Micromechanical measuring element and method for producing a micromechanical measuring element
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01D-011/24
G01L-019/14
B81B-007/00
B23K-001/00
G01P-001/02
출원번호
US-0383857
(2013-03-08)
등록번호
US-9506831
(2016-11-29)
우선권정보
DE-10 2012 102 021 (2012-03-09)
국제출원번호
PCT/EP2013/054725
(2013-03-08)
국제공개번호
WO2013/132065
(2013-09-12)
발명자
/ 주소
Schiffer, Michael
Peschka, Andreas
Zapf, Jörg
Weidner, Karl
Hedler, Harry
출원인 / 주소
EPCOS AG
대리인 / 주소
Slater Matsil, LLP
인용정보
피인용 횟수 :
0인용 특허 :
16
초록▼
A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solde
A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.
대표청구항▼
1. A micromechanical measuring element, comprising: a carrier;a sensitive element connected to the carrier by a first solder connection and a second solder connection, wherein the sensitive element is electrically contacted by the first solder connection;elastomer bodies arranged between the sensiti
1. A micromechanical measuring element, comprising: a carrier;a sensitive element connected to the carrier by a first solder connection and a second solder connection, wherein the sensitive element is electrically contacted by the first solder connection;elastomer bodies arranged between the sensitive element and the first and second solder connections; anda metallization arranged between the elastomer body and the first solder connection, wherein the metallization has a meandering or helical shape, andwherein the sensitive element, the carrier and the second solder connection form a first chamber, the first chamber having a first opening. 2. The micromechanical measuring element according to claim 1, wherein the sensitive element comprises a membrane with a bottom side and a top side, andwherein the top side of the membrane is accessible to a first medium by the first opening. 3. The micromechanical measuring element according to claim 1, wherein the first opening is realized in the carrier. 4. The micromechanical measuring element according to claim 1, wherein the second solder connection is ring-shaped. 5. The micromechanical measuring element according to claim 1, wherein the first chamber is provided at least in part with a protective layer. 6. The micromechanical measuring element according to claim 5, wherein the protective layer comprises parylene. 7. The micromechanical measuring element according to claim 1, wherein the sensitive element is connected directly to a substrate on a side that is remote from the carrier,wherein a second chamber is formed at least in part by the sensitive element and the substrate, andwherein the second chamber has a second opening that runs through the carrier and the sensitive element. 8. The micromechanical measuring element according to claim 7, wherein the sensitive element comprises a membrane with a bottom side and a top side, andwherein the top side of the membrane is accessible to a first medium by the first opening. 9. The micromechanical measuring element according to claim 8, wherein the bottom side of the membrane is accessible to a second medium by way of the second opening. 10. The micromechanical measuring element according to claim 1, wherein the measuring element comprises a pressure sensor. 11. The micromechanical measuring element according to claim 1, wherein the measuring element comprises a gas sensor. 12. The micromechanical measuring element according to claim 1, wherein the measuring element comprises an acceleration sensor. 13. A method for producing a micromechanical measuring element, the method comprising: providing a sensitive element;providing a carrier that has a first opening for supplying a medium and a feed through for electrically contacting the sensitive element;providing elastomer bodies and arranging the elastomer bodies between the sensitive element and first and second solder connections; andproviding a metallization and arranging the metallization between the elastomer body and the first solder connection, wherein the metallization has a meandering or helical shape, andconnecting the sensitive element to the carrier, wherein the sensitive element is contacted electrically and media is supplied to the sensitive element in one process step by connecting the sensitive element to the carrier. 14. The method according to claim 13, wherein connecting the sensitive element to the carrier comprises connecting the sensitive element to the carrier by flip-chip soldering. 15. A micromechanical measuring element comprising: a carrier;a sensitive element connected to the carrier by a first solder connection and a second solder connection, wherein the sensitive element is electrically contacted by the first solder connection;elastomer bodies arranged between the sensitive element and the first and second solder connections; anda metallization arranged between an elastomer body and the first solder connection, wherein the metallization comprises a meandering or helical shape, wherein the metallization is configured to decouple the carrier and the sensitive element to ensure that mechanical or thermal stress is minimized, and wherein the sensitive element, the carrier and the second solder connection form a first chamber, the first chamber having a first opening.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (16)
Bryzek Janusz ; Burns David W. ; Nasiri Steven S. ; Cahill Sean S., Compensated semiconductor pressure sensor.
Bearinger Clayton R. (Midland MI) Camilletti Robert C. (Midland MI) Kilby Jack S. (Dallas TX) Haluska Loren A. (Midland MI) Michael Keith W. (Midland MI), Flip chip silicone pressure sensitive conductive adhesive.
Lee, Jin Yuan; Lei, Ming Ta; Huang, Ching-Cheng; Lin, Chuen-Jye, Method of making a low fabrication cost, high performance, high reliability chip scale package.
Caletka, David Vincent; Darbha, Krishna; Henderson, Donald W.; Lehman, Lawrence P.; Thiel, George Henry, Structure to accommodate increase in volume expansion during solder reflow.
Sooriakumar K. (Scottsdale AZ) Monk David J. (Mesa AZ) Chan Wendy K. (Scottsdale AZ) Goldman Kenneth G. (Chandler AZ), Vertically integrated sensor structure and method.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.