Multi-stage thermal isolator for focal plane arrays and other devices
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F16M-001/00
F16M-003/00
F16M-005/00
F16M-007/00
F16M-009/00
F16M-011/00
G01J-005/02
G01J-005/06
G02B-007/00
출원번호
US-0732245
(2012-12-31)
등록번호
US-9599274
(2017-03-21)
발명자
/ 주소
Bullard, Andrew L.
출원인 / 주소
RAYTHEON COMPANY
인용정보
피인용 횟수 :
0인용 특허 :
16
초록▼
An apparatus includes a first interface platform and a second interface platform. One interface platform is configured to be coupled to a support structure, and the other interface platform is configured to be coupled to a device that operates at a temperature different than a temperature of the sup
An apparatus includes a first interface platform and a second interface platform. One interface platform is configured to be coupled to a support structure, and the other interface platform is configured to be coupled to a device that operates at a temperature different than a temperature of the support structure. The apparatus also includes at least one intermediate stage platform and struts connecting the first and second interface platforms to the at least one intermediate stage platform. Top surfaces of the interface platforms may be substantially coplanar. At least a portion of the second interface platform can reside within an opening of the first interface platform. The struts can be arranged in a nested configuration having first and second sets of struts, where the second set is located within the first set. Each strut in the first set could be substantially parallel to an adjacent strut in the second set.
대표청구항▼
1. An apparatus comprising: a first interface platform and a second interface platform, one interface platform configured to be coupled to a support structure and the other interface platform configured to be coupled to a device that operates at a temperature different than a temperature of the supp
1. An apparatus comprising: a first interface platform and a second interface platform, one interface platform configured to be coupled to a support structure and the other interface platform configured to be coupled to a device that operates at a temperature different than a temperature of the support structure;at least one intermediate stage platform configured to maintain a separation between the first interface platform and the second interface platform;struts affixing the first interface platform to the at least one intermediate stage platform; andstruts affixing the second interface platform to the at least one intermediate stage platform;wherein the apparatus is configured to reduce heat transfer between the support structure and the device; andwherein top surfaces of the first and second interface platforms are substantially coplanar. 2. The apparatus of claim 1, wherein the first and second interface platforms are concentric. 3. The apparatus of claim 1, wherein at least a portion of the second interface platform resides within an opening of the first interface platform. 4. The apparatus of claim 1, wherein the struts are arranged in a nested configuration having first and second sets of struts, the second set of struts located within the first set of struts. 5. The apparatus of claim 4, wherein each strut in the first set is substantially parallel to an adjacent strut in the second set. 6. The apparatus of claim 1, wherein: the first interface platform comprises a first square ring having a larger size;the second interface platform comprises a second square ring having a smaller size; andthe at least one intermediate stage platform comprises a third square ring with faceted corners and a circular opening. 7. The apparatus of claim 1, wherein the first interface platform, the second interface platform, the at least one intermediate stage platform, and the struts form an integral structure. 8. The apparatus of claim 1, wherein: at least three struts affix the first interface platform to the at least one intermediate stage platform; andat least three struts affix the second interface platform to the at least one intermediate stage platform. 9. The apparatus of claim 1, wherein: the apparatus comprises multiple intermediate stage platforms;a first set of struts connects the first interface platform to a first of the intermediate stage platforms;a second set of struts connects the second interface platform to a second of the intermediate stage platforms; andat least one third set of struts connects the intermediate stage platforms. 10. A system comprising: a support structure;a device configured to operate at a temperature different than a temperature of the support structure; anda thermal isolator configured to reduce heat transfer between the support structure and the device, the thermal isolator comprising: a first interface platform and a second interface platform, one interface platform configured to be coupled to the support structure and the other interface platform configured to be coupled to the device;at least one intermediate stage platform;struts affixing the first interface platform to the at least one intermediate stage platform; andstruts affixing the second interface platform to the at least one intermediate stage platform;wherein top surfaces of the first and second interface platforms are substantially coplanar. 11. The system of claim 10, wherein the first and second interface platforms are concentric. 12. The system of claim 10, wherein the struts are arranged in a nested configuration having first and second sets of struts, the second set of struts located within the first set of struts. 13. The system of claim 12, wherein each strut in the first set is substantially parallel to an adjacent strut in the second set. 14. The system of claim 10, wherein: the thermal isolator comprises multiple intermediate stage platforms;a first set of struts connects the first interface platform to a first of the intermediate stage platforms;a second set of struts connects the second interface platform to a second of the intermediate stage platforms; andat least one third set of struts connects the intermediate stage platforms. 15. A method comprising: forming first and second interface platforms, one interface platform configured to be coupled to a support structure and the other interface platform configured to be coupled to a device that operates at a temperature different than a temperature of the support structure;forming at least one intermediate stage platform;forming multiple struts for affixing the first interface platform to the at least one intermediate stage platform; andforming multiple struts for affixing the second interface platform to the at least one intermediate stage platform;wherein top surfaces of the first and second interface platforms are substantially coplanar. 16. The method of claim 15, wherein the first and second interface platforms are concentric. 17. The method of claim 15, wherein forming the first interface platform and forming the second interface platform comprise: forming a joined pair of interface platforms from a single piece of material; andforming a gap within the joined pair of interface platforms to separate the first and second interface platforms. 18. The method of claim 15, wherein the first interface platform, the second interface platform, the at least one intermediate stage platform, and the struts are formed using a single piece of material. 19. The method of claim 15, wherein the first interface platform, the second interface platform, the at least one intermediate stage platform, and the struts are formed as an integral structure using casting or injection molding. 20. The method of claim 15, wherein: the first interface platform, the second interface platform, the at least one intermediate stage platform, and the struts are formed as separate pieces; andthe method further comprises coupling the first and second interface platforms to the at least one intermediate stage platform using the struts. 21. The apparatus of claim 1, wherein: the top surface of the second interface platform is configured to be coupled to the device; andthe struts affix a bottom surface of the second interface platform. 22. The apparatus of claim 1, wherein: the first interface platform comprises a warm-stage platform; andthe second interface platform comprises a cold-stage platform.
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이 특허에 인용된 특허 (16)
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