Thermostat-controlled coolant flow within a heat sink
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F16K-031/70
F16K-031/00
F28F-027/02
F28F-027/00
F28F-003/12
H05K-007/20
출원번호
US-0706557
(2012-12-06)
등록번호
US-9291281
(2016-03-22)
발명자
/ 주소
Campbell, Levi A.
Chu, Richard C.
David, Milnes P.
Ellsworth, Jr., Michael J.
Iyengar, Madhusudan K.
Schmidt, Roger R.
Simons, Robert E.
출원인 / 주소
INTERNATIONAL BUSINESS MACHINES CORPORATION
대리인 / 주소
Chiu, Esq., Steven
인용정보
피인용 횟수 :
0인용 특허 :
16
초록▼
Cooling apparatuses and methods are presented for facilitating dissipation of heat generated by one or more electronic components. The apparatuses include, for instance, a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one
Cooling apparatuses and methods are presented for facilitating dissipation of heat generated by one or more electronic components. The apparatuses include, for instance, a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s).
대표청구항▼
1. A cooling apparatus comprising: a coolant-cooled heat sink, the coolant-cooled heat sink facilitating dissipation of heat generated by one or more electronic components, and comprising a thermally conductive element coupled to the one or more electronic components and defining, at least in part,
1. A cooling apparatus comprising: a coolant-cooled heat sink, the coolant-cooled heat sink facilitating dissipation of heat generated by one or more electronic components, and comprising a thermally conductive element coupled to the one or more electronic components and defining, at least in part, a coolant-carrying channel, the thermally conductive element including a cylindrical-shaped bore intersecting the coolant-carrying channel and extending into the thermally conductive element towards the one or more electronic components; anda thermostat-controlled valve disposed, at least partially, within the cylindrical-shaped bore, the thermostat-controlled valve comprising: a valve disk rotatable between an open position where coolant is allowed to flow through the coolant-carrying channel, and a closed position where coolant is blocked from flowing through the coolant-carrying channel, the valve disk being a flat disk residing within the cylindrical-shaped bore and intersecting the coolant-carrying channel; anda thermal-sensitive actuator mechanically coupled to the valve disk to rotate the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by at least one electronic component of the one or more electronic components, the thermal-sensitive actuator being disposed within the cylindrical-shaped bore in the thermally conductive element between the one or more electronic components and the coolant-carrying channel. 2. The cooling apparatus of claim 1, wherein the coolant-cooled heat sink is configured to couple to the one or more electronic components, and wherein the cylindrical-shaped bore with the thermostat-controlled valve disposed, at least partially, therein, is aligned over the at least one electronic component of the one or more electronic components. 3. The cooling apparatus of claim 1, wherein the coolant-cooled heat sink comprises a cold plate base and a cover, the cold plate base comprising the thermally conductive element, and wherein the valve disk and the thermal-sensitive actuator are both disposed within the cylindrical-shaped bore in the cold plate base, the thermal-sensitive actuator comprising a coiled actuator disposed within the cylindrical-shaped bore, below the coolant-carrying channel and the valve disk. 4. The cooling apparatus of claim 1, wherein the coolant-cooled heat sink comprises multiple coolant-carrying channels and multiple cylindrical-shaped bores intersecting the multiple coolant-carrying channels, each cylindrical-shaped bore intersecting a respective coolant-carrying channel of the multiple coolant-carrying channels; and wherein the cooling apparatus further comprises multiple thermostat-controlled valves, each thermostat-controlled valve being disposed, at least partially, within a respective cylindrical-shaped bore of the multiple cylindrical-shaped bores, wherein the multiple thermostat-controlled valves separately control coolant flow through the multiple coolant-carrying channels of the coolant-cooled heat sink. 5. The cooling apparatus of claim 1, wherein the valve disk comprises a coolant channel extending thereacross, and wherein in the open position, the coolant channel of the valve disk substantially aligns to an axis of the coolant-carrying channel of the coolant-cooled heat sink, and in the closed position, the coolant channel of the valve disk is rotated away from and misaligned to the axis of the coolant-carrying channel of the coolant-cooled heat sink. 6. The cooling apparatus of claim 1, wherein the valve disk defines a variable coolant flow cross-sectional opening with reference to the coolant-carrying channel, dependent on the rotational orientation thereof, as controlled by the thermal-sensitive actuator. 7. The cooling apparatus of claim 1, wherein the thermal-sensitive actuator comprises a coiled actuator disposed within the cylindrical-shaped bore, below the coolant-carrying channel and the valve disk, the coiled actuator being secured at one end to the coolant-cooled heat sink, and at another end to the valve disk. 8. The cooling apparatus of claim 7, wherein the one end of the coiled actuator comprises an outer end at an outer diameter of the coiled actuator, and the another end of the coiled actuator comprises an inner end at an inner diameter of the coiled actuator. 9. The cooling apparatus of claim 7, wherein the coiled actuator comprises a coiled foil material with an uncoiled length greater than one meter. 10. The cooling apparatus of claim 1, wherein the thermal-sensitive actuator comprises a coiled actuator fabricated of a manganese-bronze alloy. 11. A cooled electronic system comprising: one or more electronic components; anda cooling apparatus, the cooling apparatus comprising: a coolant-cooled heat sink, the coolant-cooled heat sink facilitating dissipation of heat generated by the one or more electronic components, and comprising a thermally conductive element coupled to the one or more electronic components and defining, at least in part, multiple coolant-carrying channels, the thermally conductive element including multiple cylindrical-shaped bores, each cylindrical-shaped bore intersecting a respective coolant-carrying channel of the multiple coolant-carrying channels, and each cylindrical-shaped bore extending into the thermally conductive element toward the one or more electronic components; andmultiple thermostat-controlled valves disposed, at least partially, within the multiple cylindrical-shaped bores, one thermostat-controlled valve of the multiple thermostat-controlled valves comprising: a valve disk rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position were coolant is blocked from flowing through the respective coolant-carrying channel, the valve disk being a flat disk residing within a respective cylindrical-shaped bore and intersecting a respective coolant-carrying channel of the multiple coolant-carrying channels; anda thermal-sensitive actuator mechanically coupled to the valve disk to rotate the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by at least one electronic component of the one or more electronic components, the thermal-sensitive actuator being disposed within the respective cylindrical-shaped bore in the thermally conductive element between the one or more electronic components and the respective coolant-carrying channel. 12. The cooled electronic system of claim 11, wherein each thermostat-controlled valve of the multiple thermostat-controlled valves is disposed, at least partially, within a respective cylindrical-shaped bore of the multiple cylindrical-shaped bores, and intersects a respective coolant-carrying channel of the multiple coolant-carrying channels, and each thermostat-controlled valve of the multiple thermostat-controlled valves comprises: a valve disk rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective coolant-carrying channel; anda thermal-sensitive actuator mechanically coupled to rotate the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by at least one electronic component of the one or more electronic components. 13. The cooled electronic system of claim 11, wherein the coolant-cooled heat sink comprises a cold plate base and a cover, the cold plate base comprising the thermally conductive element, and wherein the one thermostat-controlled valve is disposed within the respective cylindrical-shaped bore in the cold plate base, and the thermal-sensitive actuator comprises a coiled actuator disposed within the respective cylindrical-shaped bore, below the coolant-carrying channel. 14. The cooled electronic system of claim 11, wherein the valve disk comprises a coolant channel extending thereacross, and wherein in the open position, the coolant channel of the valve disk substantially aligns to an axis of the respective coolant-carrying channel of the coolant-cooled heat sink, and in the closed position, the coolant channel of the valve disk is rotated away from and misaligned to the axis of the coolant-carrying channel of the coolant-cooled heat sink. 15. The cooled electronic system of claim 11, wherein the valve disk defines a variable coolant flow cross-sectional opening with reference to the respective coolant-carrying channel, dependent on the rotational orientation thereof, as controlled by the thermal-sensitive actuator. 16. The cooled electronic system of claim 11, wherein the thermal-sensitive actuator comprises a coiled actuator disposed within the respective cylindrical-shaped bore of the multiple cylindrical-shaped bores, below the respective coolant-carrying channel and the valve disk, the coiled actuator being secured at one end to the coolant-cooled heat sink, and at another end to the valve disk. 17. The cooled electronic system of claim 16, wherein the one end of the coiled actuator comprises an outer end at an outer diameter of the coiled actuator, and the another end of the coiled actuator comprises an inner end at an inner diameter of the coiled actuator.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (16)
Hall ; Jr. John E. (P.O. Box 1445 Ruidoso NM 88345), Apparatus for recovering and saving chilled water in hot water lines having adjustable thermostatic control.
Zaehring Gerhard (Worthsee DEX) Prodehl Christian (Martinsried DEX), Device for controlling the throat areas between the diffusor guide vanes of a centrifugal compressor of a gas turbine en.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center.
Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
Ellsworth, Jr., Michael J.; Krug, Jr., Francis R.; Mullady, Robert K.; Schmidt, Roger R.; Seminaro, Edward J., System and method for facilitating cooling of a liquid-cooled electronics rack.
Krempel,Benjamin J., Systems for regulating the temperature of a heating or cooling device using non-electric controllers and non-electric controllers therefor.
Brunschwiler, Thomas J.; Linderman, Ryan J.; Michel, Bruno; Ruetsche, Erich M., Variable flow computer cooling system for a data center and method of operation.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.