최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
DataON 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Edison 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0081964 (2013-11-15) |
등록번호 | US-9532453 (2016-12-27) |
발명자 / 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 | 피인용 횟수 : 0 인용 특허 : 600 |
The present invention relates to, for example, printed circuit boards having a thin film battery or other electrochemical cell between or within its layer or layers. The present invention also relates to, for example, electrochemical cells within a layer stack of a printed circuit board.
1. A printed circuit board comprising: a printed circuit board (PCB) layer stack having a plurality of layers which include two outer electrically insulating layers, with conductor traces being formed on one or both of the outer electrically insulating layers;wherein each of the two outer electrical
1. A printed circuit board comprising: a printed circuit board (PCB) layer stack having a plurality of layers which include two outer electrically insulating layers, with conductor traces being formed on one or both of the outer electrically insulating layers;wherein each of the two outer electrically insulating layers of the PCB layer stack comprises an insulator material disposed in a layer of epoxy material;wherein each of said two outer electrically insulating layers of the PCB layer stack has edges that comprise a respective perimeter of each of said two outer electrically insulating layers of the PCB layer stack; andan electrochemical cell structure inserted in said PCB layer stack between said two outer electrically insulating layers of the PCB layer stack, wherein said electrochemical cell structure is embedded between said two outer electrically insulating layers of said PCB layer stack, and wherein said electrochemical cell structure extends laterally beyond the respective perimeter of at least one of said two outer electrically insulating layers of the PCB layer stack. 2. The printed circuit board of claim 1, the electrochemical cell structure having a top layer and a bottom layer, wherein the top layer and the bottom layer are two terminals and said electrochemical cell structure extends laterally beyond the respective perimeter of at least one of said two outer electrically insulating layers to provide direct and external electrical access to at least one of said terminals. 3. The printed circuit board of claim 1, the electrochemical cell structure having a top layer and a bottom layer; and wherein said PCB layer stack encapsulates an entirety of a top surface of the top layer of the electrochemical cell structure, and an entirety of a bottom surface of the bottom layer of the electrochemical cell structure, except where said electrochemical cell structure extends laterally beyond the respective perimeter of at least one of said two outer electrically insulating layers of the PCB layer stack. 4. The printed circuit board of claim 1, further comprising an electrical contact in electrical connection with said electrochemical cell structure, said electrical contact being externally accessible through an access port. 5. The printed circuit board of claim 4 wherein said electrical contact comprises the conductor traces. 6. The printed circuit board of claim 4 wherein said electrochemical cell structure comprises a terminal and wherein said electrical contact electrically connects with said terminal and said terminal is not externally accessible through said access port. 7. The printed circuit board of claim 6 wherein said terminal comprises a top layer or a bottom layer of the electrochemical cell structure. 8. The printed circuit board of claim 6 further comprising conductor material within said access port and further comprising a cap of insulating material over said access port. 9. A printed circuit board comprising: a printed circuit board (PCB) layer stack having a plurality of layers which include two outer electrically insulating layers, with conductor traces being formed on one or both of the outer electrically insulating layers;wherein each of the two outer electrically insulating layers of the PCB layer stack comprises an insulator material disposed in a layer of epoxy material;wherein each of said two outer electrically insulating layers of the PCB layer stack has edges that comprise a respective perimeter of each of said two outer electrically insulating layers of the PCB layer stack;two electrically conducting layers inserted in said layer stack between said two outer electrically insulating layers; andan electrochemical cell inserted in said layer stack wherein said electrochemical cell is embedded between said two electrically conducting layers, and wherein said electrochemical cell extends laterally beyond the respective perimeter of at least one of said two outer electrically insulating layers of the PCB layer stack. 10. The printed circuit board of claim 9, further comprising an electrical contact in electrical connection with said electrochemical cell, said electrical contact being externally accessible through an access port. 11. The printed circuit board of claim 10 wherein said electrical contact comprises one of the conducting layers or the conductor traces. 12. The printed circuit board of claim 10 wherein said electrochemical cell comprises a terminal and wherein said electrical contact electrically connects with said terminal and said terminal is not externally accessible through said access port. 13. The printed circuit board of claim 12 wherein said terminal comprises a top layer or a bottom layer of the electrochemical cell. 14. The printed circuit board of claim 10 further comprising conductor material within said access port and further comprising a cap of insulating material over said access port. 15. A printed circuit board comprising: a printed circuit board (PCB) layer stack having a plurality of layers which include two outer electrically insulating layers, with conductor traces being formed on one or both of the two outer electrically insulating layers;wherein each of the two outer electrically insulating layers of the PCB layer stack comprises an insulator material disposed in a layer of epoxy material;wherein each of said two outer electrically insulating layers of the PCB layer stack has edges that comprise a respective perimeter of each of said two outer electrically insulating layers of the PCB layer stack; andan electrochemical cell structure inserted in said PCB layer stack between said two outer electrically insulating layers of the PCB layer stack, wherein said electrochemical cell structure has a top layer and a bottom layer,wherein each of the top layer and the bottom layer of said electrochemical cell structure extends laterally beyond the respective perimeter of one of said two outer electrically insulating layers of said PCB layer stack, and wherein said PCB layer stack encapsulates an entirety of a top surface of the top layer of the electrochemical cell structure, and an entirety of a bottom surface of the bottom layer of the electrochemical cell structure, except where said electrochemical cell structure extends laterally beyond the respective perimeter of the one of said two outer electrically insulating layers of the PCB layer stack. 16. The printed circuit board of claim 15, wherein said PCB layer stack encapsulates an entirety of the top surface of the top layer of the electrochemical cell structure, and an entirety of the bottom surface of the bottom layer of the electrochemical cell structure to protect the electrochemical cell structure against moisture and oxygen.
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