid portion in the first flow path and a second working fluid portion in the second flow path, and wherein the first working fluid portion and the second working fluid portion have different flow directions when flowing through the first and second heat exchange elements. 3. The computer system of claim 1, further comprising a first working fluid portion in the first flow path and a second working fluid portion in the second flow path, and wherein computer system further includes a directing means for directing the first working fluid portion to flow through the first heat exchange element in a first direction and the second working fluid portion to flow through the second heat exchange element in a second direction opposite of the first direction. 4. The computer system of claim 1 wherein the first flow path is in fluid isolation from the second flow path. 5. The computer system of claim 1, further comprising a first working fluid portion in the first flow path and a second working fluid portion in the second flow path, wherein the first working fluid portion has a first physical characteristic and the second working fluid portion has a second physical characteristic that is different than the first physical characteristic. 6. A method for operating a computer cabinet having a plurality of computer module compartments positioned between an air inlet and an air outlet and a heat exchanger positioned between two adjacent computer module compartments, the method comprising: flowing a first working fluid portion along a first inlet volume in a first manifold of the heat exchanger;flowing a second working fluid portion along a second inlet volume in a second manifold of the heat exchanger, wherein the second manifold is spaced apart from the first manifold;flowing the first working fluid portion from the first inlet volume along a first flow path in a first internal channel of an individual heat exchange element of the heat exchanger;flowing the second working fluid portion from the second inlet volume along a second flow path in a second internal channel of the individual heat exchange element of the heat exchanger, the first and second internal channels being in fluid isolation from each other;flowing the first working fluid portion from the first internal channel into a first outlet volume of the second manifold;flowing the second working fluid portion from the second internal channel into a second outlet volume of the first manifold, wherein the first manifold includes a first divider separating the first manifold into the first inlet volume and the second outlet volume, wherein the second manifold includes a second divider separating the second manifold into the first outlet volume and the second inlet volume, wherein the first inlet volume is positioned toward a first end of the individual heat exchange element and the second inlet volume is positioned toward a second end of the individual heat exchange element opposite the first end, wherein the first outlet volume is positioned toward the second end of the individual heat exchange element and the second outlet volume is positioned toward the first end of the individual heat exchange element, and wherein the first and second working fluids portions flow in generally opposite directions across the individual heat exchange element. 7. The method of claim 6, further comprising controlling at least one characteristic of at least one of the first and second working fluid portions. 8. The method of claim 6, further comprising controlling a flow rate, a heat transfer coefficient, a boiling point, and/or a heat of vaporization of at least one of the first and second working fluid portions. 9. The method of claim 6, further comprising drawing air into the computer cabinet via the air inlet, flowing the air through the heat exchanger and past the individual heat exchange element, and discharging the air from the computer cabinet via the air outlet. 10. The method of claim 6, further comprising flowing air along an air flow path through the heat exchanger and past the individual heat exchange element, wherein the first and second flow paths are arranged sequentially along the air flow path. 11. A computer system, comprising: a computer cabinet having a plurality of computer module compartments positioned between an air inlet and an air outlet, wherein the air inlet, the air outlet, and the computer module compartments define an air flow path through the computer cabinet; anda heat exchanger positioned between two adjacent computer module compartments, the heat exchanger including: a first manifold having a first divider separating the first manifold into a first inlet volume and a first outlet volume;a second manifold having a second divider separating the second manifold into a second inlet volume and a second outlet volume; andat least one heat exchange element positioned between the first manifold and the second manifold, wherein the individual heat exchange element includes a first internal channel portion and a second internal channel portion, wherein the first internal channel portion is in fluid communication with the first inlet volume and the second outlet volume, and wherein the second internal channel portion is in fluid communication with the second inlet volume and the first outlet volume. 12. The computer system of claim 11 wherein the first inlet volume, the first internal channel portion, and the second outlet volume at least partially define a first flow path, wherein the second inlet volume, the second internal channel portion, and the first outlet volume at least partially define a second flow path, and wherein the first flow path is in fluid isolation from the second flow path. 13. The computer system of claim 12 wherein the first and second flow paths are arranged sequentially along the air flow path. 14. The computer system of claim 12, further comprising a first working fluid portion in the first flow path and a second working fluid portion in the second flow path, wherein the first working fluid portion and the second working fluid portion have different flow directions when flowing through the individual heat exchange element. 15. The computer system of claim 12, further comprising a first working fluid portion in the first flow path and a second working fluid portion in the second flow path, wherein the first working fluid portion has a first physical characteristic and the second working fluid portion has a second physical characteristic that is different than the first physical characteristic. 16. The computer system of claim 12, further comprising a first working fluid portion in the first flow path and a second working fluid portion in the second flow path, wherein the first working fluid portion has at least one of a different flow rate, a different heat transfer coefficient, a different boiling point, or a different heat of vaporization than the second working fluid portion. 17. The computer system of claim 11 wherein the individual heat exchange element carries a plurality of fins on an external portion thereof. 18. The computer system of claim 11, wherein the at least one heat exchange element includes a plurality of heat exchange elements positioned between the first manifold and the second manifold, and wherein all of the heat exchange elements are functionally identical.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (252)
Doll,Wade J., Acoustic absorbers for use with computer cabinet fans and other cooling systems.
Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system.
Chu,Richard C.; Ellsworth, Jr.,Michael J.; Porter,Donald W.; Schmidt,Roger R.; Simons,Robert E., Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack.
Bhargava Vikram (Alpharetta GA) Muntner Donald A. (Stone Mountain GA) Cone Ronald H. (Jefferson GA) Heberling James R. (Lawrenceville GA) Hicks Mark E. (Norcross GA) Harris Samuel W. (Norcross GA) Ku, Apparatus for rack mounting multiple circuit boards.
Yatskov,Alexander I.; Hellriegel,Stephen V. R., Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses.
Yatskov,Alexander I.; Hellriegel,Stephen V.R., Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures.
Mondor Robert M. (Sutton MA) Howards Mark (Belmont MA) Barker ; III Charles R. (Harvard MA) Selling Alan R. (Franklin MA), Cabinet for a computer assembly.
Bradley Morgan J. (Harrisburg PA) Schmedding George R. (Hummelstown PA) Stuckey Richard A. (Annville PA), Canted coil spring array and method for producing the same.
Dolbear Thomas P. (Austin TX) Nelson Richard D. (Austin TX) Gibson David A. (Austin TX) Gupta Omkarnath R. (Fremont CA), Coiled spring heat transfer element.
Faneuf, Barrett M.; Holalkere, Ven R.; Montgomery, Stephen W., Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure.
Lancia Frederick N. (Columbus OH) Kesterson Albert O. (Columbus OH) Feeney Edward K. (Worthington OH) Liebert Ralph C. (Worthington OH), Control system for an air conditioning system having supplementary, ambient derived cooling.
Borror, Steven A; DiPaolo, Franklin E; Harvey, Thomas E; Madara, Steven M; Mam, Reasey J; Sillato, Stephen C, Cooling system for high density heat load.
Miller David Jonathan,GBX ; Sams Ian James,GBX ; Holland Michael James,GBX ; Fields Simon David,GBX, Cooling system for use in cooling electronic equipment.
Shariff Sadiq A. (Palos Park IL) Bharteey Brij M. (DuPage IL) Mehkri Shahab A. (Rich IL), Electric control center having integral air-ventilation system.
Davis Michael I. (Winchester GB2) Garrett Michael J. (Winchester GB2) Wiseman John A. (Winchester GB2), Electronic assembly with forced convection cooling.
Madara, Steven M.; Sillato, Steve; Harvey, Thomas E.; Dukes, David A., Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation.
Shah, Hemant S.; Hollingshead, John Stuart; Wang, John; Thawani, Prakash Tuljaram; Kosik, Richard Charles; Kumar, Mukesh, Fan shroud with built in noise reduction.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Furey, Edward; Schmidt, Roger R.; Simons, Robert E., Method and apparatus for combined air and liquid cooling of stacked electronics components.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Method and system for cooling electronics racks using pre-cooled air.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Method of assembling a cooling system for a multi-component electronics system.
Melane Marcus L. ; Pisterzi Michael J. ; Mills Edward G. ; Hargroves Curtis L., Modular electronic enclosure having rotational molded plastic interlocking components.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Monitoring method and system for determining rack airflow rate and rack power consumption.
Hobbs Forrest B. (Eau Claire WI) Blewett Richard G. (Altoona WI) Wentzka Scott A. (Eau Claire WI) Chen Steve S. (Eau Claire WI) Sheets Kitrick B. (Eau Claire WI) Stevens Sheldon D. (Eau Claire WI), Packaging architecture for a data server.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use.
Amaike, Takeshi; Heo, Seon Meyong; Watanabe, Makoto; Yasaku, Takayuki; Izumi, Shinya; Shikamura, Naoya, Server unit comprising stacked multiple server unit cabinets accommodating multiple cartridge type server units.
Fernandez,Kenneth Richard; Fleiner,Claudio Matthias; Garner,Robert Barton; Huels,Harald; Ries,Manfred; Wilcke,Winfried Wolfgang, System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Temperature-based monitoring method and system for determining first and second fluid flow rates through a heat exchanger.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.