Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and
Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and is present between the metal and the base members. Disclosed is also a joint material in the form of a paste containing an oxide glass containing V and Te, metal particles, and a solvent; in the form of a foil piece or plate in which particles of an oxide glass containing V and Te are embedded; or in the form of a foil piece or plate containing a layer of an oxide glass containing V and Te, and a layer of a metal.
대표청구항▼
1. A jointed body, comprising: a first base member;a second base member; anda joint material layer for jointing the first base member and the second base member to each other,wherein the first base member is any one selected from the group consisting of a ceramic base member, a semiconductor base me
1. A jointed body, comprising: a first base member;a second base member; anda joint material layer for jointing the first base member and the second base member to each other,wherein the first base member is any one selected from the group consisting of a ceramic base member, a semiconductor base member and a glass base member,the joint material layer comprises a metal and an oxide having a thickness of no more than 100 nm present between the first base member and the metal,the oxide is a lead-free glass composition including V, Te, and Ag, in terms of respective oxides thereof, so as to satisfy 100%>V2O5+TeO2+Ag2O≧85% by mass,the oxide is present in at least one part of a space between the first base member and the metal,voids are dispersed in the metal,the lead-free glass composition includes TeO2 of 25% to 40% by mass, as well as V2O5 and Ag2O, andthe oxide is dispersed in the metal. 2. The jointed body according to claim 1, wherein the oxide comprises at least one element selected from the group consisting of Sb, Ba, W, Fe and alkali metals. 3. The jointed body according to claim 1, wherein the first base member is a base member of any one selected from the group consisting of aluminum oxide, aluminum nitride, silicon nitride, silicon and silicon carbide, and the second base member is a metal base member, or a composite material base member of a metal and a ceramic material. 4. The jointed body according to claim 3, wherein the second base member is any one selected from the group consisting of a Cu base member, an aluminum base member and an Al—SiC base member. 5. The jointed body according to claim 1, wherein the first base member is at least one selected from the group consisting of an Al nitride base member, and a silicon nitride base member, and a layer made mainly of an oxide is formed on a surface of the first base member to have a thickness of 0.1 to 5 μm. 6. The jointed body according to claim 1, wherein the metal comprises at least one selected from the group consisting of Ag, Cu, Al, Sn, Zn, Au, In, Bi, and Pt. 7. The jointed body according to claim 1, wherein the glass composition comprises P in addition to V, Te, and Ag.
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이 특허에 인용된 특허 (7)
Iyori Yusuke (Fukaya JPX) Fukushima Hideko (Kumagaya JPX), Aluminum nitride sintered body and semiconductor substrate thereof.
Friesen G. Delbert (Hunt. Beach CA) Shin Yun K. (Glendale CA) Hoffman ; deceased Lewis (late of Riviera Beach FL by Norma Hoffman ; Executrix), Low softening point metallic oxide glasses suitable for use in electronic applications.
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