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| 국가/구분 | United States(US) Patent 등록 |
|---|---|
| 국제특허분류(IPC7판) |
|
| 출원번호 | US-0670374 (2015-03-26) |
| 등록번호 | US-9330695 (2016-05-03) |
| 발명자 / 주소 |
|
| 출원인 / 주소 |
|
| 인용정보 | 피인용 횟수 : 5 인용 특허 : 410 |
A head suspension assembly for a disk drive includes a load beam and a laminated flexure that comprises a stainless steel layer, a copper trace layer, and a dielectric layer between the stainless steel layer and the copper trace layer. The laminated flexure includes a flexure tail that extends away
A head suspension assembly for a disk drive includes a load beam and a laminated flexure that comprises a stainless steel layer, a copper trace layer, and a dielectric layer between the stainless steel layer and the copper trace layer. The laminated flexure includes a flexure tail that extends away from the load beam to a flexure tail terminal region. The copper trace layer includes a plurality of flexure bond pads in the flexure tail terminal region. The stainless steel layer includes a plurality of backing islands in the flexure tail terminal region. Each of the plurality of backing islands is aligned with a corresponding one of the plurality of flexure bond pads. A noble metal layer is disposed on the plurality of backing islands.
1. A head suspension assembly comprising: a load beam; anda laminated flexure that comprises a stainless steel layer, a copper trace layer, and a dielectric layer between the stainless steel layer and the copper trace layer, the laminated flexure including a flexure tail that extends away from the l
1. A head suspension assembly comprising: a load beam; anda laminated flexure that comprises a stainless steel layer, a copper trace layer, and a dielectric layer between the stainless steel layer and the copper trace layer, the laminated flexure including a flexure tail that extends away from the load beam to a flexure tail terminal region;wherein the copper trace layer includes a plurality of flexure bond pads in the flexure tail terminal region;wherein the stainless steel layer includes a plurality of backing islands in the flexure tail terminal region, each of the plurality of backing islands being aligned with a corresponding one of the plurality of flexure bond pads;wherein a noble metal layer is disposed on the plurality of backing islands; andwherein each of the plurality of backing islands is electrically connected to the corresponding one of the plurality of flexure bond pads by a conductive via through the dielectric layer. 2. A head suspension assembly comprising: a load beam; anda laminated flexure that comprises a stainless steel layer, a copper trace layer, and a dielectric layer between the stainless steel layer and the copper trace layer, the laminated flexure including a flexure tail that extends away from the load beam to a flexure tail terminal region;wherein the copper trace layer includes a plurality of flexure bond pads in the flexure tail terminal region;wherein the stainless steel layer includes a plurality of backing islands in the flexure tail terminal region, each of the plurality of backing islands being aligned with a corresponding one of the plurality of flexure bond pads;wherein a noble metal layer is disposed on the plurality of backing islands; andwherein the noble metal layer includes a plurality of testing pads, each of the plurality of testing pads being disposed on one of the plurality of backing islands. 3. The head suspension assembly of claim 2 wherein the noble metal layer further includes a grounding pad that is disposed on the stainless steel layer in an adjacent area of the flexure tail terminal region that does not include the plurality of backing islands. 4. A head suspension assembly comprising: a load beam; anda laminated flexure that comprises a stainless steel layer, a copper trace layer, and a dielectric layer between the stainless steel layer and the copper trace layer, the laminated flexure including a flexure tail that extends away from the load beam to a flexure tail terminal region;wherein the copper trace layer includes a plurality of flexure bond pads in the flexure tail terminal region;wherein the stainless steel layer includes a plurality of backing islands in the flexure tail terminal region, each of the plurality of backing islands being aligned with a corresponding one of the plurality of flexure bond pads; andwherein a noble metal layer is disposed directly in contact with the plurality of backing islands. 5. The head suspension assembly of claim 4 wherein the noble metal layer comprises gold. 6. The head suspension assembly of claim 4 wherein the noble metal layer has a noble metal thickness in the range of 0.2 microns to 4 microns. 7. A disk drive comprising: a disk drive base;a disk rotatably mounted to the disk drive base;an actuator pivotably mounted to the disk drive base, the actuator including at least one actuator arm and a flexible printed circuit (FPC) that includes a plurality of electrically conductive FPC bond pads; andat least one head gimbal assembly attached to the at least one actuator arm, the at least one head gimbal assembly comprising a head for reading data on the disk; anda suspension assembly that comprises a load beam; anda laminated flexure that comprises a metal structural layer, a metal conductive trace layer, and a dielectric layer between the metal structural layer and the metal conductive trace layer, the laminated flexure including a tongue portion that connects to the read head and a flexure tail that extends to the plurality of FPC bond pads, the flexure tail including a flexure tail terminal region that at least partially overlaps the FPC;wherein the metal conductive trace layer includes a plurality of flexure bond pads in the flexure tail terminal region, each of the plurality of flexure bond pads being aligned with and bonded to a corresponding one of the plurality of FPC bond pads;wherein the metal structural layer includes a plurality of backing islands in the flexure tail terminal region, each of the plurality of backing islands aligned with a corresponding one of the plurality of flexure bond pads; andwherein a noble metal layer is disposed directly in contact with the plurality of backing islands. 8. The disk drive of claim 7 wherein the noble metal layer comprises gold. 9. The disk drive of claim 7 wherein the structural layer comprises stainless steel, the dielectric layer comprises polyimide, and the conductive layer comprises copper. 10. The disk drive of claim 7 wherein the noble metal layer has a noble metal thickness in the range of 0.2 microns to 4 microns. 11. A disk drive comprising: a disk drive base;a disk rotatably mounted to the disk drive base;an actuator pivotably mounted to the disk drive base, the actuator including at least one actuator arm and a flexible printed circuit (FPC) that includes a plurality of electrically conductive FPC bond pads; andat least one head gimbal assembly attached to the at least one actuator arm, the at least one head gimbal assembly comprising a head for reading data on the disk; anda suspension assembly that comprises a load beam; anda laminated flexure that comprises a metal structural layer, a metal conductive trace layer, and a dielectric layer between the metal structural layer and the metal conductive trace layer, the laminated flexure including a tongue portion that connects to the read head and a flexure tail that extends to the plurality of FPC bond pads, the flexure tail including a flexure tail terminal region that at least partially overlaps the FPC;wherein the metal conductive trace layer includes a plurality of flexure bond pads in the flexure tail terminal region, each of the plurality of flexure bond pads being aligned with and bonded to a corresponding one of the plurality of FPC bond pads;wherein the metal structural layer includes a plurality of backing islands in the flexure tail terminal region, each of the plurality of backing islands aligned with a corresponding one of the plurality of flexure bond pads;wherein a noble metal layer is disposed on the plurality of backing islands; andwherein the noble metal layer includes a plurality of testing pads, each of the plurality of testing pads being disposed on one of the plurality of backing islands. 12. The disk drive of claim 11 wherein the noble metal layer further includes a grounding pad that is disposed on the metal structural layer in an adjacent area of the flexure tail terminal region that does not overlap with the FPC and that does not include the plurality of backing islands. 13. A disk drive comprising: a disk drive base;a disk rotatably mounted to the disk drive base;an actuator pivotably mounted to the disk drive base, the actuator including at least one actuator arm and a flexible printed circuit (FPC) that includes a plurality of electrically conductive FPC bond pads; andat least one head gimbal assembly attached to the at least one actuator arm, the at least one head gimbal assembly comprising a head for reading data on the disk; anda suspension assembly that comprises a load beam; anda laminated flexure that comprises a metal structural layer, a metal conductive trace layer, and a dielectric layer between the metal structural layer and the metal conductive trace layer, the laminated flexure including a tongue portion that connects to the read head and a flexure tail that extends to the plurality of FPC bond pads, the flexure tail including a flexure tail terminal region that at least partially overlaps the FPC;wherein the metal conductive trace layer includes a plurality of flexure bond pads in the flexure tail terminal region, each of the plurality of flexure bond pads being aligned with and bonded to a corresponding one of the plurality of FPC bond pads;wherein the metal structural layer includes a plurality of backing islands in the flexure tail terminal region, each of the plurality of backing islands aligned with a corresponding one of the plurality of flexure bond pads;wherein a noble metal layer is disposed on the plurality of backing islands; andwherein each of the plurality of backing islands is electrically connected to the corresponding one of the plurality of flexure bond pads by a conductive via through the dielectric layer.
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