[특허]Printed circuit board including linking extended contact pad

[미국특허] Printed circuit board including linking extended contact pad 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-001/02 H05K-001/03
출원번호	US-0172187 (2014-02-04)
등록번호	US-9532446 (2016-12-27)
우선권정보	KR-10-2013-0107548 (2013-09-06); KR-10-2013-0160622 (2013-12-20)
발명자 / 주소	Jung, Kyung Hun Kim, Ik Soo Jeon, Yuck Hwan Jung, Hee Seok Koo, Hwang Sub Kim, Hyun Je
출원인 / 주소	GIGALANE CO., LTD.
대리인 / 주소	Harness, Dickey & Pierce, P.L.C.
인용정보	피인용 횟수 : 0 인용 특허 : 41

초록 ▼

A printed circuit board (PCB) used as a signal transmission line of a terminal, comprising a first ground layer elongating in one direction, a first dielectric layer deposited on a top of the first ground layer and elongating in the same direction as the first ground layer, a signal transmission line deposited on a top of the first dielectric layer and elongating in the same direction as the first dielectric layer, a ground pad elongating from one end of the first ground layer and in contact with an external ground, and a signal line pad extended from one end of the signal transmission line and in contact with an external signal line.

대표청구항 ▼

1. A printed circuit board (PCB) comprising: a first ground layer elongating in one direction;a first dielectric layer deposited on a top of the first ground layer and elongating in the same direction as the first ground layer;a signal transmission line deposited on a top of the first dielectric layer and elongating in the same direction as the first dielectric layer;a ground pad elongating from one end of the first ground layer and in contact with an external ground;a signal line pad extended from one end of the signal transmission line and in contact with an external signal line; anda ground pad area formed on a bottom of the one end of the first dielectric layer while the signal line pad is formed on a bottom of the ground pad area,wherein the ground pad is formed on a bottom of one end of the first ground layer, andwherein the ground pad area is electrically segregated from the first ground layer by etching a peripheral portion of the first ground layer, on which the signal line pad is deposited. 2. The PCB of claim 1, wherein the ground pad area is connected to the signal transmission line through a via hole formed in the first dielectric layer. 3. The PCB of claim 1, wherein the ground pad and the signal line pad have one of a hexagonal shape and a circular shape. 4. The PCB of claim 1, wherein a portion extended from the one end of the first ground layer and connected to the ground pad has a width identical to a width of the ground pad. 5. The PCB of claim 1, wherein the ground pad and the signal line pad are flush with each other. 6. The PCB of claim 1, wherein the ground pad and the signal line pad are disposed on the one end of the first dielectric layer in a direction vertical to the direction, in which the signal transmission line elongates. 7. The PCB of claim 1, wherein the ground pad and the signal line pad are disposed on the one end of the first dielectric layer in the direction, in which the signal transmission line elongates. 8. The PCB of claim 1, wherein the ground pad has a hollow formed therein and is disposed to surround an edge of the signal line pad. 9. The PCB of claim 8, wherein the signal line pad is formed as a circular shape. 10. A printed circuit board (PCB) comprising: a first ground layer elongating in one direction;a first dielectric layer deposited on a top of the first ground layer and elongating in the same direction as the first ground layer;a signal transmission line deposited on a top of the first dielectric layer and elongating in the same direction as the first dielectric layer;a ground pad elongating from one end of the first ground layer and in contact with an external ground;a signal line pad extended from one end of the signal transmission line and in contact with an external signal line;a second dielectric layer deposited on a top of the signal transmission line; anda second ground layer deposited on a top of the second dielectric layer,wherein the ground pad and the signal line pad are formed on different dielectric layer surfaces. 11. The PCB of claim 10, further comprising a ground pad area formed on a top of one end of the second dielectric layer while the signal line pad is formed on a top of the ground pad area, wherein the ground pad is formed on a bottom of one end of the second ground layer, andwherein the ground pad area is electrically segregated from the second ground layer by etching a peripheral portion of the first ground layer, on which the signal line pad is deposited. 12. The PCB of claim 11, wherein the ground pad area is connected to the signal transmission line through a via hole formed in the second dielectric layer. 13. The PCB of claim 11, wherein the ground pad and the signal line pad are formed in locations that correspond vertically to each other. 14. The PCB of claim 1, comprising a plurality of first ground patterns formed in a row with certain intervals along a center of a bottom surface of the first ground layer in a longitudinal direction of the first ground layer by etching the bottom surface of the first ground layer, wherein the plurality of first ground patterns expose the first dielectric layer. 15. The PCB of claim 1, comprising a slot pattern area formed by etching a part of the signal transmission line except an edge thereof to a thickness of the signal transmission line in a longitudinal direction of the signal transmission line, wherein currents flow while being dispersed into both edges of the signal transmission line divided by the slot pattern area. 16. The PCB of claim 1, further comprising a second dielectric layer deposited on a top of the signal transmission line; and a second ground layer deposited on a top of the second dielectric layer.

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A	생활필수품
A62	인명구조; 소방(사다리 E06C)
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A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Printed circuit board including linking extended contact pad 원문보기