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Graphite layer between carbon layers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/16
  • G06F-001/20
  • B32B-009/00
  • B32B-003/26
  • B32B-003/30
  • B32B-007/02
출원번호 US-0338884 (2014-07-23)
등록번호 US-9442514 (2016-09-13)
발명자 / 주소
  • Fourie, Daniel
출원인 / 주소
  • GOOGLE INC.
대리인 / 주소
    Brake Hughes Bellermann LLP
인용정보 피인용 횟수 : 0  인용 특허 : 49

초록

According to one example embodiment, a sheet may include a first carbon fiber reinforced plastic layer, a graphite layer adjacent to the first carbon fiber reinforced plastic layer, the graphite layer comprising at least one aperture, a second carbon fiber reinforced plastic layer adjacent to the gr

대표청구항

1. A sheet comprising: a first carbon fiber reinforced plastic layer;a graphite layer adjacent to the first carbon fiber reinforced plastic layer, the graphite layer comprising at least one aperture;a second carbon fiber reinforced plastic layer adjacent to the graphite layer; andat least one column

이 특허에 인용된 특허 (49)

  1. Pascolini, Mattia; Hill, Robert J.; Zavala, Juan; Jin, Nanbo; Li, Qingxiang; Schlub, Robert W.; Caballero, Ruben, Bezel gap antennas.
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  11. Perry, Michael C.; Moscovitch, Jerry; Yap, Luther V. Diaz; Wilk, Raymond, Display enclosure.
  12. Hastings Otis H. (130 E. Crescent Ave. Mahwah NJ 07430) Hastings Otis M. (130 E. Crescent Ave. Mahwah NJ 07430), Electrically conductive laminate for temperature control of aircraft surface.
  13. Kawasaki Tamotsu (Yokohama JPX) Kuwana Takeshi (Tokyo JPX) Morita Minoru (Yokohama JPX), Evacuated heat insulation unit.
  14. Ulrich Bohdan (Kehrsatz CHX), Flat bag filled with thermally conducting liquid or paste.
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  16. Griffith Brent T. (Berkeley CA) Arasteh Dariush K. (Oakland CA) Selkowitz Stephen E. (Piedmont CA), Gas filled panel insulation.
  17. Ohta, Yusuke; Wakahara, Shuhei; Nishikawa, Yasushi, Graphite film and graphite composite film.
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  19. Spaight ; Ronald Neil, Heat transfer mechanism for integrated circuit package.
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  26. Raghavendran, Venkat; Smith, Gary Francis, Lightweight thermoplastic composite including bi-directional fiber tapes.
  27. Frank D. MacDonald ; Patrick B. Stickler ; Ryon C. Warren ; Chun-Hua Kathy Chuang, Low cost structural fabrication that resists catastrophic failure under rapid thermal loading.
  28. Holloway, Gary, Method for manufacturing a composite body and a composite body manufacturing arrangement.
  29. Peterson, Kenneth A.; Watson, Robert D., Microelectronic device package with an integral window mounted in a recessed lip.
  30. Sauzade Jean-Denis (Juan Les Pins FRX) L\Hote Manuel (Vence FRX), Mounting for printed circuits forming a heat sink with controlled expansion.
  31. Cur Nihat O. (St. Joseph Township ; Berrien County MI) Kirby David B. (St. Joseph Township ; Berrien County MI), Multi-compartment vacuum insulation panels.
  32. Fedorov, Andrei G., Nano-patch thermal management devices, methods, & systems.
  33. Tilton, Charles L; Tilton, Donald E.; Palmer, Randall T.; Beasley, William J.; Miller, Douglas W.; Alder, Norman O., Narrow gap spray cooling in a globally cooled enclosure.
  34. Shives, Gary D.; Varela, William, Optimized frame system for a liquid crystal display device.
  35. Yee, Dong-Su; Cho, Dai-Han; Hwang, Jung-Ho; Moon, Chan-Kyoung; Lee, Hyun-Hee; Kim, Min-Su; Wang, Chan-Hee; Yun, Kwang-Jin, Organic light emitting diode display device having a second bezel.
  36. Katsui Tadashi,JPX ; Yamamoto Haruhiko,JPX, Outside panel for an electronic device.
  37. Kabadi Ashok N., Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors.
  38. Takashi Kobayashi JP, Portable electrical apparatus with metal case having thermal insulation.
  39. Yuasa, Akiko; Tanimoto, Yasuaki; Hirai, Chie, Portable information appliance.
  40. Lindsay Brad H. (601 E. Bell Rd. Suite 350 Phoenix AZ 85022), Radiant barrier apparatus.
  41. Sorabji, Khurshed; Lerner, Alexander N., Rapid conductive cooling using a secondary process plane.
  42. Kratel Gnter (Durach-Bechen DEX) Stohr Gnter (Durach-Bechen DEX) Schreiner Franz (Sulzberg DEX), Shaped microporous thermal insulation body with sheathing and process for making same.
  43. Huang, Kun-Feng; Hsu, Hsin-Fa, Structure-reinforced bezel for flat panel display.
  44. Nakajima Tadakatsu (Ibaraki JPX) Nakayama Wataru (Kashiwa JPX) Oohashi Shigeo (Ibaraki JPX) Kuwabara Heikichi (Ibaraki JPX) Daikoku Takahiro (Usiku JPX), Thermal conduction device.
  45. Simko ; Jr. Frank A. (5666 Cope Leyte Dr. Sarasota FL 33580), Thermal insulating material.
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  47. Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson, Thermal solution for portable electronic devices.
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