|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||H05K-007/20 G02B-027/01 F28F-003/02 F28F-021/00 F28D-015/00 H01L-023/40|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 6 인용 특허 : 31|
A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex ...
1. An electronic device comprising: a first housing portion containing an electronic component that generates heat during operation;a second housing portion, flexibly coupled via a hinge to the first housing portion, the second housing portion containing a heat dissipation structure; anda multi-layer flexible thermal conduit that passes from the first housing portion to the second housing portion, to convey heat generated by the electronic component to the heat dissipation structure,wherein the multi-layer flexible thermal conduit comprises a plurality o...