Ablation layers to prevent pitting in laser peening
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B23K-026/00
B23K-026/18
C21D-010/00
출원번호
US-0240676
(2005-09-30)
등록번호
US-9409254
(2016-08-09)
발명자
/ 주소
Hackel, Lloyd A.
출원인 / 주소
Lawrence Livermore National Security, LLC
대리인 / 주소
Wooldridge, John P.
인용정보
피인용 횟수 :
0인용 특허 :
11
초록▼
A hybrid ablation layer that comprises a separate under layer is applied to a material to prevent pitting resulting from laser peening. The underlayer adheres to the surface of the workpiece to be peened and does not have bubbles and voids that exceed an acceptable size. One or more overlayers are p
A hybrid ablation layer that comprises a separate under layer is applied to a material to prevent pitting resulting from laser peening. The underlayer adheres to the surface of the workpiece to be peened and does not have bubbles and voids that exceed an acceptable size. One or more overlayers are placed over and in contact with the underlayer. Any bubbles formed under the over layers are insulated from the surface to be peened. The process significantly reduces the incidence of pits on peened surfaces.
대표청구항▼
1. A laser peening method, comprising, providing a workpiece;adhering an opaque first layer of paint onto said workpiece, wherein said first layer contains no voids or bubbles larger than 10 microns in diameter, wherein the step of adhering an opaque first layer comprises an adhering step selected f
1. A laser peening method, comprising, providing a workpiece;adhering an opaque first layer of paint onto said workpiece, wherein said first layer contains no voids or bubbles larger than 10 microns in diameter, wherein the step of adhering an opaque first layer comprises an adhering step selected from the group consisting of dip coating and spraying;adhering an opaque second layer onto said first layer; andpropagating a pulse of laser light onto said second layer, wherein said pulse comprises sufficient energy density to ablate a portion of said second layer, thereby ejecting a plasma, wherein said plasma produces a shock wave that propagates onto said first layer and onto said workpiece, thereby peening said workpiece, wherein said opaque first layer and said opaque second layer are opaque to the wavelength of said pulse of laser light. 2. The method of claim 1, wherein said second layer comprises a plurality of layers. 3. The method of claim 1, wherein said second layer comprises metal foil. 4. The method of claim 3, wherein said metal foil comprises adhesive. 5. The method of claim 1, wherein said second layer comprises tape. 6. The method of claim 5, wherein said tape comprises adhesive. 7. The method of claim 5, wherein said tape comprises metal tape. 8. The method of claim 7, wherein said metal tape comprises aluminum tape. 9. The method of claim 1, wherein said first layer comprises sprayed on paint. 10. The method of claim 1, wherein said first layer comprises a dip applied paint. 11. The method of claim 1, wherein said first layer comprises metal primer. 12. An apparatus, comprising, an opaque first layer of paint adhered to a workpiece to be laser peened, wherein said first layer contains no voids or bubbles larger than 10 microns in diameter, wherein said first layer is adhered to said workpiece by dip coating or spraying;an opaque second layer adhered to said first layer; andmeans for propagating a pulse of laser light onto said second layer wherein said pulse comprises sufficient energy density to ablate a portion of said second layer, thereby ejecting a plasma, wherein said plasma produces a shock wave that propagates onto said first layer and onto said workpiece, thereby peening said workpiece, wherein said opaque first layer and said opaque second layer are opaque to the wavelength of said pulse of laser light. 13. The apparatus of claim 12, wherein said second layer comprises a plurality of layers. 14. The apparatus of claim 12, wherein said second layer comprises metal foil. 15. The apparatus of claim 14, wherein said metal foil comprises adhesive. 16. The apparatus of claim 12, wherein said second layer comprises tape. 17. The apparatus of claim 16, wherein said tape comprises adhesive. 18. The apparatus of claim 16, wherein said tape comprises metal tape. 19. The apparatus of claim 18, wherein said metal tape comprises aluminum tape. 20. The apparatus of claim 12, wherein said first layer comprises sprayed on paint. 21. The apparatus of claim 12, wherein said first layer comprises a dip applied paint. 22. The apparatus of claim 12, wherein said first layer comprises metal primer.
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이 특허에 인용된 특허 (11)
Mannava Seetharamaiah (Cincinnati OH) Yeaton Robert L. (Cincinnati OH) McDaniel Albert E. (Cincinnati OH), Dry tape covered laser shock peening.
Ortiz ; Jr. Angel L. (Scotia NY) Penney Carl M. (Saratoga Springs NY) Jones Marshall G. (Scotia NY) Erikson Carl E. (Schenectady NY), Laser peening system and method.
Clauer Allan H. (Worthington OH) Fairand Barry P. (Arlington OH) Ford Stephen C. (Worthington OH) Walters Craig T. (Arlington OH), Laser shock processing.
Epstein Harold M. (Columbus OH) Clauer Allan H. (Worthington MI) Mueller Boyd A. (Columbus MI) Dulaney Jeffrey L. (Hilliard OH) Campbell Bernerd E. (Upper Arlington OH) Walters Craig T. (Columbus OH), Material properties.
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