[미국특허]
Polyphenylene oxide resin, method of preparing polyphenylene oxide resin, polyphenylene oxide prepolymer and resin composition
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C08G-061/00
C08G-065/48
C08L-071/12
C08K-005/5397
C08K-007/18
출원번호
US-0643627
(2015-03-10)
등록번호
US-9447238
(2016-09-20)
우선권정보
CN-2014 1 0851821 (2014-12-31)
발명자
/ 주소
Gao, Yu
Hsieh, Chen-Yu
Ma, Ziqian
Wang, Rongtao
Tian, Wenjun
출원인 / 주소
ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
대리인 / 주소
Muncy, Geissler, Olds & Lowe, P.C.
인용정보
피인용 횟수 :
2인용 특허 :
0
초록▼
A polyphenylene oxide resin belongs to a polymerized and/or modified thermosetting polyphenylene oxide resin, having a structure represented by formula (I): The polymerized and/or modified thermosetting polyphenylene oxide resin has better flame retardancy, thermal resistance, dielectric constant,
A polyphenylene oxide resin belongs to a polymerized and/or modified thermosetting polyphenylene oxide resin, having a structure represented by formula (I): The polymerized and/or modified thermosetting polyphenylene oxide resin has better flame retardancy, thermal resistance, dielectric constant, dissipation factor, toughness, reactivity, viscosity and solubility. Therefore, the polyphenylene oxide resin is suitable for producing prepregs, resin films, laminates, printed circuit boards and other articles. A method of preparing polyphenylene oxide resins, a prepolymer thereof and a resin composition containing the polyphenylene oxide resin are also provided.
대표청구항▼
1. A polyphenylene oxide resin having a structure represented by formula (I): wherein b is a positive integer, X is selected from any one of formula (II) to formula (IV) and a combination thereof: Y has a structure represented by formula (V): wherein m and n independently represent a positive intege
1. A polyphenylene oxide resin having a structure represented by formula (I): wherein b is a positive integer, X is selected from any one of formula (II) to formula (IV) and a combination thereof: Y has a structure represented by formula (V): wherein m and n independently represent a positive integer of 1 to 30; R1 to R16 are independently selected from H, —CH3 and halogen atoms; A is selected from —CH2—, —CH(CH3)—, —C(CH3)2—, —O—, —S—, —SO2— and carbonyl group;and Z has a structure of formula (VI) or (VIII) or a combination thereof: wherein R17 to R23 are independently selected from H, —CH3 and halogen atoms, and W is an aliphatic group. 2. A method of preparing the polyphenylene oxide resin of claim 1, comprising reacting a bis(chloromethyl) compound with dihydroxyl-terminated polyphenylene oxide, followed by the addition of a vinyl compound to complete the reaction and obtain the polyphenylene oxide resin. 3. The method of claim 2, wherein the bis(chloromethyl) compound is selected from bis(chloromethyl)benzene, bis(chloromethyl)biphenyl, bis(chloromethyl)ether and a combination thereof. 4. The method of claim 2, wherein the dihydroxyl-terminated polyphenylene oxide has a structure represented by formula (XII): wherein m and n independently represent a positive integer of 1 to 30; R1 to R16 are independently selected from H, —CH3 and halogen atoms; and A is selected from —CH2—, —CH(CH3)—, —C(CH3)2—, —O—, —S—, —SO2— and carbonyl group. 5. The method of claim 2, wherein the vinyl compound is selected from 4-chloromethyl styrene, 3-chloromethyl styrene, 2-chloromethyl styrene, methacrylic acid, chloropropene, and a combination thereof. 6. A polyphenylene oxide prepolymer obtained from a pre-polymerization of the polyphenylene oxide resin of claim 1 with a double-bond-containing compound, a double-bond-containing resin or a mixture of a double-bond-containing compound and a double-bond-containing resin. 7. The polyphenylene oxide prepolymer of claim 6, wherein the double-bond-containing compound and the double-bond-containing resin are independently selected from isocyanate, isocyanurate, maleimide, polyolefin, divinylbenzene, acrylic resin and a combination of any two or more thereof. 8. A resin composition comprising: (A) the polyphenylene oxide resin of claim 1, its prepolymer or a mixture thereof; and (B) a property modifier for modifying at least one property of the resin composition comprising flame retardancy, thermal resistance, dielectric constant, dissipation factor, toughness, reactivity, viscosity and solubility. 9. The resin composition of claim 8, wherein the property modifier is selected from a group consisting of flame retardant, inorganic filler, olefin polymer, surfactant, toughener, curing accelerator, solvent and a combination thereof. 10. The resin composition of claim 8, further comprising isocyanate, modified isocyanate, isocyanurate, modified isocyanurate, maleimide, modified maleimide or a combination thereof. 11. The resin composition of claim 8, further comprising styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, vinyl-polybutadiene-urethane oligomer, styrene butadiene copolymer, hydrogenated styrene butadiene copolymer, styrene isoprene copolymer, hydrogenated styrene isoprene copolymer or a combination thereof. 12. An article made from the resin composition of claim 8, which is a prepreg, a resin film, a laminate or a printed circuit board. 13. The polyphenylene oxide resin according to claim 1, wherein A is —C(CH3)2—.
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이 특허를 인용한 특허 (2)
King, Scott B.; Kobilka, Brandon M.; Kuczynski, Joseph; Wertz, Jason T., Flame-retardant polyallyl and polyalkenyl isocyanurate compounds.
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