이 특허에 인용된 특허 (224) 인용/피인용 타임라인 분석

1. Schemmel Floyd F. (Sherman TX), Adjustable probe for probe assembly.

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2. Komatsu Fumio (Tokyo JPX) Miyoshi Motosuke (Fujisawa JPX) Okumura Katsuya (Yokohama JPX), Apparatus and method for controlling irradiation of an electron beam at a fixed position in an electron beam tester syst.

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3. Fredrickson Toby Alan ; Hornchek Eric D., Apparatus and method for testing chip scale package integrated circuits.

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4. Doemens Guenter (Holzkirchen DEX) Rose Thomas (Munich DEX), Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards.

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5. Malladi Deviprasad (Campbell CA) Hanson Lee Frederick (Cupertino CA) Kahahane Jean (Redwood City CA), Apparatus for testing flip chip or wire bond integrated circuits.

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6. Benedetto William E. (Succasunna NJ) Moran Joseph M. (Berkeley Heights NJ), Apparatus having a buckling beam probe assembly.

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7. Theppakuttai, Senthil; Klaerner, Peter J.; Bradach, Jason; Cunningham, Mark; Tunaboylu, Bahadir, Approach for assembling and repairing probe assemblies using laser welding.

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8. Dabrowiecki Krzysztof ; Kister January, Assembly structure for making integrated circuit chip probe cards.

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9. Dabrowiecki Krzysztof ; Kister January ; Lobacz Jerzy, Assembly structure for making integrated circuit chip probe cards.

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10. David James J. (Sturbridge MA), Board mounted connector system.

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11. Lin, Kuan-Min; Shen, Jin-Ji, Bonding pad with separate bonding and probing areas.

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12. Kister,January; Dabrowiecki,Krzysztof, Bundled probe apparatus for multiple terminal contacting.

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13. Chen,Richard T.; Kruglick,Ezekiel J. J.; Bang,Christopher A.; Smalley,Dennis R.; Lembrikov,Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.

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14. Chen,Richard T.; Kruglick,Ezekiel J. J.; Bang,Christopher A.; Smalley,Dennis R.; Lembrikov,Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.

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15. Kister,January, Cantilever probe with dual plane fixture and probe apparatus therewith.

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16. Stowers Jeffrey P. (Stanton VA) Burgers Henri T. (Grottoes VA) Blackard Paul D. (Waynesboro VA), Coaxial double-headed spring contact probe assembly.

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17. Stowers Jeffrey P. ; Burgers Henri T. ; Blackard Paul D., Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith.

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18. Ohkubo Masao (Tokyo JPX) Yoshimitsu Yasuro (Tokyo JPX), Complex probe card for testing a semiconductor wafer.

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19. Khandros Igor Y. ; Mathieu Gaetan L., Composite interconnection element for microelectronic components, and method of making same.

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20. Cooper,Timothy E.; Eldridge,Benjamin N.; Khandros,Igor Y.; Martens,Rod; Mathieu,Gaetan L., Composite motion probing.

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21. Mok, Sammy; Chong, Fu Chiung; Swiatowiec, Frank John; Lahiri, Syamal Kumar; Haemer, Joseph Michael, Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs.

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22. Gunsei Kimoto JP, Contact and contact assembly using the same.

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23. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L. ; Dozier Thomas H. ; Smith William D., Contact carriers (tiles) for populating larger substrates with spring contacts.

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24. Byrnes Herbert P. (Poughkeepsie NY) Wahl Richard (Fishkill NY), Contact for an electrical contactor assembly.

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25. Satoh, Shuichi; Fukunaga, Masami, Contact pin assembly, contact pin assembly manufacturing method, contact pin assembling structure, contact pin assembling structure manufacturing method, and socket for electrical parts.

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26. Kurotori, Fumio; Ishikawa, Takaji; Saito, Tadao, Contact pin probe card and electronic device test apparatus using same.

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27. Haga,Tsuyoshi; Shimada,Shigeki; Kimura,Atsushi, Contact probe.

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28. Byrnes Herbert P. (Poughkeepsie NY) Wahl Richard (Fishkill NY), Contact probe assembly having rotatable contacting probe elements.

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29. Zhou, Yu; Yu, David, Contact structure and production method thereof and probe contact assembly using same.

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30. Zhou, Yu; Yu, David; Aldaz, Robert Edward; Khoury, Theodore A., Contact structure and production method thereof and probe contact assembly using same.

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31. Zhou, Yu; Yu, David; Aldaz, Robert Edward; Khoury, Theodore A., Contact structure and production method thereof and probe contact assembly using same.

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32. Zhou, Yu; Yu, David; Aldaz, Robert Edward; Khoury, Theodore A., Contact structure and production method thereof and probe contact assembly using same.

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33. Zhou, Yu; Yu, David; Aldaz, Robert Edward; Khoury, Theodore A., Contact structure production method.

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34. Hohenwarter, Gert K. G., Contact structure with flexible cable and probe contact assembly using same.

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35. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Alec Madsen ; Gaetan L. Mathieu, Contact structures with blades having a wiping motion.

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36. Krger Gustav (Herrenberg DEX) Hinnerwisch Sven (Nufringen DEX), Contactor for an electronic tester.

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37. Kister, January, Continuously profiled probe beam.

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38. Kister,January, Double acting spring probe.

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39. Kister January, Dual contact probe assembly for testing integrated circuits.

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40. Baumberger John G. (Johnson City NY) Kershaw James J. (Endwell NY) Petrozello James R. (Endicott NY), Dual element electrical contact and connector assembly utilizing same.

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41. Cosmo Nicola (Harrisburg PA), Electrical compression connector.

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42. Distefano Thomas H. ; Fjelstad Joseph, Electrical connection with inwardly deformable contacts.

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43. Feigenbaum Haim (Irvine CA) Crumly William R. (Anaheim CA) Schreiber Christopher M. (Newport Beach CA), Electrical connections with shaped contacts.

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44. Asakawa Kazushige (Yokohama JPX) Fukushima Minoru (Yokohama JPX) Fujikura Mitsuo (Zama JPX), Electrical connector and terminal therefor.

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45. Difrancesco Louis (Hayward CA), Electrical interconnect using particle enhanced joining of metal surfaces.

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46. Richardson Neil (Mountain View CA), Electron beam test probe system for analyzing integrated circuits.

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47. Kasai Ichiro (Santa Barbara CA) Osgood Roderic L. (Goleta CA) Burgett Charley B. (Santa Barbara CA) Joyce Richard J. (Thousand Oaks CA) Warfield Michael D. (Oxnard CA), Electron-beam probing of photodiodes.

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48. Tomaru Kazuhiko,JPX ; Handa Ryuichi,JPX ; Yoneyama Tsutomu,JPX, Electrostatic chuck.

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49. Colvin James Barry, Elimination of vibration by vibration coupling in microscopy applications.

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50. Swettlen, Tim; Pan, Jin; Zhu, Hua; Ding, Jun, Embedded voltage regulator and active transient control device in probe head for improved power delivery and method.

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51. Margozzi Paul D. (San Jose CA), Environmental box for automated wafer probing.

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52. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.

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53. Fjelstad Joseph ; DiStefano Thomas H. ; Karavakis Konstantine ; Faraci Anthony B. ; Nguyen Tan, Flexible connectors for microelectronic elements.

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54. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.

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55. Van Loan David R. ; St. Onge Gary F. ; Swart Mark A., Floating spring probe wireless test fixture.

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56. Kister,January, Freely deflecting knee probe with controlled scrub motion.

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57. Chapin Fletcher W. (Vestal NY) Dranchak David W. (Endwell NY) Engle David E. (Vestal NY) Hall Richard R. (Endwell NY) Macek Thomas G. (Endicott NY), High density connector.

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58. Lemke Timothy A. ; Houtz Timothy W., High density connector.

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59. Brian Samuel Beaman ; Keith Edward Fogel ; Paul Alfred Lauro ; Maurice Heathcote Norcott ; Da-Yuan Shih ; George Frederick Walker, High density integrated circuit apparatus, test probe and methods of use thereof.

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60. Malo Cheryne (Foxboro MA) Marian Steven P. (Plainville MA) Mendenhall David W. (Greenville RI), High density parallel interconnect.

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61. Miller,Charles A.; Eldridge,Benjamin N., High density planar electrical interface.

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62. Parrish Frank, High density printed circuit board.

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63. Coberly ; Charles W. ; Lewis ; Howard A., High frequency probe.

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64. Jones Mark R. ; Khoury Theodore A., High performance integrated circuit chip package.

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65. Miller, Charles A., High performance probe system.

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66. Miller,Charles A., High performance probe system.

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67. Pendse Rajendra D. (Fremont CA), High pin count package for semiconductor device.

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68. Kister January, High temperature probe card for testing integrated circuits.

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69. Mai, Phillip, Highly resilient cantilever spring probe for testing ICs.

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70. Mardi, Mohsen H.; Dang, Elvin P., Hybrid probe card.

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71. Tojo Toru (Yamato JPX) Sugihara Kazuyoshi (Kawasaki JPX), IC Tester using an electron beam capable of easily setting a probe card unit for wafers & packaged IC\s to be tested.

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72. Tanioka,Michinobu; Nemoto,Yoshihiko; Ito,Katsuyuki, Inspection probe, method for preparing the same, and method for inspecting elements.

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73. Colvin James Barry, Integrated circuit failure analysis using color voltage contrast.

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74. Boll Gregory G. (Watchung NJ) Boll Harry J. (Berkeley Heights NJ), Integrated circuit probing apparatus.

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75. Albrow Robert ; Klugkist Bert, Integrated circuit test head.

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76. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Madsen, Alec; Mathieu, Gaetan L., Interconnection element with contact blade.

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77. Kister, January, Interface structure for contacting probe beams.

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78. Kister, January, Knee probe having increased scrub motion.

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79. Kister, January, Knee probe having reduced thickness section for control of scrub motion.

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80. Kister, January, Knee probe having reduced thickness section for control of scrub motion.

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81. Khandros, Igor Y; Pedersen, David V.; Whitten, Ralph G., Large contactor with multiple, aligned contactor units.

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82. Kister January (Palo Alto CA), Large scale protrusion membrane for semiconductor devices under test with very high pin counts.

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83. Kister, January, Layered probes with core.

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84. Mathieu Gaetan L. ; Eldridge Benjamin N. ; Grube Gary W., Lithographic contact elements.

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85. Sayre Tracy L. ; Slutz Robert A. ; Kanack Kris J., Loaded-board, guided-probe test fixture.

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86. Tracy L. Sayre ; Robert A. Slutz ; Kris J. Kanack, Loaded-board, guided-probe test fixture.

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87. Chism Warren L. (Vancouver WA), Low capacitance probe tip.

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88. Kister, January, Low profile probe having improved mechanical scrub and reduced contact inductance.

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89. Kister, January, Low profile probe having improved mechanical scrub and reduced contact inductance.

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90. Kister, January, Low profile probe having improved mechanical scrub and reduced contact inductance.

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91. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.

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92. Smith David A. (Katonah NY) Wells Oliver C. (Yorktown Heights NY), Low-energy scanning transmission electron microscope.

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93. Leedy Glenn J. (Santa Barbara CA), Making and testing an integrated circuit using high density probe points.

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94. Kister January ; Lobacz Jerzy, Membrane for holding a probe tip in proper location.

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95. Gleason K. Reed ; Smith Kenneth R. ; Bayne Mike, Membrane probing system with local contact scrub.

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96. Gleason,K. Reed; Smith,Kenneth R.; Bayne,Mike, Membrane probing system with local contact scrub.

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97. K. Reed Gleason ; Kenneth R. Smith ; Mike Bayne, Membrane probing system with local contact scrub.

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98. Kister January, Method and apparatus for aligning probes.

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99. Engelking Steven ; Deckert Richard Allan ; Evans Joey Dean, Method and apparatus for electrically testing semiconductor devices fabricated on a wafer.

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100. Throssel Fred, Method and apparatus for mounting, inspecting and adjusting probe card needles.

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101. Cooper,Timothy E.; Eldridge,Benjamin N.; Khandros,Igor Y.; Martens,Rod; Mathieu,Gaetan L., Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component.

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102. Richard P. Mozzetta, Method and apparatus for testing an electronic assembly.

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103. Kister January (Menlo Park CA), Method and circuit testing apparatus for equalizing a contact force between probes and pads.

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104. Cohen Adam L., Method for electrochemical fabrication.

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105. Kister, January, Method for making a probe apparatus for testing integrated circuits.

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106. Kister January, Method for making a probe preserving a uniform stress distribution under deflection.

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107. Eldridge,Benjamin N.; Grube,Gary W.; Khandros,Igor Y.; Mathieu,Gaetan L., Method for mounting a plurality of spring contact elements.

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108. Frank Franzen DE, Method for potting a populated assembly using an anti-vibration potting compound, populated assembly and controller having a populated assembly.

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109. Montoya Thomas T., Method for probing a semiconductor wafer using a motor controlled scrub process.

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110. Iyer,Rajesh V.; Tettemer,Susan A.; Tardiff,John P; Knowles,Shawn D., Method of attaching a capacitor to a feedthrough assembly of a medical device.

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111. Chang Chuan C. (Berkeley Heights NJ) Kumar Jitendra (Bridgewater NJ), Method of cleaning test probes.

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112. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Method of fabricating an interconnection element.

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113. Busacco Raymond A. (Lake Ariel PA) Chapin Fletcher W. (Vestal NY) Dranchak David W. (Endwell NY) Molla Jaynal A. (Endicott NY) Saxenmeyer ; Jr. George J. (Apalachin NY) Topa Robert D. (Binghamton NY), Method of forming a conductive end portion on a flexible circuit member.

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114. Beaman Brain S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Method of forming a three dimensional high performance interconnection package.

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115. Fjelstad Joseph ; Smith John W. ; Distefano Thomas H. ; Zaccardi James ; Walton A. Christian, Method of making an electronic contact.

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116. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making contact tip structures.

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117. Reche John J. (Ventura CA), Method of making electrical probe diaphragms.

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118. Khandros Igor Y., Method of making raised contacts on electronic components.

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119. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making temporary connections between electronic components.

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120. Higashida,Takaaki; Kumagai,Koichi; Matsuo,Takahiro, Method of manufacturing a semiconductor element-mounting board.

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121. Tommy Long ; Mohamed Sabri ; J. Lynn Saunders, Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground.

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122. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.

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123. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.

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124. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.

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125. Khoury Theodore A. ; Frame James W., Method of producing a contact structure.

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126. Khandros Igor Y. ; Mathieu Gaetan L., Method of stacking electronic components.

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127. Byrd,Phillip E., Method to prevent damage to probe card.

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128. Fjelstad, Joseph; Smith, John W., Methods and structures for electronic probing arrays.

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129. Fjelstad Joseph ; Smith John W. ; DiStefano Thomas H. ; Walton A. Christian, Methods of assembling microelectronic assembly with socket for engaging bump leads.

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130. Cherian,Gabe, Micro probe.

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131. Fjelstad Joseph, Microelectronic connector with planar elastomer sockets.

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132. Grube, Gary W.; Mathieu, Gaetan L.; Madsen, Alec, Microelectronic contact structure.

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133. Fjelstad Joseph (Sunnyvale CA) Smith John W. (Palo Alto CA) Distefano Thomas H. (Monte Sereno CA) Zaccardi James (Sunnyvale CA) Walton A. Christian (Belmont CA), Microelectronic contacts with asperities and methods of making same.

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134. Fjelstad Joseph ; Smith John W. ; Distefano Thomas H. ; Zaccardi James ; Walton A. Christian, Microelectronic contacts with asperities and methods of making same.

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135. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Microelectronic spring contact element and electronic component having a plurality of spring contact elements.

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136. Kister, January, Modular probe apparatus.

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137. Liu,An Hong; Wang,Yeong Her; Chao,Yeong Ching; Lee,Yao Jung, Modularized probe card for high frequency probing.

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138. January Kister ; Jean-Michel Jurin FR; Isabelle George FR, Modulated space transformer for high density buckling beam probe and method for making the same.

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139. Matsuo, Toshihiro; Kudo, Shigezo, Multi-layered probe for a probecard.

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140. Kister, January; Jaquette, James; Fahrner, Steve, Multipath interconnect with meandering contact cantilevers.

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141. Kister,January; Jaquette,James; Fahrner,Steve, Multipath interconnect with meandering contact cantilevers.

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142. Kister, January, Multiple contact probes.

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143. Rincon, Reynaldo M.; Arnold, Richard W., Multiple-chip probe and universal tester contact assemblage.

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144. Gobinda Das ; Steven J. Duda ; Paul M. Gaschke, Off-axis contact tip and dense packing design for a fine pitch probe.

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145. Forehand Douglas W. ; Lamoreaux Ray, Optimized routing scheme for an integrated circuit/printed circuit board.

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146. Ricks Michael (Nidderau DEX) Bilz Peter (Freigericht DEX) Sattler Dieter (Muhlheim DEX) Jacob Werner (Frankfurt DEX), Outer joint part for a tripod joint.

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147. Jones Mark R. ; Khoury Theodore A., Packaging and interconnection of contact structure.

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148. Liao, Yu-Ting; Liu, Fu-Sung, Piercer combined prober for CU interconnect water-level preliminary electrical test.

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149. Colvin James Barry, Portable emission microscope workstation for failure analysis.

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150. Humphrey, Larry D., Power shovel.

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151. Kister, January; Beatson, David; Laurent, Edward, Prefabricated and attached interconnect structure.

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152. Kister,January; Beatson,David; Laurent,Edward, Prefabricated and attached interconnect structure.

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153. Hideo Nishikawa JP, Printed circuit board testing apparatus and probe device for use in the same.

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154. Driller Hubert (Schmitten DEX) Mang Paul (Schmitten DEX), Printed circuit board testing device with foil adapter.

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155. Lee,Oug Ki; Lee,Jung Hoon, Probe and method of making same.

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156. Nakajima Hisashi (Yamanishi-ken JPX) Yoshioka Haruhiko (Yamanishi-ken JPX), Probe apparatus for correcting the probe card posture before testing.

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157. January Kister, Probe apparatus having removable beam probes.

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158. Higgins H. Dan ; Martinez Martin A. ; Bates R. Dennis, Probe assembly and method for switchable multi-DUT testing of integrated circuit wafers.

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159. January Kister, Probe assembly having floatable buckling beam probes and apparatus for abrading the same.

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160. Kister, January, Probe bonding method having improved control of bonding material.

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161. Andy Chen TW, Probe card.

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162. Park, Ung-Gi; Park, Je-Suck, Probe card.

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163. Takagi Ryoichi,JPX, Probe card and LSI test method using probe card.

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164. Yoshida, Minoru; Ohashi, Seiichi, Probe card apparatus and electrical contact probe having curved or sloping blade profile.

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165. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly.

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166. Khandros,Igor Y.; Sporck,A. Nicholas; Eldridge,Benjamin N., Probe card assembly.

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167. Eldridge, Benjamin Niles; Grube, Gary William; Khandros, Igor Yan; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.

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168. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Probe card assembly and kit, and methods of using same.

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169. Shinde,Makarand S.; Larder,Richard A.; Cooper,Timothy E.; Shenoy,Ravindra V.; Eldridge,Benjamin N., Probe card configuration for low mechanical flexural strength electrical routing substrates.

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170. Miller, Charles A., Probe card cooling assembly with direct cooling of active electronic components.

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171. Benjamin N. Eldridge ; Gary W. Grube ; Gaetan L. Mathieu, Probe card for probing wafers with raised contact elements.

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172. Wood, Alan G.; Doan, Trung T.; Hembree, David R., Probe card for testing microelectronic components.

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173. Akram Salman ; Doherty C. Patrick ; Farnworth Warren M. ; Hembree David R., Probe card, test method and test system for semiconductor wafers.

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174. Kister, January, Probe cards employing probes having retaining portions for potting in a potting region.

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175. Kister,January, Probe cards employing probes having retaining portions for potting in a retention arrangement.

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176. Kister,January, Probe cards employing probes having retaining portions for potting in a retention arrangement.

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177. Kimoto, Gunsei, Probe device.

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178. Kimoto, Gunsei; Takai, Shinkichi, Probe pin assembly.

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179. Kister, January; Shtarker, Alex, Probe retention arrangement.

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180. Kister, January, Probe skates for electrical testing of convex pad topologies.

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181. Kister,January, Probe skates for electrical testing of convex pad topologies.

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182. Tracy ; John M., Probe station.

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183. Verkuil Roger Leonard, Probe-oxide-semiconductor method and apparatus for measuring oxide charge on a semiconductor wafer.

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184. Kister, January, Probes with offset arm and suspension structure.

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185. Kister, January, Probes with offset arm and suspension structure.

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186. Kister, January, Probes with self-cleaning blunt skates for contacting conductive pads.

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187. Karasawa Wataru (Yokohama JPX), Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer.

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188. Thomas T. Montoya, Process for testing a semiconductor device.

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189. Eldridge,Benjamin Niles; Grube,Gary William; Khandros,Igor Yan; Mathieu,Gaetan L., Resilient contact structures formed and then attached to a substrate.

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190. Wickramasinghe Hermantha K. (Chappaqua NY) Williams Clayton C. (Peekskill NY), Scanning thermal profiler.

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191. Kister,January; Jaquette,James; Tokraks,Gene, See-saw interconnect assembly with dielectric carrier grid providing spring suspension.

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192. Kister,January; Jaquette,James; Tokraks,Gene, See-saw interconnect assembly with dielectric carrier grid providing spring suspension.

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193. Yu, Yuet-Ying; Berger, Daniel G; Bowne, Camille Proietti; Langenthal, Scott; Perry, Charles H; Spoor, Terence; Weiss, Thomas, Self-scrub buckling beam probe.

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194. Otsuka Kanji (Higashiyamato JPX) Kato Masao (Hadano JPX) Kumagai Takashi (Isehara JPX) Usami Mitsuo (Ohme JPX) Kuroda Shigeo (Ohme JPX) Sahara Kunizo (Nishitama JPX) Yamada Takeo (Koganei JPX) Miyamo, Semiconductor device having leads for mounting to a surface of a printed circuit board.

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195. Takemoto,Megumi; Maekawa,Shigeki; Kashiba,Yoshihiro; Deguchi,Yoshinori; Miki,Kazunobu, Semiconductor device test probe.

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196. Takemoto, Megumi; Maekawa, Shigeki; Kashiba, Yoshihiro; Deguchi, Yoshinori; Miki, Kazunobu, Semiconductor device test probe having improved tip portion and manufacturing method thereof.

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197. Tani Koji (Kyoto JPX), Semiconductor device with polygonal shaped die pad.

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198. Kister,January; Jaquette,James; Fahrner,Steve, Sheet metal interconnect array.

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199. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Sockets for electronic components and methods of connecting to electronic components.

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200. Kenneth J. Kirsten, Solder flux compatible with flip-chip underfill material.

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201. Kister, January, Space transformers employing wire bonds for interconnections with fine pitch contacts.

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202. Kister,January, Space transformers employing wire bonds for interconnections with fine pitch contacts.

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203. Kister, January, Straight protruding probe beam contour surfaces.

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204. Pedder David John,GBX, Structure for testing bare integrated circuit devices.

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205. Theissen, William F.; Evans, Stephen; McQuade, Francis T.; Kukielka, Zbigniew, Temperature compensated vertical pin probing device.

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206. Chien,Duke, Terminal for an electrical connector.

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207. Lenz Seymour S. (P.O. Box 669 Longwood FL 32750), Test probe assembly for microelectronic circuits.

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208. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.

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209. Maekawa, Shigeki; Takemoto, Megumi; Miki, Kazunobu; Kano, Mutsumi; Nagata, Takahiro; Kashiba, Yoshihiro, Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter.

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210. Beaman Brian S. (Hyde Park NY) Fogel Keith E. (Bardonia NY) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer.

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211. Shigeru Takada JP; Yasushi Tokumo JP; Shigeki Maekawa JP; Keiko Kaneko JP, Test socket having improved contact terminals, and method of forming contact terminals of the test socket.

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212. Mori Yoichi,JPX ; Aoki Yoshihiro,JPX, Testing IC socket.

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213. Jones William H. (Villa Park IL) Chambers Worthy L. (Lombard IL), Thermally responsive controller and switch assembly therefor.

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214. Byrnes Herbert P. (Poughkeepsie NY) Halbout Jean-Marc (Larchmont NY) Scheuermann Michael R. (Katonah NY) Shapiro Eugene (Stamford CT), Thin interface pellicle for dense arrays of electrical interconnects.

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215. Vinh Nguyen T., Variable contact pressure probe.

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216. Kister, January, Vertical guided layered probe.

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217. Kister, January, Vertical guided probe array providing sideways scrub motion.

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218. Kister, January, Vertical probe array arranged to provide space transformation.

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219. Kister, January, Vertical probe array arranged to provide space transformation.

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220. Okubo, Masao; Okubo, Kazumasa; Iwata, Hiroshi, Vertical probe card.

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221. Anderson,Michael L.; McCloud,Edward A.; Mostarshed,Shahriar; Casolo,Michael A., Vertical probe card and air cooled probe head system.

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222. Reeds John W. (Thousand Oaks CA), Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy.

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223. Longson, Simon; Slocum, Alex, Wafer-level contactor.

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224. Secker, David A.; Jain, Nirmal, Wirebond assembly for high-speed integrated circuits.

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