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An electrical connector footprint on a printed circuit board (PCB) can include vias and antipads surrounding those vias. While conventional antipads surrounding vias are large in order to improve impedance of the PCB, the presence of the antipads can compromise the integrity of the ground plane and

An electrical connector footprint on a printed circuit board (PCB) can include vias and antipads surrounding those vias. While conventional antipads surrounding vias are large in order to improve impedance of the PCB, the presence of the antipads can compromise the integrity of the ground plane and can permit cross talk to arise between differential pairs on different layers in the PCB. Antipads can be constructed and arranged so as to limit cross talk between layers in a PCB, while also maximizing impedance.

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1. A printed circuit board comprising: a first electrically conductive layer that includes a first electrically conductive region and a first antipad defined by the first electrically conductive region, the first antipad including a first dielectric region and a portion of a first electrically plate

1. A printed circuit board comprising: a first electrically conductive layer that includes a first electrically conductive region and a first antipad defined by the first electrically conductive region, the first antipad including a first dielectric region and a portion of a first electrically plated via that extends through the first dielectric region along a first direction, the first antipad having a first maximum area along a first plane that is normal to the first direction, wherein the first dielectric region is aligned with the first electrically conductive region along the first plane;a first dielectric layer disposed below the first electrically conductive layer along the first direction;a second electrically conductive layer disposed below the first dielectric layer along the first direction, the second electrically conductive layer including a second electrically conductive region and a second antipad defined by the second electrically conductive region, the second antipad having a second maximum area along a second plane that is normal to the first direction, the second maximum area less than the first maximum area;a third electrically conductive layer disposed below the second electrically conductive layer along the first direction such that no additional electrically conductive layer is disposed between the second electrically conductive layer and the third electrically conductive layer along the first direction, the third electrically conductive layer defining a third electrically conductive region and a third antipad, the third antipad having a third maximum area along a third plane that is normal to the first direction, the third maximum area substantially equal to the second maximum area; andan electrically conductive signal layer that includes one or more electrically conductive traces electrically coupled to the first electrically plated via, the electrically conductive signal layer being the only signal layer disposed between the first electrically conductive layer and the second electrically conductive layer along the first direction,wherein at least a portion of each of the second antipad and the third antipad is aligned with the portion of the first electrically plated via along the first direction. 2. The printed circuit board of claim 1, wherein the first antipad further includes a portion of a second electrically plated via that extends through the first dielectric region along the first direction, wherein the second electrically conductive layer further includes a fourth antipad defined by the second electrically conductive region, the fourth antipad having a fourth maximum area along the second plane, the fourth maximum area substantially equal to the second maximum area,wherein the third electrically conductive layer further includes a fifth antipad defined by the third electrically conductive region, the fifth antipad having a fifth maximum area along the third plane, the fifth maximum area substantially equal to the third maximum area. 3. The printed circuit board of claim 1, wherein each of the second antipad and the third antipad are at least partially defined by a single back drilled cavity that extends at least from the second antipad to the third antipad along the first direction. 4. The printed circuit board of claim 3, wherein each of the second electrically conductive region and the third electrically conductive region do not come into contact with the single back drilled cavity. 5. The printed circuit board of claim 3, wherein at least one of the second electrically conductive region and the third electrically conductive region comes into contact with the single back drilled cavity. 6. The printed circuit board of claim 3, wherein the single back drilled cavity is at least partially filled with a dielectric medium. 7. A printed circuit board comprising: a first signal layer comprising a first differential pair of electrical signal traces that defines a first centerline oriented along a transverse direction, wherein the first centerline is centrally disposed between the electrical signal traces of the first differential signal pair with respect to a lateral direction;a second signal layer comprising a second differential pair of electrical signal traces spaced from the first differential pair along the transverse direction, the second differential pair defining a second centerline centrally oriented along the transverse direction, wherein the second centerline is disposed between the electrical signal traces of the second differential signal pair with respect to the lateral direction; andan electrically conductive layer disposed between the first differential signal pair and the second differential signal pair with respect to the transverse direction, wherein the first centerline and the second centerline are offset with respect to each other along the lateral direction to reduce electromagnetic interference between the first differential signal pair and the second differential signal pair,wherein the first differential pair of electrical signal traces defines the first centerline such that the first centerline is centrally disposed between no differential pairs of electrical signal traces of the second signal layer. 8. The printed circuit board of claim 1, further comprising: a second dielectric layer disposed between the second electrically conductive layer and the third electrically conductive layer such that the second dielectric layer separates the second and third electrically conductive layers from each other and the second dielectric layer abuts each of the second and third electrically conductive layers. 9. The printed circuit board of claim 1, wherein the second and third maximum areas are circular. 10. The printed circuit board of claim 9, wherein the first maximum area is rectangular. 11. The printed circuit board of claim 1, wherein the first, second, and third electrically conductive layers are ground layers. 12. The printed circuit board of claim 1, wherein the first electrically plated via defines a cylinder defining a centerline that extends through respective centers of the second antipad and the third antipad along the first direction. 13. The printed circuit board of claim 2, wherein the second electrically plated via defines a cylinder defining a centerline that extends though respective centers of the fourth antipad and the fifth antipad along the first direction. 14. The printed circuit board of claim 3, wherein the first electrically plated via defines a cylinder defining a centerline that passes through a respective center of the single back drilled cavity along the first direction. 15. A printed circuit board comprising: a first differential pair of electrical signal traces that defines a first centerline centrally disposed between the electrical signal traces of the first differential signal pair;a second differential pair of electrical signal traces spaced from the first differential pair along a first direction, the second differential pair defining a second centerline centrally disposed between the electrical signal traces of the second differential signal pair; andan electrically conductive layer disposed between the first differential signal pair and the second differential signal pair along the first direction, the electrically conductive layer including an electrically conductive region and first and second antipads that are defined by the electrically conductive region, the first and second antipads spaced from each other along a second direction that is perpendicular to the first direction, wherein each of the first and second differential pairs is disposed between the first and second antipads with respect to the second direction; andat least one ground via spaced from each of the first and second antipads along a third direction that is substantially perpendicular to both the first and second directions,wherein the first centerline is disposed closer to the first antipad than the second antipad along the second direction, and the second centerline is disposed closer to the second antipad than the first antipad along the second direction. 16. The printed circuit board claim 15, wherein a portion of the first differential pair of electrical signal traces is aligned with a portion of the second differential pair of electrical signal traces along the first direction. 17. The printed circuit board of claim 15, wherein the electrical signal traces of the first differential pair of signal traces are spaced apart from each other a first distance along the second direction, wherein the first distance is substantially equal to a distance that the electrical signal traces of the second differential pair of signal traces are spaced apart from each other along the second direction. 18. The printed circuit board of claim 15, wherein a first dielectric layer is disposed between the first differential pair of signal traces and the electrically conductive layer along the first direction, and a second dielectric layer is disposed between the second differential pair of signal traces and the electrically conductive layer along the first direction. 19. The printed circuit board of claim 15, wherein the first centerline is disposed a first distance from the first antipad along the second direction, first distance being substantially equal to a second distance that the second centerline is disposed from the second antipad along the second direction. 20. The printed circuit board as recited in claim 7, wherein the electrical signal traces of the first differential pair of electrical signal traces are spaced apart from each other a first distance with respect to the lateral direction, and the first distance is substantially equal to a distance that the electrical signal traces of the second differential pair of electrical signal traces are spaced apart from each other with respect to the lateral direction. 21. The printed circuit board as recited in claim 7, wherein: the printed circuit board further comprises: a first row of antipads, the first row extending perpendicular to the lateral direction and the transverse direction; anda second row of antipads parallel to the first row of antipads; andthe first differential pair of electrical signal traces and the second differential pair of electrical signal traces are disposed, in the lateral direction between the first row of antipads and the second row of antipads. 22. The printed circuit board as recited in claim 7, wherein the transverse direction is substantially perpendicular to the lateral direction. 23. The printed circuit board as recited in claim 7, wherein a first dielectric layer is disposed between the first differential pair of electrical signal traces and the electrically conductive layer with respect to the transverse direction, and a second dielectric layer is disposed between the second differential pair of electrical signal traces and the electrically conductive layer with respect to the transverse direction. 24. The printed circuit board as recited in claim 7, wherein the second differential pair of electrical signal traces defines the second centerline such that the second centerline is centrally disposed between no differential pairs of electrical signal traces of the first signal layer. 25. The printed circuit board as recited in claim 7, wherein a portion of the first differential pair of electrical signal traces is aligned with a portion of the second differential pair of electrical signal traces with respect to the transverse direction.