Described are features to control distribution of thermal energy by structures such as portions of a case of a device. Various patterns of thermally conductive or insulating substances alter the thermal conductivity of a structure and provide selective directional distribution of thermal energy away
Described are features to control distribution of thermal energy by structures such as portions of a case of a device. Various patterns of thermally conductive or insulating substances alter the thermal conductivity of a structure and provide selective directional distribution of thermal energy away from a hot spot caused by operation of a device component. The features result in a predetermined distribution of thermal energy across one or more structures, and may increase thermal uniformity.
대표청구항▼
1. A device comprising: at least one component, wherein heat is generated during operation of the at least one component;a case at least partly enclosing the at least one component;a structure coupled to the case, the structure comprising: a substrate coupled to the case; andat least one feature on
1. A device comprising: at least one component, wherein heat is generated during operation of the at least one component;a case at least partly enclosing the at least one component;a structure coupled to the case, the structure comprising: a substrate coupled to the case; andat least one feature on a side of the substrate that is proximate to the at least one component, the at least one feature comprising a thermally conducting material arranged on the substrate, wherein the thermally conducting material is more thermally conductive than the substrate and includes an arrangement of shapes configured to conduct the heat across the structure and away from at least one region on the structure having a temperature above a threshold, wherein the arrangement of shapes includes a regular repeating pattern. 2. The device of claim 1, wherein the thermally conducting material is an anisotropic thermally conducting material having a first thermal conductivity in a first direction and having a second thermal conductivity in a second direction that is substantially perpendicular to the first direction, the first thermal conductivity being higher than the second thermal conductivity. 3. The device of claim 1, wherein the thermally conducting material is arranged on the substrate in a star-shape having spokes that extend from a point located in the at least one region of temperature above the threshold, wherein the star-shape is radially symmetric around the point. 4. The device of claim 1, further comprising: a thermal conduit extending between the at least one component and the thermally conducting material, wherein the thermal conduit includes a first width less than a second width of the at least one heat source, and wherein the thermal conduit is configured to conduct the heat from the at least one component to the thermally conducting material. 5. The device of claim 1, wherein the arrangement of shapes includes an arrangement of discrete shapes of the thermally conducting material. 6. The device of claim 1, further comprising: an external thermal dissipation feature extending from the substrate;wherein the thermally conducting material is arranged between the at least one region and a location proximate to the external thermal dissipation feature. 7. A structure comprising: a substrate comprising a first material having a first thermal conductivity; anda second material distributed in a pattern on a surface of the substrate, the second material having a second thermal conductivity that is different from the first thermal conductivity, wherein the pattern is arranged on the surface to conduct heat away from at least one hot spot associated with at least one heat source, the pattern including an arrangement of shapes of the second material, at least a portion of the shapes of the arrangement of shapes being at least partially contiguous to facilitate heat conduction;wherein the arrangement of shapes relative to the substrate is configured to vary a rate at which the heat is conducted away from the at least one hot spot based on a distance from the at least one hot spot. 8. The structure of claim 7, wherein the second thermal conductivity is higher than the first thermal conductivity and the substrate functions as a thermal insulator, wherein the second material is disposed on a side of the substrate that is proximal to the at least one heat source, wherein all of the second material contacts the side of the substrate, and wherein the heat is conducted through the second material in a direction parallel to the substrate. 9. The structure of claim 7, wherein the second material is distributed on the surface of the substrate in a shape that is radially symmetric about a point included in the at least one hot spot. 10. The structure of claim 7, wherein the second material is distributed on the surface of the substrate in one or more of a star-shaped pattern, an elliptical pattern, or a polygonal pattern. 11. The structure of claim 7, wherein one or more shapes of the arrangement of shapes are asymmetric. 12. The structure of claim 7, wherein the second material is an anisotropic thermally conducting material having the second thermal conductivity in a first direction and a third thermal conductivity in a second direction substantially perpendicular to the first direction, the first direction being across the surface. 13. The structure of claim 7, wherein the arrangement of shapes includes a regular repeating pattern. 14. The structure of claim 7, wherein the arrangement of shapes includes an irregular pattern. 15. The structure of claim 7, further comprising: an external thermal dissipation feature extending from the substrate;wherein the second material is distributed on the surface of the substrate between the at least one hot spot and a location proximate to the external thermal dissipation feature. 16. The structure of claim 7, further comprising: a thermal conduit thermally coupled to the at least one heat source and the second material for conducting the heat from the at least one heat source to the second material, wherein the thermal conduit includes a first width less than a second width of the at least one heat source. 17. A device comprising: at least one component which in operation generates heat;a structure proximate to at least one hot spot associated with the heat generated by the at least one component, the at least one hot spot having a higher temperature than an average temperature of the structure, the structure further comprising: a first layer having a first thermal conductivity configured to conduct the heat away from the at least one hot spot; andproximate to the first layer, a second layer having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity, wherein the first layer directly contacts and is immediately adjacent to the second layer, and wherein a distribution of the first layer relative to the second layer is configured to vary a rate at which the heat is conducted away from the at least one hot spot based on a distance from the at least one hot spot. 18. The device of claim 17, further comprising at least one thermal conduit that thermally couples the at least one component to the first layer, wherein the at least one thermal conduit includes a first width less than a second width of the at least one component. 19. The device of claim 17, wherein the first layer is of a material that is thermally anisotropic, the material having the first thermal conductivity in a first direction parallel to an interface between the first layer and the second layer, and the material having a third thermal conductivity in a second direction orthogonal to the first direction, wherein the first thermal conductivity is higher than the third thermal conductivity. 20. The device of claim 17, wherein: the first layer is a thermal conductor comprising one or more of a metal, a thermally conductive ink, or an allotrope of carbon; andthe second layer is a thermal insulator comprising one or more of a metal oxide, a plastic, an aerogel, a ceramic, a silicate, or a polymer, wherein all of the first layer contacts the second layer. 21. The device of claim 17, wherein the first layer is arranged in a substantially radially symmetric shape about a point within the at least one hot spot, wherein the shape includes one or more of a star-shaped pattern, an elliptical pattern, or a polygonal pattern. 22. The device of claim 17, wherein the first layer is arranged in a substantially asymmetric pattern. 23. The device of claim 17, wherein the first layer includes a material distributed in a treatment pattern having an arrangement of discrete shapes. 24. The device of claim 17, further comprising: an external thermal dissipation feature extending from the structure;wherein the first layer is arranged between the at least one hot spot and a location proximate to the external thermal dissipation feature for conducting the heat from the at least one hot spot to the external thermal dissipation feature. 25. The device of claim 17, wherein the first layer includes a material distributed in an arrangement of shapes, the arrangement of shapes including a regular repeating pattern. 26. The device of claim 17, wherein the first layer is distributed in an arrangement of shapes, at least a portion of shapes of the arrangement of shapes being at least partially contiguous to facilitate heat conduction.
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이 특허에 인용된 특허 (6)
Cheng, Chao-Wen; Ruch, Mark H; Tracy, Mark S, Carbon laminated enclosure.
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