Vertical pillar structured photovoltaic devices with mirrors and optical claddings
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-031/0352
H01L-031/068
H01L-031/075
H01L-031/103
H01L-031/105
H01L-031/056
H01L-031/18
출원번호
US-0945492
(2010-11-12)
등록번호
US-9515218
(2016-12-06)
발명자
/ 주소
Yu, Young-June
Wober, Munib
출원인 / 주소
ZENA TECHNOLOGIES, INC.
대리인 / 주소
Pillsbury Winthrop Shaw Pittman LLP
인용정보
피인용 횟수 :
3인용 특허 :
178
초록▼
A photovoltaic device operable to convert light to electricity, comprising a substrate, a plurality of structures essentially perpendicular to the substrate, one or more recesses between the structures, each recess having a planar mirror on a bottom wall thereof. The structures have p-n or p-i-n jun
A photovoltaic device operable to convert light to electricity, comprising a substrate, a plurality of structures essentially perpendicular to the substrate, one or more recesses between the structures, each recess having a planar mirror on a bottom wall thereof. The structures have p-n or p-i-n junctions for converting light into electricity. The planar mirrors function as an electrode and can reflect light incident thereon back to the structures to be converted into electricity.
대표청구항▼
1. A photovoltaic device operable to convert light to electricity, comprising a substrate, a plurality of structures essentially perpendicular to the substrate, one or more recesses between the structures, each recess having a sidewall and a bottom wall, a planar reflective layer disposed on the bot
1. A photovoltaic device operable to convert light to electricity, comprising a substrate, a plurality of structures essentially perpendicular to the substrate, one or more recesses between the structures, each recess having a sidewall and a bottom wall, a planar reflective layer disposed on the bottom wall of each recess, a coupling layer and a cladding layer, wherein the structures comprise a single crystalline semiconductor material and wherein the sidewall of each recess is free of the planar reflective layer; wherein the structures have an overhanging portion along an entire contour of a top surface of the structures; wherein the coupling layer is disposed only directly above the cladding layer above the top surface in the direction of layer stacking; wherein the coupling layer is a different material distinct from the cladding layer. 2. The photovoltaic device of claim 1, wherein the single crystalline semiconductor material is selected from a group consisting of silicon, germanium, group III-V compound materials, group II-VI compound materials, and quaternary materials. 3. The photovoltaic device of claim 1, wherein the structures are cylinders or prisms with a cross-section selected from a group consisting of elliptical, circular, rectangular, and polygonal cross-sections, strips, or a mesh. 4. The photovoltaic device of claim 1, wherein the structures are pillars with diameters from 50 nm to 5000 nm, heights from 1000 nm to 20000 nm, a center-to-center distance between two closest pillars of 300 nm to 15000 nm. 5. The photovoltaic device of claim 1, wherein each recess has a rounded or beveled inner edge between the sidewall and the bottom wall thereof. 6. The photovoltaic device of claim 1, wherein the planar reflective layer is a material selected from a group consisting of ZnO, Al, Au, Ag, Pd, Cr, Cu, Ti, and a combination thereof. 7. The photovoltaic device of claim 1, wherein the planar reflective layer is an electrically conductive material. 8. The photovoltaic device of claim 1, wherein the planar reflective layer is a metal. 9. The photovoltaic device of claim 1, wherein the planar reflective layer has a reflectance of at least 50% for visible light of any wavelength. 10. The photovoltaic device of claim 1, wherein the planar reflective layer has a thickness of at least 5 nm. 11. The photovoltaic device of claim 1, wherein the planar reflective layer is functional to reflect light incident thereon to the structures so that the light is absorbed by the structures. 12. The photovoltaic device of claim 1, wherein the planar reflective layers in all the recesses are connected. 13. The photovoltaic device of claim 1, wherein the planar reflective layer is functional as an electrode of the photovoltaic device. 14. The photovoltaic device of claim 1, wherein the substrate has a flat surface opposite the structures. 15. The photovoltaic device of claim 14, wherein the flat surface has a doped layer and optionally a metal layer disposed on and forming an Ohmic contact with the doped layer. 16. The photovoltaic device of claim 14, wherein total area of the planar reflective layer is at least 40% of a surface area of the flat surface. 17. The photovoltaic device of claim 1, wherein the substrate has a thickness of at least 50 microns. 18. The photovoltaic device of claim 1, wherein the structures are pillars arranged in an array; each structure is about 5 microns in height; a pitch of the structures is from 300 nm to 15 microns. 19. The photovoltaic device of claim 1, further comprising a junction layer, wherein: the cladding layer is continuous;the junction layer is a doped semiconductor;the junction layer is disposed on the sidewall, on the bottom wall under the planar reflective layer, and on a top surface of the structures; and the junction layer is effective to passivate the sidewall and the bottom wall;the cladding layer is disposed over an entire exposed portion of the junction layer, the planar reflective layer and the top surface; and/or the coupling layer is disposed on the cladding layer. 20. The photovoltaic device of claim 19, wherein the structures are a doped semiconductor and the structures and the junction layer have opposite conduction types; orthe structures are an intrinsic semiconductor. 21. The photovoltaic device of claim 19, wherein: the junction layer has a thickness from 5 nm to 100 nm;the cladding layer is substantially transparent to visible light with a transmittance of at least 50%;the cladding layer is made of an electrically conductive material;the cladding layer is a transparent conductive oxide;the cladding layer is a material selected from a group consisting of indium tin oxide,aluminum doped zinc oxide, zinc indium oxide; and zinc tin oxide;the cladding layer has a thickness from 50 nm to 5000 nm;the cladding layer forms an Ohmic contact with the top portion;the cladding layer forms an Ohmic contact with the planar reflective layer;the cladding layer is functional as an electrode of the photovoltaic device;the doped layer has an opposite conduction type from the junction layer;the doped layer is electrically connected to each of the structures;the doped layer, the structures and the junction layer form a p-n or p-i-n junction;the cladding layer has a thickness of about 175 nm;the coupling layer is the same material as the cladding layer or different material from the cladding layer; and/ora refractive index of the structures n1, a refractive index of the cladding layer n2, a refractive index of the coupling layer n3, a refractive index of a space between the structures n4 satisfy relations of n1>n2>n4 and n1>n3>n4. 22. The photovoltaic device of claim 1, further comprising a junction layer, wherein: the cladding layer in continuous;the junction layer is a doped semiconductor;the junction layer is disposed on the sidewall, on the bottom wall under the planar reflective layer, and on a top surface of the structures; and the junction layer is effective to passivate the sidewall and the bottom wall;the cladding layer is disposed over an entire exposed portion of the junction layer, the planar reflective layer and the top surface;the coupling layer is disposed on the cladding layer; and/or;each of the structures has a top portion and a bottom portion having dissimilar conduction types. 23. The photovoltaic device of claim 22, wherein the top portion and the junction layer have the same conduction type; andthe structures have one of the following doping profiles:(i) the bottom portion is intrinsic and the top portion is p type;(ii) the bottom portion is n type and the top portion is p type;(iii) the bottom portion is intrinsic and the top portion is n type;(iv) the bottom portion is p type and the top portion is n type. 24. The photovoltaic device of claim 22, wherein: the junction layer has a thickness from 5 nm to 100 nm;the cladding layer is substantially transparent to visible light with a transmittance of at least 50%;the cladding layer is made of an electrically conductive material; the cladding layer is a transparent conductive oxide;the cladding layer is a material selected from a group consisting of indium tin oxide, aluminum doped zinc oxide, zinc indium oxide, and zinc tin oxide;the cladding layer has a thickness from 50 nm to 5000 nm;the cladding layer forms an Ohmic contact with the top portion;the cladding layer forms an Ohmic contact with the planar reflective layer;the cladding layer is functional as an electrode of the photovoltaic device;the doped layer has an opposite conduction type from the junction layer;the doped layer is electrically connected to the bottom portion of each of the structures;the doped layer, the bottom portion, the top portion and the junction layer form a p-n or p-i-n junction;the cladding layer has a thickness of about 175 nm;and/ora refractive index of the structures n1, a refractive index of the cladding layer n2, a refractive index of the coupling layer n3, a refractive index of a space between the structures n4, satisfy relations of n1>n2>n4 and n1>n3>n4. 25. A photo detector comprising the photovoltaic device of claim 1, wherein the photo detector is functional to output an electrical signal when exposed to light. 26. The photovoltaic device of claim 1, wherein lattice of the substrate extends undisrupted to the structures. 27. A photovoltaic device operable to convert light to electricity, comprising a substrate, a plurality of structures essentially perpendicular to the substrate, one or more recesses between the structures, each recess having a sidewall and a bottom wall, a planar reflective layer disposed on the bottom wall of each recess, a continuous cladding layer, and a coupling layer, wherein the structures are a single crystalline semiconductor material and wherein the sidewall of each recess is free of the planar reflective layer, wherein the coupling layer is a different material distinct from the continuous cladding layer, wherein the continuous cladding layer is made of an electrically conductive material and completely covers a top surface of the structures, and wherein the coupling layer is disposed on the continuous cladding layer and only directly above the cladding layer above the top surface in the direction of layer stacking of the structures.
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