초록 ▼

A removable, permanent or reconfigurable debug probing device for use in debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising at least one leader thread configured to be threaded through the at least one throug

A removable, permanent or reconfigurable debug probing device for use in debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising at least one leader thread configured to be threaded through the at least one through via. Using the probing device comprises inserting a selected one of the at least one leader threads through a selected one of the at least one through via to thereby probe a surface of the printed circuit assembly; and responsive to detecting a defect in the selected through via, using a flexible circuit connected to the selected leader thread to repair the detected defect.

대표청구항 ▼

1. A removable, permanent or reconfigurable debug probing device for use in debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising: at least one leader thread configured to be threaded through the at least one th

1. A removable, permanent or reconfigurable debug probing device for use in debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising: at least one leader thread configured to be threaded through the at least one through via; andat least one design and rework device corresponding to the at least one leader threads, the design and rework device being in form of a planar flexible circuit configured to be threaded through the at least one through via, the planar flexible circuit comprising; at least one lead-in portion at one end of the planar flexible circuit, the at least one lead-in portion configured to receive at least one of the at least one leader thread of the debug probing device;at least one tail portion configured to align the planar flexible circuit on a surface of the printed circuit assembly;at least one first distended head portion proximal to the lead-in portion; andat least one second distended head portion proximal to the tail portion, the at least one second distended head portion being connected to the at least one first distended head portion by at least one flex portion, wherein a length of the at least one flex portion is substantially equal to a depth of the at least one through via. 2. The removable, permanent or reconfigurable debug probing device according to claim 1, wherein at least one of the at least one leader thread is of a zigzag type shape. 3. The removable, permanent or reconfigurable debug probing device according to claim 1, wherein at least one of the at least one leader thread is of a snake type shape. 4. The removable, permanent or reconfigurable debug probing device according to claim 1, wherein at least one of the at least one leader thread is of an s-type shape. 5. The removable, permanent or reconfigurable debug probing device according to claim 1, wherein the probing device is configured for probing the printed circuit assembly without damaging interconnection of electrical components present thereupon. 6. The removable, permanent or reconfigurable debug probing device according to claim 1, wherein the probing device is configured for probing the printed circuit assembly without need for additional wiring. 7. The removable, permanent or reconfigurable debug probing device according to claim 1, wherein the probing device comprises a bulk portion and a plurality of the leader threads. 8. The removable, permanent or reconfigurable debug probing device according to claim 7, wherein ones of the plurality of leader threads are of different shapes. 9. The removable, permanent or reconfigurable debug probing device according to claim 7, wherein ones of the plurality of leader threads are of different sizes. 10. The removable, permanent or reconfigurable debug probing device according to claim 1, wherein at least one of the at least one leader thread includes a plurality of openings. 11. The removable, permanent or reconfigurable debug probing device according to claim 1, wherein the plurality of openings are provided to allow clearance for through vias. 12. The removable, permanent or reconfigurable debug probing device according to claim 1, wherein the plurality of openings are provided to allow clearance for at least one of surface features and keep out zones. 13. A method of using a debug probing device for debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising: at least one leader thread configured to be threaded through the at least one through via; andat least one design and rework device corresponding to the at least one leader threads, the design and rework device being in form of a planar flexible circuit configured to be threaded through the at least one through via, the planar flexible circuit comprising; at least one lead-in portion at one end of the planar flexible circuit, the at least one lead-in portion configured to receive at least one of the at least one leader thread of the debug probing device;at least one tail portion configured to align the planar flexible circuit on a surface of the printed circuit assembly;at least one first distended head portion proximal to the lead-in portion; andat least one second distended head portion proximal to the tail portion, the at least one second distended head portion being connected to the at least one first distended head portion by at least one flex portion, wherein a length of the at least one flex portion is substantially equal to a depth of the at least one through via,wherein the method comprises: inserting a selected one of the at least one leader threads through a selected one of the at least one through via to thereby probe a surface of the printed circuit assembly; andresponsive to detecting a defect in the selected through via, using a flexible circuit connected to the selected leader thread to repair the detected defect.