[특허]System and method for thermoelectrically cooling inductive charging assemblies

Gentherm Incorporated

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System and method for thermoelectrically cooling inductive charging assemblies

국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/00 H05K-007/20 H02J-007/02
출원번호	US-0935321 (2013-07-03)
등록번호	US-9451723 (2016-09-20)
발명자 / 주소	Lofy, John Marquette, David
출원인 / 주소	Gentherm Incorporated
대리인 / 주소	Knobbe, Martens, Olson & Bear, LLP
인용정보	피인용 횟수 : 20 인용 특허 : 183

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In some embodiments, a cooling system for an inductive charger includes a thermal conditioning assembly in fluid communication with an inductive charging assembly. The inductive charging assembly can include a dock and an inductive charging module. The dock can be configured to receive a portable electronic device, such as a cell phone, that is configured to accept inductive charging from the inductive charging module. The thermal conditioning assembly can include a fluid transfer device and a thermal conditioning module, such as a thermoelectric device. In various embodiments, heat (e.g., heat produced during inductive charging) can be transferred from the inductive charging assembly to the thermal conditioning module and/or to a fluid flow produced by the fluid transfer device, thereby cooling the inductive charging assembly and/or the portable electronic device.

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1. A thermally conditioned inductive charging system comprising: a dock having a partially-enclosed portion and an aperture at a first end of the dock defining a cavity, the cavity configured to receive a portable electronic device, the cavity having at least one rib on an interior surface of the cavity to position the electronic device away from the interior surface of the cavity;a thermal conditioning assembly comprising a thermal conditioning module and a fluid transfer device configured to produce a fluid flow;a ducting member fluidly connected to the thermal conditioning assembly and the dock and configured to transfer air between the thermal conditioning assembly and a second end of a first side of the dock opposite the first end; andan inductive charging module configured to provide selective inductive charging to the portable electronic device received in the dock, the inductive charging module connected to a second side of the dock opposite the first side; andwherein the thermal conditioning assembly is configured to selectively cool the portion of the dock. 2. The thermally conditioned inductive charging system of claim 1, wherein the thermal conditioning module is configured to conductively cool the portion of the dock. 3. The thermally conditioned inductive charging system of claim 1, wherein the thermal conditioning module is configured to cool the fluid flow, and wherein the cooled fluid flow convectively cools the portion of the dock. 4. The thermally conditioned inductive charging system of claim 1, wherein the thermal conditioning module is a thermoelectric device. 5. A cooling system for an inductive charger, the cooling system comprising: a thermal conditioning assembly in fluid communication with an inductive charging assembly, the thermal conditioning assembly comprising a thermal conditioning module and a fluid transfer device configured to produce a fluid flow;wherein the inductive charging assembly comprises a dock and an inductive charging module, the dock having an aperture at a first end of the dock defining an interior cavity configured to receive a portable electronic device, the inductive charging module configured to provide inductive charging to the portable electronic device, the inductive charging module connected to a first side of the dock;a ducting member fluidly connected to the thermal conditioning assembly and the dock and configured to transfer air between the thermal conditioning assembly and a second end of the dock opposite the first end; andwherein the fluid flow is delivered to the interior of the dock, thereby cooling the portable electronic device. 6. The cooling system of claim 5, wherein the thermal conditioning module has a waste side and a main side. 7. The cooling system of claim 6, wherein the thermal conditioning module is configured to cool the fluid flow. 8. The cooling system of claim 6, wherein the thermal conditioning module is configured to cool a conduction member in conductive thermal communication with the dock. 9. The cooling system of claim 6, wherein the thermal conditioning module comprises a thermoelectric device. 10. The cooling system of claim 6, wherein heat from the waste side of the thermal conditioning module is convectively transferred away from the thermal conditioning module. 11. The cooling system of claim 5, wherein the cooling system is at least partly integrated into an automobile. 12. The cooling system of claim 5, wherein the portable electronic device comprises a cell phone. 13. A cooled inductive charging system comprising: a thermal conditioning assembly comprising a thermal conditioning module and a fluid transfer device configured to produce a fluid flow; anda charging assembly comprising a dock having a partially-enclosed portion and an aperture at a first end of the dock defining a cavity, the dock of the charging assembly operatively integrated with the thermal conditioning assembly via a ducting member fluidly connected to the thermal conditioning assembly and a second end of a first side of the dock opposite the first end;wherein the thermal conditioning assembly is configured to provide a flow of air to selectively cool the charging assembly and the charging assembly is configured to selectively charge a portable electronic device. 14. The cooled inductive charging system of claim 13, wherein the thermal conditioning assembly is further configured to selectively cool the portable electronic device. 15. The cooled inductive charging system of claim 14, wherein the thermal conditioning assembly comprises a thermoelectric device configured to cool the flow of air. 16. The cooled inductive charging system of claim 14, wherein the thermal conditioning module is configured to conductively cool the portable electronic device.

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이 특허를 인용한 특허 피인용횟수: 20

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System and method for thermoelectrically cooling inductive charging assemblies

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이 특허에 인용된 특허 (183)

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System and method for thermoelectrically cooling inductive charging assemblies

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이 특허에 인용된 특허 (183)

이 특허를 인용한 특허 피인용횟수: 20

IPC 상위 출원인

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IPC 상세정보(version : 201201)

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