Engineered wood flooring with a double-frame substrate
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B44F-007/00
B44F-009/00
E04C-001/00
E04F-015/04
E04F-015/02
B32B-021/13
B32B-003/14
B32B-021/02
B32B-003/06
E04C-002/12
B32B-023/04
E04F-015/10
E04C-002/24
출원번호
US-0813859
(2015-07-30)
등록번호
US-9382718
(2016-07-05)
우선권정보
CN-2015 2 0442138 (2015-06-25)
발명자
/ 주소
Li, David
출원인 / 주소
SHENZHENSHI HUANWEI WOODS CO., LTD.
대리인 / 주소
Shimokaji IP
인용정보
피인용 횟수 :
0인용 특허 :
10
초록▼
The present invention relates to engineered wood flooring with a double-frame substrate. The engineered wood flooring comprises a double-frame substrate of wood and a solid wood panel adhered to the double-frame substrate. The double-frame substrate of wood comprises a horizontal grain core and two
The present invention relates to engineered wood flooring with a double-frame substrate. The engineered wood flooring comprises a double-frame substrate of wood and a solid wood panel adhered to the double-frame substrate. The double-frame substrate of wood comprises a horizontal grain core and two vertical grain frames; two vertical grain frames are bonded on both sides of the horizontal grain core along the grain direction of the core; the horizontal grain core is sandwiched in the middle, and the horizontal grain core and the vertical grain frame are perpendicular to each other and located in the same plane; the vertical grain frame on each side comprises two vertical grain boards, and one vertical wood board is located between the horizontal grain core and the other vertical wood board. The engineered wood flooring has excellent resistance of deformation, small deformation, high strength and steady usage.
대표청구항▼
1. An engineered wood flooring with a double-frame substrate, comprising: a double-frame substrate of wood comprising a horizontal grain core and two vertical grain frames; wherein two vertical grain frames are bonded on both sides of the horizontal grain core along the grain direction of the core;
1. An engineered wood flooring with a double-frame substrate, comprising: a double-frame substrate of wood comprising a horizontal grain core and two vertical grain frames; wherein two vertical grain frames are bonded on both sides of the horizontal grain core along the grain direction of the core; the horizontal grain core is sandwiched in the middle, and the horizontal grain core and the vertical grain frames are perpendicular to each other and located in the same plane; each of the vertical grain frames comprises two vertical grain boards disposed in parallel along the grain direction of the core, and one vertical wood board is located between the horizontal grain core and the other vertical wood board; the horizontal grain core consists of a plurality of strip-type horizontal grain boards glued in parallel along the grain direction of the vertical grain frame; anda solid wood panel adhered to the double-frame substrate. 2. The engineered wood flooring with a double-frame substrate as claimed in claim 1, wherein a width of the vertical grain frame on each side is both in a range of 1 to 4 cm. 3. The engineered wood flooring with a double-frame substrate as claimed in claim 2, wherein a width of each strip-type horizontal grain board is both in a range of 1 to 4 cm. 4. The engineered wood flooring with a double-frame substrate as claimed in claim 2, wherein a thickness of the engineered wood flooring is in a range of 0.5 to 3 cm. 5. The engineered wood flooring with a double-frame substrate as claimed in claim 2, wherein the horizontal grain core and the vertical grain frames are assembled together to form the double-frame substrate of wood by means of binding without saw-tooth, micro teeth tenon riveting structure, bolted structure, finger jointed structure or tongued-and-grooved joint. 6. The engineered wood flooring with a double-frame substrate as claimed in claim 2, wherein the two vertical grain boards are assembled together to form the vertical grain frame by means of binding without saw-tooth, micro teeth tenon riveting structure, bolted structure, finger jointed structure or tongued-and-grooved joint. 7. The engineered wood flooring with a double-frame substrate as claimed in claim 2, wherein the tongued-and-grooved joint is set around all the outer periphery of the engineered wood flooring and the tongued-and-grooved joint can be fixed with the tongued-and-grooved joint of another engineered wood flooring with a double-frame substrate. 8. The engineered wood flooring with a double-frame substrate as claimed in claim 1, wherein a width of the vertical wood board is both in a range of 0.5 to 2 cm. 9. The engineered wood flooring with a double-frame substrate as claimed in claim 8, wherein a width of each strip-type horizontal grain board is both in a range of 1 to 4 cm. 10. The engineered wood flooring with a double-frame substrate as claimed in claim 8, wherein a thickness of the engineered wood flooring is in a range of 0.5 to 3 cm. 11. The engineered wood flooring with a double-frame substrate as claimed in claim 8, wherein the horizontal grain core and the vertical grain frames are assembled together to form the double-frame substrate of wood by means of binding without saw-tooth, micro teeth tenon riveting structure, bolted structure, finger jointed structure or tongued-and-grooved joint. 12. The engineered wood flooring with a double-frame substrate as claimed in claim 8, wherein the two vertical grain boards are assembled together to form the vertical grain frame by means of binding without saw-tooth, micro teeth tenon riveting structure, bolted structure, finger jointed structure or tongued-and-grooved joint. 13. The engineered wood flooring with a double-frame substrate as claimed in claim 8, wherein the tongued-and-grooved joint is set around all the outer periphery of the engineered wood flooring and the tongued-and-grooved joint can be fixed with the tongued-and-grooved joint of another engineered wood flooring with a double-frame substrate. 14. The engineered wood flooring with a double-frame substrate as claimed in claim 1, wherein a width of each strip-type horizontal grain board is both in a range of 1 to 4 cm. 15. The engineered wood flooring with a double-frame substrate as claimed in claim 1, wherein a thickness of the engineered wood flooring is in a range of 0.5 to 3 cm. 16. The engineered wood flooring with a double-frame substrate as claimed in claim 1, wherein the horizontal grain core and the vertical grain frames are assembled together to form the double-frame substrate of wood by means of binding without saw-tooth, micro teeth tenon riveting structure, bolted structure, finger jointed structure or tongued-and-grooved joint. 17. The engineered wood flooring with a double-frame substrate as claimed in claim 1, wherein the two vertical grain boards are assembled together to form the vertical grain frame by means of binding without saw-tooth, micro teeth tenon riveting structure, bolted structure, finger jointed structure or tongued-and-grooved joint. 18. The engineered wood flooring with a double-frame substrate as claimed in claim 1, wherein the tongued-and-grooved joint is set around all the outer periphery of the engineered wood flooring and the tongued-and-grooved joint can be fixed with the tongued-and-grooved joint of another engineered wood flooring with a double-frame substrate. 19. The engineered wood flooring with a double-frame substrate as claimed in claim 1, wherein the plurality of strip-type horizontal grain boards have a same width, a same length and a same thickness.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (10)
Magnusson Tryggvi,SEX, Engineered hardwood flooring system having acoustic attenuation characteristics.
Wilderman Ronald C. ; Kerns John W. ; Wagner Richard E. ; Dimakis Alkiviadis G. ; Selby John S., Method of producing wood strips for conversion into composite lumber products.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.